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1. 发明申请

US20230112649A1 INTEGRATED WARNING STRUCTURES FOR ENERGIZED ULTRAVIOLET LIGHT-EMITTING DIODE PACKAGES 有权
公开(公告)号：US20230112649A1
公开(公告)日：2023-04-13
申请号：US17500219
申请日：2021-10-13
申请人： CreeLED, Inc.
发明人： Colin Blakely , Andre Pertuit
IPC分类号： H01L33/50 , H01L33/62 , H01L33/48
摘要： Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly integrated warning structures for ultraviolet LED packages are disclosed. Integrated warning structures may include passive structures, such as lumiphoric material regions, that are arranged within LED packages to receive a portion of ultraviolet light from an LED chip within the LED package and provide a small amount of wavelength-converted light. Such wavelength-converted light may serve as indication that ultraviolet light is being emitted. Exemplary lumiphoric material regions may form one or more discrete regions within LED packages and may provide such wavelength-converted light without substantial impact on color purity of the LED packages. Accordingly, LED packages may provide integrated warning emissions that may serve to indicate the presence of ultraviolet emissions and/or reduce human exposure to such ultraviolet emissions.

2. 发明申请

US20230080947A1 COVER STRUCTURE ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES 有权
公开(公告)号：US20230080947A1
公开(公告)日：2023-03-16
申请号：US18057805
申请日：2022-11-22
申请人： CreeLED, Inc.
发明人： Colin Blakely , Eric Kamp , Derek Miller
IPC分类号： H01L33/48 , H01L33/50 , H01L33/58 , H01L33/60
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly cover structure arrangements for packaged LED devices are disclosed. Cover structures include light-absorbing layers configured to absorb certain wavelengths of light while permitting other wavelengths to pass therethrough. Light-absorbing layers may include pigment materials of colors that absorb intended wavelengths of light. In certain aspects, an LED package may include an LED chip configured to emit light of a first peak wavelength and a cover structure that includes a light-absorbing layer with a pigment of a color that absorbs the first peak wavelength. Such an arrangement may be useful for embodiments that also include a lumiphoric material that converts a portion of the first peak wavelength to light of a second peak wavelength. Cover structures may include one or more combinations of light-absorbing layers, antireflective layers, and reflective layers for providing improved emission characteristics for the LED package.

3. 发明授权

US11552229B2 Spacer layer arrangements for light-emitting diodes 有权
公开(公告)号：US11552229B2
公开(公告)日：2023-01-10
申请号：US17019593
申请日：2020-09-14
申请人： CreeLED, Inc.
发明人： Kyle Damborsky , Ayush Tripathi , Robert Wilcox , Sarah Trinkle , Colin Blakely
IPC分类号： H01L33/58 , H01L33/52 , H01L25/075 , H01L33/00
摘要： Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.

4. 发明授权

US11547063B1 Light-emitting devices for horticulture applications 有权
公开(公告)号：US11547063B1
公开(公告)日：2023-01-10
申请号：US17663940
申请日：2022-05-18
申请人： CreeLED, Inc.
发明人： Paul Scheidt , Anna Costine , Derek Miller , Colin Blakely
IPC分类号： A01G9/24 , A01G7/04 , F21V9/30 , H01L25/075 , H01L33/50 , H01L33/56 , H01L33/32 , F21Y115/10
摘要： Solid-state lighting devices and more particularly light-emitting devices for horticulture applications are disclosed. Light-emitting devices are disclosed with aggregate emissions that target chlorophyll absorption peaks while also providing certain broader spectrum emissions between the chlorophyll absorption peaks. The aggregate emissions may be provided by light-emitting diodes (LEDs) that emit wavelengths that correspond with certain chlorophyll absorption peaks and lumiphoric materials that provide broader spectrum emissions. The aggregate emissions are configured to have reduced emissions from lumiphoric materials in ranges close to certain chlorophyll absorption peaks, such as above 600 nanometers (nm). In this regard, light-emitting devices according to the present disclosure provide the ability to efficiently target specific chlorophyll absorption peaks for plant growth while also providing suitable lighting for occupants in a horticulture environment.

5. 发明授权

US11508715B2 Light-emitting diode chip with electrical overstress protection 有权
公开(公告)号：US11508715B2
公开(公告)日：2022-11-22
申请号：US16857721
申请日：2020-04-24
申请人： CreeLED, Inc.
发明人： Daniel E. Stasiw , Steven Wuester , Michael Check
IPC分类号： H01L27/02 , H01L33/48 , H01L33/60 , H01L33/00 , H01L25/075 , H01L33/62
摘要： Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chip structures with electrical overstress protection are disclosed. LED chip structures are disclosed that include built-in electrical overstress protection. An exemplary LED chip may include an active LED structure that is arranged as a primary light-emitting structure and a separate active LED structure that is arranged as an electrical overstress protection structure. The electrical overstress protection structure may be electrically connected in reverse relative to the primary light-emitting structure. In this manner, under normal operating conditions, forward current will flow through the primary light-emitting structure to generate desired light emissions, and during an electrical overstress event, reverse current may flow through the electrical overstress protection structure, thereby protecting the light-emitting structure from damage.

