专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070165417A1 Light-emitting diode backlight module 失效
标题翻译：发光二极管背光模组
公开(公告)号：US20070165417A1
公开(公告)日：2007-07-19
申请号：US11432379
申请日：2006-05-12
申请人： Yi-Tsuo Wu , Robert Yeh
发明人： Yi-Tsuo Wu , Robert Yeh
IPC分类号： H01L33/00 , G09G3/36 , F21V7/04
CPC分类号： G02F1/133606 , G02F1/133603 , G02F1/133609
摘要： An LED backlight module includes a substrate. An LED array, composed of a plurality of red, blue and green lamp LEDs, is mounted on the substrate. A light-mixing chamber is mounted on the substrate and is used to seal the LED array inside. A diffusion sheet is secured inside the light-mixing chamber and is disposed parallel to the substrate. A first prism sheet is secured inside the light-mixing chamber and is disposed parallel to the diffusion sheet. A second prism sheet is secured inside the light-mixing chamber and is disposed parallel to the first prism sheet.
摘要翻译： LED背光模块包括基板。由多个红色，蓝色和绿色LED LED组成的LED阵列安装在基板上。光混合室安装在基板上，用于将LED阵列密封在内部。漫射片被固定在光混合室内并且平行于衬底设置。第一棱镜片被固定在光混合室内并且平行于漫射片设置。第二棱镜片被固定在光混合室内并平行于第一棱镜片设置。

2. 发明授权

US07339491B2 Light-emitting diode backlight module 失效
标题翻译：发光二极管背光模组
公开(公告)号：US07339491B2
公开(公告)日：2008-03-04
申请号：US11432379
申请日：2006-05-12
申请人： Yi-Tsuo Wu , Robert Yeh
发明人： Yi-Tsuo Wu , Robert Yeh
IPC分类号： G08B5/00
CPC分类号： G02F1/133606 , G02F1/133603 , G02F1/133609
摘要： An LED backlight module includes a substrate. An LED array, composed of a plurality of red, blue and green lamp LEDs, is mounted on the substrate. A light-mixing chamber is mounted on the substrate and is used to seal the LED array inside. A diffusion sheet is secured inside the light-mixing chamber and is disposed parallel to the substrate. A first prism sheet is secured inside the light-mixing chamber and is disposed parallel to the diffusion sheet. A second prism sheet is secured inside the light-mixing chamber and is disposed parallel to the first prism sheet.
摘要翻译： LED背光模块包括基板。由多个红色，蓝色和绿色LED LED组成的LED阵列安装在基板上。光混合室安装在基板上，用于将LED阵列密封在内部。漫射片被固定在光混合室内并且平行于衬底设置。第一棱镜片被固定在光混合室内并且平行于漫射片设置。第二棱镜片被固定在光混合室内并平行于第一棱镜片设置。

3. 外观设计

USD566663S1 Light emitting diode 有权
公开(公告)号：USD566663S1
公开(公告)日：2008-04-15
申请号：US29264428
申请日：2006-08-10
申请人： Robert Yeh
设计人： Robert Yeh

4. 发明申请

US20120305967A1 Flip Chip Type Light Emitting Diode and Manufacturing Method Thereof 有权
标题翻译：倒装芯片型发光二极管及其制造方法
公开(公告)号：US20120305967A1
公开(公告)日：2012-12-06
申请号：US13482485
申请日：2012-05-29
申请人： Robert Yeh
发明人： Robert Yeh
IPC分类号： H01L33/60 , H01L33/36 , H01L33/48
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
摘要： The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.
摘要翻译：本公开提供了一种倒装芯片型发光二极管，其包括基板和发光二极管芯片。基板包括主体，多个第三焊盘，第四焊盘，第一电极，第二电极，多个第一通孔和第二通孔。主体具有与第一表面相对的第一表面和第二表面。第三焊盘和第四焊盘设置在主体的第一表面上。第一电极和第二电极设置在主体的第二表面上。第一通孔穿过主体并且各自电耦合到第三焊盘和第一电极中的相应一个。第二通孔穿过主体并且电耦合到第四焊盘和第二电极。

5. 发明授权

US09171995B2 Flip chip type light emitting diode and manufacturing method thereof 有权
标题翻译：倒装芯片型发光二极管及其制造方法
公开(公告)号：US09171995B2
公开(公告)日：2015-10-27
申请号：US13482485
申请日：2012-05-29
申请人： Robert Yeh
发明人： Robert Yeh
IPC分类号： H01L33/00 , H01L33/38 , H01L33/62
CPC分类号： H01L33/0079 , H01L33/382 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
摘要： The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.
摘要翻译：本公开提供了一种倒装芯片型发光二极管，其包括基板和发光二极管芯片。基板包括主体，多个第三焊盘，第四焊盘，第一电极，第二电极，多个第一通孔和第二通孔。主体具有与第一表面相对的第一表面和第二表面。第三焊盘和第四焊盘设置在主体的第一表面上。第一电极和第二电极设置在主体的第二表面上。第一通孔穿过主体并且各自电耦合到第三焊盘和第一电极中的相应一个。第二通孔穿过主体并且电耦合到第四焊盘和第二电极。

6. 发明申请

US20070164408A1 Light emitting diode packaging structure 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20070164408A1
公开(公告)日：2007-07-19
申请号：US11489496
申请日：2006-07-20
申请人： Robert Yeh , Shih-Jen Chuang
发明人： Robert Yeh , Shih-Jen Chuang
IPC分类号： H01L23/495
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/0102 , H01L2924/01068 , H01L2924/01079 , H01L2924/00014
摘要： A light emitting diode (LED) packaging structure includes a package body, a lead frame and a reflective wall. The package body includes a chip accommodating space for an LED chip, and a portion of the lead frame is exposed to the chip accommodating space. The reflective wall is connected with the lead frame and extendedly bends from the lead frame to cover a sidewall of the accommodating space so that rays of the LED chip can reflect from the reflective wall mostly.
摘要翻译：发光二极管（LED）封装结构包括封装体，引线框架和反射壁。封装体包括用于LED芯片的芯片容纳空间，并且引线框架的一部分暴露于芯片容纳空间。反射壁与引线框架连接并从引线框架延伸弯曲以覆盖容纳空间的侧壁，使得LED芯片的光线可以大部分从反射壁反射。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式