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    • 2. 发明授权
    • Methods and systems for routing an electronic design using spacetiles
    • 使用空间布线电子设计的方法和系统
    • US09075932B1
    • 2015-07-07
    • US13602069
    • 2012-08-31
    • Jeffrey S. Salowe
    • Jeffrey S. Salowe
    • G06F17/50
    • G06F17/50G06F17/5036G06F17/5077
    • Various embodiments identify a routing layer of an electronic design, create spacetile(s) by performing spacetile punches for the muting layer, identify an area probe from the spacetiles, and routes the electronic design by using the one or more area probes for performing area search for routing solutions. Some embodiments identify two routing layers of an electronic design, perform spacetile punches to form spacetiles for the routing layers, determine a via spacetile layer, identify spacetiles as one or more area probes based on the via spacetile layer, and routes the electronic design by using the one or more area probes for performing area search for routing solutions while transitioning between the two muting layers. One of the two routing layers may be a tracked muting layer, and the other may be a trackless routing layer. The tracked muting may be gridded or gridless.
    • 各种实施例识别电子设计的布线层,通过对静电层进行空间冲压来创建空间,从空间识别区域探针,并且通过使用用于执行区域搜索的一个或多个区域探针来路由电子设计 用于路由解决方案。 一些实施例识别电子设计的两个路由层,执行空间冲孔以形成用于路由层的空间,确定经由空间层,基于经由空间层将空间识别为一个或多个区域探针,并且通过使用 所述一个或多个区域探针用于在两个屏蔽层之间转换时执行路由解决方案的区域搜索。 两个路由层中的一个可以是跟踪的静默层,另一个可以是无轨道路由层。 跟踪的静音可能是网格或无格。
    • 3. 发明授权
    • Method and apparatus for inserting metal fill in an integrated circuit (“IC”) layout
    • 用于将金属填充物插入集成电路(“IC”)布局的方法和装置
    • US08074187B2
    • 2011-12-06
    • US12731057
    • 2010-03-24
    • Judd Matthew YlinenKwok Ming Yue
    • Judd Matthew YlinenKwok Ming Yue
    • G06F17/50
    • H01L23/522G06F2217/12H01L21/76819H01L21/7684H01L2924/0002Y02P90/265H01L2924/00
    • Some embodiments of the invention provide a method for inserting several fills in an integrated circuit (“IC”) layout. The method identifies a set of potential fills in a region of an IC layout, where the set of potential fills has a first fill size, wherein the first fill size is from a set of fill sizes. The method specifies a halo around each potential fill in the set of potential fills. For each potential fill, the method determines whether the specified halo overlaps with a foreign object in the region of the layout. For each potential fill, the method specifies a legal fill in the region of the IC layout if the specified halo does not overlap with a foreign object in the region of the IC layout. The method inserts at least one legal fill in the region of the IC layout. In some embodiments, the halo is a spacing halo.
    • 本发明的一些实施例提供了一种在集成电路(“IC”)布局中插入多个填充物的方法。 该方法识别在IC布局的区域中的一组潜在填充,其中该潜在填充的集合具有第一填充尺寸,其中第一填充尺寸来自一组填充尺寸。 该方法在潜在填充集合中的每个潜在填充周围指定光晕。 对于每个潜在的填充,该方法确定指定的光晕是否与布局区域中的异物重叠。 对于每个可能的填充,如果指定的光环不与IC布局区域中的异物重叠,则该方法指定IC布局区域中的合法填充。 该方法在IC布局的区域插入至少一个合法填充。 在一些实施方案中,卤素是间隔卤素。
    • 4. 发明授权
    • Methods, systems, and computer program products for grid-morphing techniques in placement, floorplanning, and legalization
    • 方法,系统和计算机程序产品,用于放置,布局规划和合法化中的格式变形技​​术
    • US07739644B1
    • 2010-06-15
    • US11838193
    • 2007-08-13
    • Philip ChongChristian Szegedy
    • Philip ChongChristian Szegedy
    • G06F17/50
    • G06F17/5072
    • Disclosed are methods, systems, and computer program products for performing grid morphing technique for computing a spreading of objects over an area such that the final locations of the objects are distributed over the area and such that the final locations of the objects are minimally perturbed from their initial starting locations and the density of objects meets certain constraints. The minimization of perturbation, or stability, of the approaches disclosed, is the key feature which is the principal benefit of the techniques disclosed. The methods described herein may be used as part of a tool for placement or floorplanning of logic gates or larger macroblocks for the design of an integrated circuit.
