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1. 发明授权

US07961763B2 System for detection of wafer defects 有权
标题翻译：晶圆缺陷检测系统
公开(公告)号：US07961763B2
公开(公告)日：2011-06-14
申请号：US11476342
申请日：2006-06-28
申请人： Dov Furman , Gad Neumann , Mark Wagner , Noam Dotan , Ram Segal , Shai Silberstein
发明人： Dov Furman , Gad Neumann , Mark Wagner , Noam Dotan , Ram Segal , Shai Silberstein
IPC分类号： H01S3/10 , H01S3/11 , H01S3/0915
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/95607 , G01N21/95623 , G01N2021/479 , G01N2021/8825 , G01N2201/0697 , G01N2201/0826
摘要： Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.
摘要翻译：通过用来自重复脉冲激光器的短光脉冲照射晶片缺陷的快速在线电光检测，晶片的一部分在成像系统的视场内移动，并将移动的晶片成像到焦平面组件，在光学成像系统的焦平面处光学地形成光电检测器的连续表面。持续移动的晶片被持续时间明显短于像素停留时间的激光脉冲照亮，使得在晶片运动期间实际上没有图像污迹。激光脉冲具有足够的能量和亮度，以对于产生被检查的晶片管芯的图像所需的每个顺序检查的视场赋予必要的照明。描述了一种有效减少源相干效应的新型光纤照明传输系统。该系统的其他新颖的方面包括用于补偿Q开关激光输出的脉冲能量变化的系统，用于晶片成像系统的自动聚焦的方法，以及通过傅立叶平面去除图像的重复特征的新颖方法过滤，以便更容易地检测晶片缺陷。

2. 发明授权

US07916286B2 Defect detection through image comparison using relative measures 有权
标题翻译：通过图像比较使用相对措施进行缺陷检测
公开(公告)号：US07916286B2
公开(公告)日：2011-03-29
申请号：US11958731
申请日：2007-12-18
申请人： Erez Sali , Oren Cohen
发明人： Erez Sali , Oren Cohen
IPC分类号： G01B11/00 , G01N21/00 , G06K9/00 , G06K9/03
CPC分类号： G01N21/95607 , G06T7/001 , G06T2207/30148
摘要： Inspection of objects such as semiconductor wafers can include comparisons of shapes between inspection and reference images. As part of the inspection process, relative values may be assigned to pixels within each image based on comparison of such pixels to neighboring pixels. For instance, the pixels may be ranked by relative brightness in each image. Alternatively, directional vectors may be defined based on slopes between pixels and their neighbors. Various comparison metrics may be utilized to determine the degree of correlation between the relative values for pixels in the inspection image and corresponding pixels in the reference image. Relative values may be combined with conventional techniques as part of an inspection process. The inspection may be performed using an optical inspection tool that uses conventional techniques to identify defect candidates, with relative value analysis performed on areas containing defect candidates to confirm or deny the existence of a defect.
摘要翻译：检查诸如半导体晶片的物体可以包括检查和参考图像之间的形状的比较。作为检查过程的一部分，可以基于这些像素与相邻像素的比较将相对值分配给每个图像内的像素。例如，像素可以通过每个图像中的相对亮度进行排序。或者，可以基于像素与其邻居之间的斜率来定义方向向量。可以使用各种比较度量来确定检查图像中的像素和参考图像中的对应像素的相对值之间的相关度。作为检查过程的一部分，相对值可以与常规技术相结合。可以使用使用常规技术来识别缺陷候选的光学检查工具进行检查，对包含缺陷候选的区域进行相对值分析以确认或拒绝存在缺陷。

3. 发明授权

US07804993B2 Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images 有权
标题翻译：用于检测晶片中的缺陷的方法和装置，包括晶片图像的对准，以便在所有图像中引起相同的涂片
公开(公告)号：US07804993B2
公开(公告)日：2010-09-28
申请号：US11068711
申请日：2005-02-28
申请人： Yuval Dorphan , Ran Zaslavsky , Mark Wagner , Dov Furman , Shai Silberstein
发明人： Yuval Dorphan , Ran Zaslavsky , Mark Wagner , Dov Furman , Shai Silberstein
IPC分类号： G06K9/00 , G06K9/40
CPC分类号： G01N21/9501 , G01N21/95607
摘要： A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
摘要翻译：一种用于检查包括多个管芯的晶片的方法，所述方法包括将晶片的至少一部分的图像划分成多个子图像，每个子图像表示晶片的子部分，并且选择至少一个缺陷候选物每个子图像通过将每个子图像与包括晶片的该部分的被认为是无故障的表示的参考的对应子图像进行比较。

4. 发明授权

US07813541B2 Method and apparatus for detecting defects in wafers 有权
标题翻译：用于检测晶片缺陷的方法和装置
公开(公告)号：US07813541B2
公开(公告)日：2010-10-12
申请号：US11069712
申请日：2005-02-28
申请人： Erez Sali , Tomer Yanir , Mark Wagner , Noam Dotan , Yuval Dorfan , Ran Zaslavsky
发明人： Erez Sali , Tomer Yanir , Mark Wagner , Noam Dotan , Yuval Dorfan , Ran Zaslavsky
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N21/9501 , G06T7/001
摘要： A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.
摘要翻译：一种用于检查包括多个管芯的晶片的方法，所述方法包括将晶片的至少一部分的图像划分成多个子图像，每个子图像表示晶片的子部分，并且选择至少一个缺陷候选物每个子图像通过将每个子图像与包括晶片的该部分的被认为是无故障的表示的参考的对应子图像进行比较。

