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1. 发明申请

US20080311354A1 Method for producing resin plated product and resin molded product to be plated used therefor 有权
标题翻译：用于生产树脂电镀产品的方法和用于其的被电镀的树脂模制产品
公开(公告)号：US20080311354A1
公开(公告)日：2008-12-18
申请号：US12003953
申请日：2008-01-03
申请人： Yoshitaka Ohara , Tomohiro Morita , Ryoji Matsuoka
发明人： Yoshitaka Ohara , Tomohiro Morita , Ryoji Matsuoka
IPC分类号： B32B27/04 , C25D11/00
CPC分类号： C25D5/12 , C25D5/14 , C25D5/48 , Y10T428/24793
摘要： A method for producing a resin plated product includes: a molding step of forming a resin molded product as a resin molded product to be plated that includes integrally a main body part with a form of a molding and a sacrifice part arranged in the vicinity of an edge part not to come into contact with the edge part; an electro-less plating step of applying an electro-less plating process to the resin molded product, an electroplating step of immersing the resin molded product in an electroplating bath provided with an anode electrode, applying an anode voltage to the anode electrode and applying a cathode voltage to the resin molded product to carry out an electroplating process; and a removing step of removing the sacrifice part from the resin molded product. The sacrifice part is preferably extended from a non-designed surface of the main body part.
摘要翻译：一种树脂电镀制品的制造方法，其特征在于，包括以下工序：将树脂成型体形成为被覆方式的树脂成形品，将成形体的主体部和所述成形体的一部分配置在一起的牺牲部边缘部分不与边缘部分接触; 对所述树脂成型体进行无电镀处理的无电镀工序，将所述树脂成形体浸渍在设置有阳极电极的电镀槽中的电镀工序，向所述阳极电极施加阳极电压，对树脂成型体的阴极电压进行电镀工序; 以及从树脂成型体除去牺牲部的移除工序。牺牲部分优选地从主体部分的非设计表面延伸。

2. 发明授权

US08900689B2 Method for producing resin plated product and resin molded product to be plated used therefor 有权
标题翻译：用于生产树脂电镀产品的方法和用于其的被电镀的树脂模制产品
公开(公告)号：US08900689B2
公开(公告)日：2014-12-02
申请号：US12003953
申请日：2008-01-03
申请人： Yoshitaka Ohara , Tomohiro Morita , Ryoji Matsuoka
发明人： Yoshitaka Ohara , Tomohiro Morita , Ryoji Matsuoka
IPC分类号： B23B27/04 , C25D5/56 , C25D5/12 , C25D5/14 , C25D5/48
CPC分类号： C25D5/12 , C25D5/14 , C25D5/48 , Y10T428/24793
摘要： A method for producing a resin plated product includes: a molding step of forming a resin molded product as a resin molded product to be plated that includes integrally a main body part with a form of a molding and a sacrifice part arranged in the vicinity of an edge part not to come into contact with the edge part; an electro-less plating step of applying an electro-less plating process to the resin molded product, an electroplating step of immersing the resin molded product in an electroplating bath provided with an anode electrode, applying an anode voltage to the anode electrode and applying a cathode voltage to the resin molded product to carry out an electroplating process; and a removing step of removing the sacrifice part from the resin molded product. The sacrifice part is preferably extended from a non-designed surface of the main body part.
摘要翻译：一种树脂电镀制品的制造方法，其特征在于，包括以下工序：将树脂成型体形成为被覆方式的树脂成形品，将成形体的主体部和所述成形体的一部分配置在一起的牺牲部边缘部分不与边缘部分接触; 对所述树脂成型体进行无电镀处理的无电镀工序;将所述树脂成形体浸渍在设置有阳极电极的电镀槽中的电镀工序，向所述阳极电极施加阳极电压，对树脂成型体的阴极电压进行电镀工序; 以及从树脂成型体除去牺牲部的移除工序。牺牲部分优选地从主体部分的非设计表面延伸。

3. 发明申请

US20080237052A1 Method for fabricating plated product 有权
标题翻译：电镀产品的制造方法
公开(公告)号：US20080237052A1
公开(公告)日：2008-10-02
申请号：US12076866
申请日：2008-03-25
申请人： Ryoji Matsuoka , Muneo Furutani , Masato Nasu , Takeshi Inoue
发明人： Ryoji Matsuoka , Muneo Furutani , Masato Nasu , Takeshi Inoue
IPC分类号： C25D5/02
CPC分类号： C25D17/12 , C25D5/00 , C25D7/00 , C25D17/007
摘要： A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24, respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfaces 22 and 24 so that the surface of the concave portion is away from the segmented anodes 31 and 32, respectively, is larger than those of other portions at a part serving as a border between the second plated surface 22 and the fourth plated surface 24. Accordingly, the distance from the part serving as the border between the second plated surface 22 and the fourth plated surface 24 to a metal case 50a corresponding to this part is set so as to be shorter than those from each of the other parts to the metal cases 50a and 50b respectively corresponding to the segmented anodes 31 and 32.
摘要翻译：通过将分段阳极31和32设置在要被电镀的基材20的表面22和24上并进行电镀以分别在表面22和24上形成金属膜来制造保险杠模制件。形成在表面22和24的每个部分中的凹部的表面的曲率分别大于凹部的表面远离分段的阳极31和32的曲率大于其他部分的曲率作为第二电镀表面22和第四电镀表面24之间的边界的部分。因此，从第二镀面22与第四镀面24之间的边界部分到与该部分相对应的金属壳50a的距离设定为短于其他部分至第金属壳体50a和50b分别对应于分段阳极31和32。

4. 发明授权

US08092666B2 Method for fabricating plated product 有权
标题翻译：电镀产品的制造方法
公开(公告)号：US08092666B2
公开(公告)日：2012-01-10
申请号：US12076866
申请日：2008-03-25
申请人： Ryoji Matsuoka , Muneo Furutani , Masato Nasu , Takeshi Inoue
发明人： Ryoji Matsuoka , Muneo Furutani , Masato Nasu , Takeshi Inoue
IPC分类号： C25D5/02
CPC分类号： C25D17/12 , C25D5/00 , C25D7/00 , C25D17/007
摘要： A bumper molding is fabricated by disposing segmented anodes 31 and 32 on surfaces 22 and 24 of a base material 20, which are to be plated, and performing electroplating so as to form metal films on the surfaces 22 and 24, respectively. The curvature of a surface of a concave portion, which is formed in each part of the surfaces 22 and 24 so that the surface of the concave portion is away from the segmented anodes 31 and 32, respectively, is larger than those of other portions at a part serving as a border between the second plated surface 22 and the fourth plated surface 24. Accordingly, the distance from the part serving as the border between the second plated surface 22 and the fourth plated surface 24 to a metal case 50a corresponding to this part is set so as to be shorter than those from each of the other parts to the metal cases 50a and 50b respectively corresponding to the segmented anodes 31 and 32.
摘要翻译：通过将分段阳极31和32设置在要被电镀的基材20的表面22和24上并进行电镀以分别在表面22和24上形成金属膜来制造保险杠模制件。形成在表面22和24的每个部分中的凹部的表面的曲率分别大于凹部的表面远离分段的阳极31和32的曲率大于其他部分的曲率作为第二电镀表面22和第四电镀表面24之间的边界的部分。因此，从第二电镀表面22和第四镀覆表面24之间的边界部分到与其对应的金属壳体50a的距离部分被设定为比分别对应于分段阳极31和32的金属壳体50a和50b的其它部分的那些短。

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