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    • 5. 发明授权
    • Housing with a soft surface
    • 外壳表面柔软
    • US07811658B2
    • 2010-10-12
    • US11961283
    • 2007-12-20
    • Gang-Yang YuHsiang-Jung SuWen-Te Lai
    • Gang-Yang YuHsiang-Jung SuWen-Te Lai
    • B32B9/04B32B15/04B41M5/00
    • H05K5/0243Y10T428/24802Y10T428/24876Y10T428/24917
    • A housing with a soft surface device (100) includes a substrate (10), a primer coating (20) formed on a surface of the substrate, a decorative coating (30) formed on the primer coating, and a top coating (40) formed on the decorative coating and configured for protecting the decorative coating. The primer coating is made of a first resin paint containing a polyamide component. The decorative coating is made of a second resin paint. The top coating is made of a third resin paint. Both the second resin paint and the third resin paint contain an isocyanate polymer and/or reaction products of the isocyanate polymer with hydroxyl groups. A method for making a housing is also provided.
    • 具有软表面装置(100)的壳体包括基底(10),形成在基底表面上的底漆涂层(20),形成在底漆涂层上的装饰涂层(30)和顶涂层(40) 形成在装饰涂层上并被构造成保护装饰涂层。 底漆涂层由含有聚酰胺组分的第一种树脂涂料制成。 装饰性涂料由第二种树脂涂料制成。 顶部涂层由第三种树脂涂料制成。 第二树脂涂料和第三树脂涂料均含有异氰酸酯聚合物和/或异氰酸酯聚合物与羟基的反应产物。 还提供了制造壳体的方法。
    • 6. 发明申请
    • Method of manufacturing metal cover with blind holes therein
    • 制造带有盲孔的金属盖的方法
    • US20060049141A1
    • 2006-03-09
    • US11268950
    • 2005-11-07
    • Wen-Te Lai
    • Wen-Te Lai
    • B44C1/22C23F1/00
    • B44C1/227C23F1/02C25D11/022C25D11/04C25D13/12Y10T29/4916Y10T29/49171Y10T29/49172Y10T29/49178
    • An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; step (64), forming holes in the protective film according to an intended pattern of the blind holes in the metal cover, thus exposing the metal surface through the holes; step (66), etching the metal substrate in the exposed areas to form the blind holes; and step (68), removing a remainder of the protective film from the metal substrate, thereby obtaining the finished metal cover. The method involving etching is relatively low-cost. Additionally, because electrophoretic deposition is used to cover the metal substrate with the protective film, the protective film can be formed on all surfaces of the metal substrate. Thus the method is especially advantageous for manufacturing a metal cover having a three-dimensional shape.
    • 制造其中具有盲孔(3)的金属盖(1)的示例性方法包括:步骤(60),制备金属基板; 步骤(62),用电泳沉积形成的保护膜覆盖金属基板; 步骤(64),根据金属盖中的盲孔的预期图案在保护膜中形成孔,从而使金属表面通过孔露出; 步骤(66),在暴露的区域中蚀刻金属基底以形成盲孔; 和步骤(68),从金属基板去除剩余的保护膜,从而获得成品金属盖。 涉及蚀刻的方法相对低成本。 另外,由于使用电泳沉积法来覆盖金属基板与保护膜,所以可以在金属基板的所有表面上形成保护膜。 因此,该方法特别有利于制造具有三维形状的金属盖。
    • 7. 发明授权
    • Method of manufacturing metal cover with blind holes therein
    • 制造带有盲孔的金属盖的方法
    • US07387740B2
    • 2008-06-17
    • US11268950
    • 2005-11-07
    • Wen-Te Lai
    • Wen-Te Lai
    • B44C1/22C25B15/00
    • B44C1/227C23F1/02C25D11/022C25D11/04C25D13/12Y10T29/4916Y10T29/49171Y10T29/49172Y10T29/49178
    • An exemplary method of manufacturing a metal cover (1) with blind holes (3) therein includes: step (60), preparing a metal substrate; step (62), covering the metal substrate with a protective film formed by electrophoretic deposition; step (64), forming holes in the protective film according to an intended pattern of the blind holes in the metal cover, thus exposing the metal surface through the holes; step (66), etching the metal substrate in the exposed areas to form the blind holes; and step (68), removing a remainder of the protective film from the metal substrate, thereby obtaining the finished metal cover. The method involving etching is relatively low-cost. Additionally, because electrophoretic deposition is used to cover the metal substrate with the protective film, the protective film can be formed on all surfaces of the metal substrate. Thus the method is especially advantageous for manufacturing a metal cover having a three-dimensional shape.
    • 制造其中具有盲孔(3)的金属盖(1)的示例性方法包括:步骤(60),制备金属基板; 步骤(62),用电泳沉积形成的保护膜覆盖金属基板; 步骤(64),根据金属盖中的盲孔的预期图案在保护膜中形成孔,从而使金属表面通过孔露出; 步骤(66),在暴露的区域中蚀刻金属基底以形成盲孔; 和步骤(68),从金属基板去除剩余的保护膜,从而获得成品金属盖。 涉及蚀刻的方法相对低成本。 另外,由于使用电泳沉积法来覆盖金属基板与保护膜,所以可以在金属基板的所有表面上形成保护膜。 因此,该方法特别有利于制造具有三维形状的金属盖。