6. 发明申请

US20220228059A1 PHOSPHOR COMPOSITION 有权
公开(公告)号：US20220228059A1
公开(公告)日：2022-07-21
申请号：US17712646
申请日：2022-04-04
申请人： CREELED, INC.
发明人： Brian T. Collins , Christopher P. Hussell , David T. Emerson , Ronan P. Le Toquin
IPC分类号： C09K11/77 , C04B35/597 , C04B35/58 , C04B35/581 , C04B35/584 , C09K11/08 , C09K11/02
摘要： A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

7. 发明申请

US20220199589A1 LED CHIPS AND DEVICES WITH TEXTURED LIGHT-EXTRACTING PORTIONS, AND FABRICATION METHODS 有权
公开(公告)号：US20220199589A1
公开(公告)日：2022-06-23
申请号：US17538078
申请日：2021-11-30
申请人： CreeLED, Inc.
发明人： Peter Scott Andrews , David Suich , Kevin Haberern , Justin White
IPC分类号： H01L25/075 , H01L33/00 , H01L33/50
摘要： Pixelated-LED chips include substrate sidewalls with sidewall involutions and/or increased sidewall surface area regions to affect light extraction therefrom. A LED lighting device incorporates a superstrate that supports lumiphoric material and includes sidewalls with sidewall involutions and/or increased sidewall surface area regions. Methods for fabricating sidewall features may include etching (e.g., deep etching) of substrate or superstrate materials, such as by using an etch mask having edges with non-linear shapes to produce and/or enhance sidewall involutions when an etchant is supplied through the etch mask to selectively consume substrate or superstrate material.

8. 发明授权

US11367810B2 Light-altering particle arrangements for light-emitting devices 有权
公开(公告)号：US11367810B2
公开(公告)日：2022-06-21
申请号：US16993470
申请日：2020-08-14
申请人： CreeLED, Inc.
发明人： Derek Miller , Colin Blakely
IPC分类号： H01L33/50
摘要： Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED devices with light-altering particle arrangements are disclosed. An LED device may include an LED chip with a light-altering material arranged to redirect light in a desired emission direction. The light-altering material may include light-altering particles with a median particle size that is determined based on a wavelength of light provided by the LED chip. Such light-altering particles may be arranged proximate sidewalls of the LED chip to redirect lateral emissions. LED devices may further include lumiphoric materials and other light-altering particles arranged proximate the lumiphoric materials with a median particle size that is determined based on a wavelength of light provided by the lumiphoric materials. By selectively arranging different light-altering particles in different areas of an LED device based on what wavelengths of light are most concentrated, the amount of overall light redirected may be increased, thereby improving efficiency.

9. 发明申请

US20210265544A1 LIGHT-EMITTING DIODE PACKAGES 有权
公开(公告)号：US20210265544A1
公开(公告)日：2021-08-26
申请号：US17238934
申请日：2021-04-23
申请人： CreeLED, Inc.
发明人： Roshan Murthy , Kenneth M. Davis , Jae-Hyung Park , Xiameng Shi
IPC分类号： H01L33/62 , H01L25/075 , H01L25/16 , H01L33/64 , H01L21/66 , H01L33/50 , H01L33/60 , H01L27/02 , G02B5/02 , G02B27/09 , H01L23/00 , H01L33/10
摘要： Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.

10. 发明申请

US20230115342A1 BROAD ELECTROMAGNETIC SPECTRUM LIGHT-EMITTING DIODE PACKAGES 有权
公开(公告)号：US20230115342A1
公开(公告)日：2023-04-13
申请号：US17496320
申请日：2021-10-07
申请人： CreeLED, Inc.
发明人： David Suich , Michael Check , Colin Blakely
IPC分类号： H01L33/50 , H01L33/58 , H01L33/54 , H01L25/075 , F21V23/00
摘要： Light-emitting diode (LED) packages, and more particularly broad electromagnetic spectrum LED packages are disclosed. Individual LED packages are disclosed that are capable of emitting various combinations of peak wavelengths across a broad electromagnetic spectrum, including one or more combinations of ultraviolet, visible, and infrared peak wavelengths. Such LED packages may also be broadly tunable across portions of the electromagnetic spectrum ranging from ultraviolet to infrared wavelengths. By providing such capabilities within a single light source provided by a single LED package, larger and more complex systems for broadband emissions that include multiple light sources, complex optical systems, mirrors, filters, and additional components may be avoided. LED chip arrangements, control schemes, and encapsulant arrangements are also disclosed for such broad electromagnetic spectrum LED packages.

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