5. 发明授权

US07804590B2 Multi mode inspection method and apparatus 有权
标题翻译：多模式检查方法和装置
公开(公告)号：US07804590B2
公开(公告)日：2010-09-28
申请号：US12316302
申请日：2008-12-10
申请人： Dov Furman , Noam Dotan , Efraim Miklatzky
发明人： Dov Furman , Noam Dotan , Efraim Miklatzky
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N2021/8825
摘要： An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.
摘要翻译：一种用于检查物体的检查系统，所述系统包括照明器，所述照明器包括至少一个脉冲光源，检测器组件和相对运动提供器，所述相对运动提供器可操作以沿着运动轴线提供所述物体相对于所述检测器组件的运动，检测器组件包括多个二维检测器单元，其有效面积间隔地布置。

6. 发明授权

US07719674B2 Image splitting in optical inspection systems 有权
标题翻译：光学检测系统中的图像分割
公开(公告)号：US07719674B2
公开(公告)日：2010-05-18
申请号：US11944677
申请日：2007-11-26
申请人： Dov Furman , Shai Silberstein , Effy Miklatzky , Daniel Mandelik , Martin Abraham
发明人： Dov Furman , Shai Silberstein , Effy Miklatzky , Daniel Mandelik , Martin Abraham
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/95607 , G01N2021/8825 , G01N2021/95615
摘要： In an optical inspection tool, an image of an object under inspection, such as a semiconductor wafer, may be obtained using imaging optics defining a focal plane. Light comprising the image can be detected using multiple detectors which each register a portion of the image. The image of the object at the focal plane can be split into two, three, or more parts by mirrors or other suitable reflecting elements positioned tangent to the focal plane and/or with at least some portion at the focal plane with additional portions past the focal plane so that the focal plane lies between the imaging optics and the splitting apparatus. In some embodiments, reflective planes may be arranged to direct different portions to different detectors. Some reflective planes may be separated by a gap so that some portions of the light are directed while some portions pass through the gap. Other splitting elements may comprise a group of transmissive and reflective areas interspersed in an element positioned at or in the focal plane, with some portions of the light are reflected to detectors while other portions pass through the element(s) to other detectors. Splitting apparatuses and elements may be cascaded.
摘要翻译：在光学检查工具中，可以使用限定焦平面的成像光学元件来获得被检查物体（诸如半导体晶片）的图像。可以使用多个检测器来检测包括图像的光，每个检测器记录图像的一部分。在焦平面处的物体的图像可以通过反射镜或与焦平面相切定位的其它合适的反射元件和/或与焦平面上的至少一些部分分离成两个，三个或更多个部分，附加部分经过该焦平面焦平面，使得焦平面位于成像光学元件和分割装置之间。在一些实施例中，可以布置反射平面以将不同部分引导到不同的检测器。一些反射面可以被间隙分离，使得一些部分的光被引导，而一些部分通过间隙。其他分裂元件可以包括散布在位于焦平面处或焦平面处的元件中的一组透射和反射区域，其中一些部分光被反射到检测器，而其他部分穿过元件到其它检测器。分割装置和元件可以级联。

7. 发明授权

US07633041B2 Apparatus for determining optimum position of focus of an imaging system 有权
标题翻译：用于确定成像系统的焦点的最佳位置的装置
公开(公告)号：US07633041B2
公开(公告)日：2009-12-15
申请号：US11524684
申请日：2006-09-21
申请人： Dov Furman , Gad Neumann , Mark Wagner , Noam Dotan , Ram Segal , Shai Silberstein
发明人： Dov Furman , Gad Neumann , Mark Wagner , Noam Dotan , Ram Segal , Shai Silberstein
IPC分类号： G02B7/04 , G01N21/86
CPC分类号： G01N21/9501 , G01N21/8806 , G01N21/95607 , G01N21/95623 , G01N2021/479 , G01N2021/8825 , G01N2201/0697 , G01N2201/0826
摘要： Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described. Other novel aspects of the system include a system for compensating for variations in the pulse energy of a Q-switched laser output, methods for autofocussing of the wafer imaging system, and novel methods for removal of repetitive features of the image by means of Fourier plane filtering, to enable easier detection of wafer defects.
摘要翻译：通过用来自重复脉冲激光器的短光脉冲照射晶片缺陷的快速在线电光检测，晶片的一部分在成像系统的视场内移动，并将移动的晶片成像到焦平面组件，在光学成像系统的焦平面处光学地形成光电检测器的连续表面。持续移动的晶片被持续时间明显短于像素停留时间的激光脉冲照亮，使得在晶片运动期间实际上没有图像污迹。激光脉冲具有足够的能量和亮度，以对于产生被检查的晶片管芯的图像所需的每个顺序检查的视场赋予必要的照明。描述了一种有效减少源相干效应的新型光纤照明传输系统。该系统的其他新颖的方面包括用于补偿Q开关激光输出的脉冲能量变化的系统，用于晶片成像系统的自动聚焦的方法，以及通过傅里叶平面去除图像的重复特征的新颖方法过滤，以便更容易地检测晶片缺陷。