    • 公开了用于执行网格变形技术的方法,系统和计算机程序产品,用于计算区域上的对象的扩展,使得对象的最终位置分布在该区域上,并且使得对象的最终位置被最小程度地从 它们的起始位置和物体的密度满足某些限制。 所公开的方法的扰动或稳定性的最小化是所公开技术的主要益处的关键特征。 本文描述的方法可以用作用于设计集成电路的逻辑门或更大宏块的放置或布局规划的工具的一部分。
    • 5. 发明授权
    • Method and apparatus for optimizing memory-built-in-self test
    • 用于优化内存自身测试的方法和装置
    • US08719761B2
    • 2014-05-06
    • US13625682
    • 2012-09-24
    • Norman CardPuneet AroraSteven GregorNavneet Kaushik
    • Norman CardPuneet AroraSteven GregorNavneet Kaushik
    • G06F17/50
    • G06F17/505G06F2217/14
    • Testing of memories is done using an optimized memory built-in-self-test (MBIST) approach, including the generation of compact models for memory. Cost functions are constructed from estimated parameters affecting MBIST, and a user is able to assign relative weights to the parameters. Estimated parameters include MBIST area, wiring congestion, and timing overhead, as well as power consumption and timing. The cost functions are minimized using optimization techniques, resulting in an optimized grouping of memory devices and an optimized schedule for MBIST testing. The estimated parameters may be derived from a compact model constructed from data experimentally-derived from various memory devices. This approach allows a circuit designer to generate and revise groupings and schedules prior to running a full design flow, saving time and cost, while still achieving high-quality results.
    • 使用优化的存储器内置自检(MBIST)方法来测试存储器,包括生成用于存储器的紧凑模型。 成本函数由影响MBIST的估计参数构成,用户可以为参数分配相对权重。 估计参数包括MBIST区域,布线拥塞和定时开销,以及功耗和时序。 使用优化技术最小化成本函数,从而对存储器件进行优化分组,并为MBIST测试提供优化的计划。 估计的参数可以从由从各种存储器件实验导出的数据构建的紧凑模型中导出。 这种方法允许电路设计者在运行完整的设计流程之前生成和修改分组和计划,从而节省时间和成本,同时仍然实现高质量的结果。
    • 7. 发明授权
    • IC layout with non-quadrilateral Steiner points
    • 具有非四边形Steiner点的IC布局
    • US06895569B1
    • 2005-05-17
    • US10066102
    • 2002-01-31
    • Steven TeigAkira FujimuraAndrew Caldwell
    • Steven TeigAkira FujimuraAndrew Caldwell
    • G06F9/45G06F17/50
    • G06F17/5068
    • Some embodiments of the invention provide vias that are not in shape of quadrilaterals. In some embodiments, some or all vias are in shape of non-quadrilateral polygons, such as octagons and hexagons. In some embodiments, some or all vias have a circular shape. Some embodiments provide a first set of vias that have a diamond shape and a second set of vias that have a rectangular shape. In some embodiments, a via can also be formed by a diamond contact and a rectangular contact. The diamond contact has four sides. In the embodiments described below, all four sides of a diamond via contact have equal sides. However, in other embodiments, a via contact can be in shape of a diamond with a pair of sides that are longer than the other pair of sides. Similarly, in the embodiments described below, the rectangular via contacts are squares with four equal sides. However, in other embodiments, the length and width of a rectangular via contact can differ. Some embodiments of the invention provide interconnect lines that have non-rectangular ends. In some embodiments, the interconnect-line ends are partial octagons, hexagons, and/or circles. Also, some embodiments provide Steiner points that are not rectangular. In some embodiments, the Steiner points are octagonal, hexagonal, or circles.
    • 本发明的一些实施例提供不具有四边形形状的通孔。 在一些实施例中,一些或所有通孔的形状为非四边形多边形,例如八边形和六边形。 在一些实施例中,一些或所有通孔具有圆形形状。 一些实施例提供具有菱形形状的第一组通孔和具有矩形形状的第二组通孔。 在一些实施例中,也可以通过金刚石触点和矩形触点形成通孔。 钻石接触有四面。 在下面描述的实施例中,钻石经过接触的所有四个侧面具有相等的边。 然而,在其他实施例中,通孔接触可以是具有比另一对侧长的一对侧面的菱形的形状。 类似地,在下面描述的实施例中,矩形通孔触点是具有四个相等边的正方形。 然而,在其他实施例中,矩形通孔接触件的长度和宽度可以不同。 本发明的一些实施例提供具有非矩形端部的互连线。 在一些实施例中,互连线端部是部分八边形,六边形和/或圆形。 而且,一些实施例提供了不是矩形的Steiner点。 在一些实施例中,Steiner点是八边形,六边形或圆形。