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1. 发明申请

US20220298010A1 SEMI-FINISHED PRODUCT OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE 有权
公开(公告)号：US20220298010A1
公开(公告)日：2022-09-22
申请号：US17535699
申请日：2021-11-26
申请人： Merry Electronics Co., Ltd.
发明人： Jen-Yi Chen , Yueh-Kang Lee , Kai-Yu Jiang
IPC分类号： B81C99/00
摘要： Provided is a semi-finished product of an electronic device, including a substrate, a sensing module, and a lid. The substrate has a first surface and a second surface opposite to each other. The sensing module is disposed on the first surface. The lid is disposed on the first surface and forms a first cavity together with the substrate. An electronic device is also provided.

2. 发明申请

US20210364346A1 VIBRATION SENSOR 有权
公开(公告)号：US20210364346A1
公开(公告)日：2021-11-25
申请号：US17444285
申请日：2021-08-03
申请人： MERRY ELECTRONICS CO., LTD.
发明人： Jen-Yi CHEN , Chao-Sen CHANG , Yueh-Kang LEE
IPC分类号： G01H11/06 , H04R19/04 , H04R7/04 , H05K1/02 , H05K5/04 , G01L19/00
摘要： A vibration sensor includes a circuit board, a spacer, a pressure sensing device and a housing. The spacer is located on the circuit board. The pressure sensing device is located on the spacer, and the circuit board, the spacer and the pressure sensing device jointly form a first chamber and an air gap. The housing is mounted on the circuit board to defining a third chamber along with the circuit board, wherein the air gap allows the first chamber venting to the third chamber.

3. 发明申请

US20140254851A1 MEMS MICROPHONE PACKAGING STRUCTURE 有权
标题翻译： MEMS麦克风包装结构
公开(公告)号：US20140254851A1
公开(公告)日：2014-09-11
申请号：US13790219
申请日：2013-03-08
申请人： MERRY ELECTRONICS CO., LTD.
发明人： Jen-Yi CHEN
IPC分类号： H04R1/04
CPC分类号： H04R1/04 , B81B2201/0257 , H01L29/84 , H01L2224/32145 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/16152 , H01L2924/181 , H04R19/005 , H04R2201/003 , H01L2924/00012 , H01L2924/00
摘要： The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.
摘要翻译：本发明提供了一种用于降低封装结构体积，降低制造成本和改善耐冲击性的MEMS麦克风封装结构。封装结构具有由控制芯片的凹部和MEMS麦克风芯片的深孔形成的大后腔。控制芯片设置在MEMS麦克风芯片上，用于保护MEMS麦克风芯片。塑料成型工艺可以应用在包装结构上。包装结构的基座上的多个垫片由密封剂或底漆保护，以防止在大气条件下的腐蚀。总之，本发明具有体积小，厚度薄的优点，而不降低性能，可以降低制造成本。

4. 发明申请

US20130320465A1 THIN MEMS MICROPHONE MODULE 审中-公开
标题翻译：微型MEMS麦克风模块
公开(公告)号：US20130320465A1
公开(公告)日：2013-12-05
申请号：US13483352
申请日：2012-05-30
申请人： Chao-Ching HUANG , Ju-Mei Lu , Hung-Jen Chen , Kuan-Hsun Chiu
发明人： Chao-Ching HUANG , Ju-Mei Lu , Hung-Jen Chen , Kuan-Hsun Chiu
IPC分类号： H01L29/84
CPC分类号： H04R1/04 , H04R19/005 , H04R2201/003
摘要： A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and a second ground layer of the second circuit board are electrically coupled to each other to define a ground shielding structure. By this way, an EMI shielding can be applied by the ground shielding structure to the MEMS chip and the ASIC chip.
摘要翻译： MEMS麦克风模块包括第一电路板和附接到第一电路板的第二电路板。 MEMS芯片和ASIC芯片分别被接收在第一电路板的两个凹部之一中。第一电路板的第一接地层和第二电路板的第二接地层彼此电耦合以限定接地屏蔽结构。通过这种方式，EMI屏蔽可以通过接地屏蔽结构施加到MEMS芯片和ASIC芯片。