8. 发明授权

US08031931B2 Printed fourier filtering in optical inspection tools 有权
标题翻译：光学检测工具中的印刷光栅过滤
公开(公告)号：US08031931B2
公开(公告)日：2011-10-04
申请号：US11410276
申请日：2006-04-24
申请人： Dan T. Fuchs , Shai Silberstein
发明人： Dan T. Fuchs , Shai Silberstein
IPC分类号： G06K9/00
CPC分类号： G06K9/741 , G01N21/95623 , G06K2209/19
摘要： A spatial mask printer may be used in conjunction with an optical inspection tool. The tool can be used to obtain a Fourier image of an inspected object, and a filter mask image can be designed to block certain aspects of the object's image in the Fourier plane corresponding to repetitive aspects of the imaged object. The filter mask image can then be printed and used in the tool during the inspection process. The mask image may be designed by hand or by computer and may be stored for later use. Filters may be automatically placed into the optical path of the inspection tool by a filter wheel, or may be housed in other filter banks. The printer may be configured to operate in a clean room environment, and may be integrated into the optical inspection tool.
摘要翻译：空间掩模打印机可以与光学检查工具结合使用。可以使用该工具来获得被检查对象的傅里叶图像，并且可以设计滤波器掩模图像以阻挡对应于成像对象的重复方面的傅立叶平面中的对象的图像的某些方面。然后可以在检查过程中将过滤器掩模图像打印并在工具中使用。掩模图像可以手动或通过计算机设计，并且可以存储以供以后使用。过滤器可以通过过滤轮自动地放置在检查工具的光路中，或者可以容纳在其他过滤器组中。打印机可以被配置为在洁净室环境中操作，并且可以集成到光学检查工具中。

9. 发明授权

US07973921B2 Dynamic illumination in optical inspection systems 有权
标题翻译：光学检测系统中的动态照明
公开(公告)号：US07973921B2
公开(公告)日：2011-07-05
申请号：US12145708
申请日：2008-06-25
申请人： Shai Silberstein , Tsafrir Avni
发明人： Shai Silberstein , Tsafrir Avni
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/9503 , G01N21/95607 , G01N21/95623 , G01N2021/8825 , G01N2201/067 , G01N2201/0675 , G01N2201/0697 , G01N2201/1241
摘要： An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.
摘要翻译：光学检查系统或工具可以被配置为使用动态照明来检查物体，其中调整照明的一个或多个特征以满足不同区域的检查需要。例如，当工具检查晶片管芯中的存储器区域和外围特征时，可以增加或减小照明强度。在一些实施例中，调整可以基于在预检查设置顺序期间获得的数据，其中基于具有变化特性的照明拍摄的图像被评估为在检查过程的其余部分中的适用性。

10. 发明授权

US07924420B2 Optical inspection including partial scanning of wafers 有权
标题翻译：光学检查包括晶片的部分扫描
公开(公告)号：US07924420B2
公开(公告)日：2011-04-12
申请号：US11764296
申请日：2007-06-18
申请人： Gilad Shomrony , Arnon Gratch , Shai Silberstein
发明人： Gilad Shomrony , Arnon Gratch , Shai Silberstein
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Inspection of objects, such as semiconductor wafers, can be performed using a diluted scan wherein not all of an inspected area is actually imaged. Instead, a dilution plan can be devised based on the desired amount of area to be skipped and the particular parameters of the inspection, such as the size of each unit area to be imaged or not imaged and the distribution features of the wafer. When the same area is inspected in multiple wafers, the wafers can be inspected in sets using a dilution plan whereby a wafer (or inspected area) can be statistically inspected using diluted scans of the set of wafers. Similarly a die or group of dies of a specified type can be statistically inspected using diluted scans of a set of dies (or group of dies). When statistical inspection is used, the end results of such inspections, such as defect densities and distributions, can be corrected to account for inaccuracies that may be introduced when certain portions are imaged more often than others due to the dilution plan.
摘要翻译：可以使用稀释扫描来执行诸如半导体晶片的对象的检查，其中不是所有的检查区域都被实际成像。相反，可以基于要跳过的期望的区域面积和检查的特定参数（例如要成像或未被成像的每个单位面积的大小以及晶片的分布特征）来设计稀释计划。当在多个晶片中检查相同的区域时，可以使用稀释计划对组合进行检查，从而可以使用该组晶片的稀释扫描对晶片（或检查区域）进行统计学检查。类似地，可以使用一组模具（或一组模具）的稀释扫描来统计检查指定类型的模具或一组模具。当使用统计检验时，可以纠正这种检查的最终结果，例如缺陷密度和分布，以解决由于稀释计划，某些部分比其他部分成像的频率更高时可能引入的不准确。

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