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    • 1. 发明授权
    • Removing undesirable nanotubes during nanotube device fabrication
    • 在纳米管器件制造过程中去除不需要的纳米管
    • US07943418B2
    • 2011-05-17
    • US11467058
    • 2006-08-24
    • Thomas W. Tombler, Jr.
    • Thomas W. Tombler, Jr.
    • H01L51/40
    • H01L51/057B82Y10/00B82Y40/00H01L51/0048
    • Fabricating single-walled carbon nanotube transistor devices includes removing undesirable types of nanotubes. These undesirable types of nanotubes may include nonsemiconducting nanotubes, multiwalled nanotubes, and others. The undesirable nanotubes may be removed electrically using voltage or current, or a combination of these. This approach to removing undesirable nanotubes is sometimes referred to as “burn-off.” The undesirable nanotubes may be removed chemically or using radiation. The undesirable nanotubes of an integrated circuit may be removed in sections or one transistor (or a group of transistors) at a time in order to reduce the electrical current used or prevent damage to the integrated circuit during burn-off.
    • 制造单壁碳纳米管晶体管器件包括去除不想要的类型的纳米管。 这些不期望的类型的纳米管可以包括非半导体纳米管,多壁纳米管等。 可以使用电压或电流或这些的组合来电除去不需要的纳米管。 这种去除不需要的纳米管的方法有时被称为“燃烧”。不期望的纳米管可以化学去除或使用辐射。 集成电路的不期望的纳米管可以在一段时间内去除部分或一个晶体管(或一组晶体管),以便减少所使用的电流或防止在烧坏期间对集成电路的损坏。
    • 4. 发明申请
    • Removing Undesirable Nanotubes During Nanotube Device Fabrication
    • 在纳米管装置制造过程中除去不希望的纳米管
    • US20110217827A1
    • 2011-09-08
    • US13109774
    • 2011-05-17
    • Thomas W. Tombler, JR.
    • Thomas W. Tombler, JR.
    • H01L21/326B82Y40/00
    • H01L51/057B82Y10/00B82Y40/00H01L51/0048
    • Fabricating single-walled carbon nanotube transistor devices includes removing undesirable types of nanotubes. These undesirable types of nanotubes may include nonsemiconducting nanotubes, multiwalled nanotubes, and others. The undesirable nanotubes may be removed electrically using voltage or current, or a combination of these. This approach to removing undesirable nanotubes is sometimes referred to as “burn-off.” The undesirable nanotubes may be removed chemically or using radiation. The undesirable nanotubes of an integrated circuit may be removed in sections or one transistor (or a group of transistors) at a time in order to reduce the electrical current used or prevent damage to the integrated circuit during burn-off.
    • 制造单壁碳纳米管晶体管器件包括去除不想要的类型的纳米管。 这些不期望的类型的纳米管可以包括非半导体纳米管,多壁纳米管等。 可以使用电压或电流或这些的组合来电除去不需要的纳米管。 这种去除不需要的纳米管的方法有时被称为“燃烧”。不期望的纳米管可以化学去除或使用辐射。 集成电路的不期望的纳米管可以在一段时间内去除部分或一个晶体管(或一组晶体管),以便减少所使用的电流或防止在烧坏期间对集成电路的损坏。
    • 8. 发明申请
    • Techniques to Enhance Selectivity of Electrical Breakdown of Carbon Nanotubes
    • 提高碳纳米管电击穿选择性的技术
    • US20110136304A1
    • 2011-06-09
    • US12814254
    • 2010-06-11
    • Eric W. WongBrian D. HuntRajay KumarChao Li
    • Eric W. WongBrian D. HuntRajay KumarChao Li
    • H01L21/338B82Y40/00
    • H01L51/0048B82Y10/00H01L51/0545H01L51/0558H01L51/105
    • Techniques are used to fabricate carbon nanotube devices. These techniques improve the selective removal of undesirable nanotubes such as metallic carbon nanotubes while leaving desirable nanotubes such as semiconducting carbon nanotubes. In a first technique, slot patterning is used to slice or break carbon nanotubes have a greater length than desired. By altering the width and spacing of the slotting, nanotubes have a certain length or greater can be removed. Once the lengths of nanotubes are confined to a certain or expected range, the electrical breakdown approach of removing nanotubes is more effective. In a second technique, a Schottky barrier is created at one electrode (e.g., drain or source). This Schottky barrier helps prevent the inadvertent removal the desirable nanotubes when using the electrical breakdown approach. The first and second techniques can be used individually or in combination with each other.
    • 技术用于制造碳纳米管器件。 这些技术改进了不需要的纳米管的选择性去除,例如金属碳纳米管,同时留下了期望的纳米管,如半导体碳纳米管。 在第一种技术中,狭缝图案化用于切割或断裂碳纳米管具有比期望更长的长度。 通过改变开槽的宽度和间距,可以去除纳米管的一定长度或更大。 一旦纳米管的长度被限制在一定或预期的范围内,去除纳米管的电击穿方法更有效。 在第二种技术中,在一个电极(例如漏极或源极)处产生肖特基势垒。 这种肖特基势垒有助于防止在使用电击穿方法时无意中去除所需的纳米管。 第一和第二技术可以单独使用或者彼此组合使用。