5. 发明授权

US08532325B2 Earphone device with bass adjusting function 有权
标题翻译：耳机设备带低音调节功能
公开(公告)号：US08532325B2
公开(公告)日：2013-09-10
申请号：US12897225
申请日：2010-10-04
申请人： Chiu-Yun Tung , Fang-Chang Hsieh , Yuan-Hsing Wu , Chung-Yi Huang
发明人： Chiu-Yun Tung , Fang-Chang Hsieh , Yuan-Hsing Wu , Chung-Yi Huang
IPC分类号： H04R25/00
CPC分类号： H04R1/1016 , H04R1/2811
摘要： An earphone device with a bass adjusting function is provided. The earphone device includes an accommodating portion and an extension segment. The accommodating portion has an inner chamber for accommodating a speaker. The extension segment which is hollow-shaped and has a first space and a second space therein, and the first space is in communication with the inner chamber of the accommodating portion, and when a portion of the extension segment is adjusted from a first position to a second position, the first space, the second space, and the inner chamber of the accommodating portion are in communication, so as to increase a volume of the back chamber of the speaker.
摘要翻译：提供具有低音调节功能的耳机设备。耳机装置包括容纳部分和延伸段。容纳部分具有用于容纳扬声器的内室。所述延伸段是中空形的并且在其中具有第一空间和第二空间，并且所述第一空间与所述容纳部分的内室连通，并且当所述延伸段的一部分从第一位置调整到第二位置，容纳部分的第一空间，第二空间和内室是连通的，以便增加扬声器的后室的体积。

6. 发明授权

US08130995B2 Earpiece device with microphone 有权
标题翻译：带麦克风的耳机设备
公开(公告)号：US08130995B2
公开(公告)日：2012-03-06
申请号：US11946894
申请日：2007-11-29
申请人： Hong-Ching Her , Hung-Yue Chang , Ton-Kun Ho
发明人： Hong-Ching Her , Hung-Yue Chang , Ton-Kun Ho
IPC分类号： H04R25/00 , H04R1/10 , H04R3/00 , H03B29/00 , H04M1/00
CPC分类号： H04R1/1075 , H04R1/1016 , H04R25/04 , H04R25/604 , H04R25/656 , H04R2201/107
摘要： An earpiece device includes a housing having a sound output portion, a speaker and a microphone. The speaker disposed in the housing includes a diaphragm and a sound transmitting hole. The diaphragm is located between the sound output portion and the sound transmitting hole. The microphone is disposed in the housing and covers the sound transmitting hole. A sound wave generated within an ear canal would be received by the speaker and delivered through the sound transmitting hole to the microphone for pickup.
摘要翻译：听筒装置包括具有声音输出部分，扬声器和麦克风的壳体。设置在壳体中的扬声器包括隔膜和声音传递孔。隔膜位于声音输出部分和声音传播孔之间。麦克风设置在壳体中并覆盖声音传播孔。在耳道内产生的声波将被扬声器接收并通过声音传送孔传送到麦克风进行拾取。

7. 发明授权

US08103013B2 Acoustic transducer device 有权
标题翻译：声换能器装置
公开(公告)号：US08103013B2
公开(公告)日：2012-01-24
申请号：US12389114
申请日：2009-02-19
申请人： Po-Hsun Sung , Hong-Ching Her
发明人： Po-Hsun Sung , Hong-Ching Her
IPC分类号： H03B29/00
CPC分类号： G10K11/178 , G10K2210/1081
摘要： An acoustic transducer device is provided. The device includes a body, a speaker, a microphone, and a processor. The body has a cavity, a sound exit, and a sound entrance. The cavity interflows with the sound exit and accommodates the speaker. The microphone is disposed within the body beside the speaker. The microphone interflows selectively with the cavity or the sound entrance. The processor is electrically connected to the speaker and the microphone. When the microphone interflows with the cavity, the microphone receives a sound signal generated from the cavity and transmits the sound signal to the processor for cancelling noise in the cavity. When the microphone interflows with the sound exit, the microphone receives an external sound signal and transmits the external sound signal to the processor for cancelling noise from the external.
摘要翻译：提供了一种声学换能器装置。该装置包括主体，扬声器，麦克风和处理器。身体有一个空腔，一个声音出口和一个声音入口。空腔与声音出口相交并容纳扬声器。麦克风位于扬声器旁边的身体内。麦克风选择性地与空腔或声音入口交流。处理器电连接到扬声器和麦克风。当麦克风与空腔交流时，麦克风接收从空腔产生的声音信号，并将声音信号发送到处理器以消除空腔中的噪声。当麦克风与声音出口交错时，麦克风接收外部声音信号，并将外部声音信号发送到处理器，以从外部消除噪声。

8. 发明申请

US20090196454A1 EARPHONE SET 有权
标题翻译：耳机套
公开(公告)号：US20090196454A1
公开(公告)日：2009-08-06
申请号：US12023207
申请日：2008-01-31
申请人： Hong-Ching Her , Hung-Yue Chang , Ton-Kun Ho
发明人： Hong-Ching Her , Hung-Yue Chang , Ton-Kun Ho
IPC分类号： H04R25/00
CPC分类号： H04R25/00
摘要： An earphone set includes a main device having a digital signal processor, and an earplug has an external microphone and a speaker electrically connected with the digital signal processor respectively. The external microphone converts an external sound wave into an electronic signal and transmits the electronic signal to the digital signal processor for processing. The speaker converts the electronic signal processed by the digital signal processor into a sound wave for output.
摘要翻译：耳机组包括具有数字信号处理器的主设备，耳塞具有分别与数字信号处理器电连接的外部麦克风和扬声器。外部麦克风将外部声波转换为电子信号，并将电子信号发送到数字信号处理器进行处理。扬声器将由数字信号处理器处理的电子信号转换为声波输出。

9. 发明申请

US20070036387A1 Speaker with reduced height 审中-公开
标题翻译：扬声器降低高度
公开(公告)号：US20070036387A1
公开(公告)日：2007-02-15
申请号：US11237390
申请日：2005-09-28
申请人： Jui-Cheng Chang , Yan-Shueun Peng
发明人： Jui-Cheng Chang , Yan-Shueun Peng
IPC分类号： H04R9/06 , H04R11/02
CPC分类号： H04R1/06 , H04R9/06 , H04R2499/11
摘要： A speaker includes a body, a yoke, and two connectors. The body includes an outer periphery with a recessed section. The yoke is securely mounted around the body and engaged with the recessed section. Each connector includes a first end fixed to the yoke and a second end. Each connector is at a level not beyond an end face of the body when the speaker is in an assembled state. Thus, the speaker has a reduced height, which is particularly useful for electronic devices that have a trend in miniaturization.
摘要翻译：扬声器包括主体，磁轭和两个连接器。主体包括具有凹部的外周。轭被牢固地安装在主体周围并与凹进部分接合。每个连接器包括固定到轭的第一端和第二端。当扬声器处于组装状态时，每个连接器处于不超过身体端面的水平面上。因此，扬声器具有降低的高度，其对于具有小型化趋势的电子设备特别有用。

10. 发明申请

US20060215869A1 LOUD SPEAKER 有权
公开(公告)号：US20060215869A1
公开(公告)日：2006-09-28
申请号：US10907302
申请日：2005-03-28
申请人： Jui-Cheng Chang , Yu-Shen Yeh
发明人： Jui-Cheng Chang , Yu-Shen Yeh
IPC分类号： H04R1/02 , H04R1/00 , H04R9/06
CPC分类号： H04R1/06 , H04R1/025
摘要： A loud speaker includes a circuit board and a base. The circuit board includes a plurality of contacts on a side thereof. The base is formed of plastic material by injection molding. The base includes an insertion groove in an end thereof. The circuit board is embedded in the insertion groove. The base further includes a plurality of grooves in communication with the insertion groove. The grooves are respectively aligned with the contacts of the circuit board. The circuit board is placed in a mold for forming the base and the circuit board is embedded in the base after formation of the base by injection molding.
摘要翻译：扬声器包括电路板和底座。电路板在其一侧包括多个触点。底座由注塑成型的塑料制成。底座包括在其一端的插入槽。电路板嵌入插入槽。底座还包括与插入槽连通的多个凹槽。凹槽分别与电路板的触头对准。将电路板放置在用于形成基座的模具中，并且通过注射成型在基底形成之后将电路板嵌入基座中。

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