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1. 发明申请

US20230128723A1 METHOD FOR FABRICATING IMPRINT MASTER, THE IMPRINT MASTER, IMPRINT AND ARTICLE 有权
公开(公告)号：US20230128723A1
公开(公告)日：2023-04-27
申请号：US17906863
申请日：2021-03-17
申请人： Dexerials Corporation
发明人： Masanao KIKUCHI
IPC分类号： B81C99/00 , B29C33/42
摘要： A method for fabricating an imprint master 1 comprises a first forming step of forming micro-protrusion-and-recess structures 23 having a first average pitch on one surface of a substrate 10 and a second forming step of forming main recesses 21 or main protrusions 22 having a second average pitch larger than the first average pitch on the one surface of the substrate 10 having the micro-protrusion-and-recess structures 23 formed thereon, in a manner maintaining a shape of at least a portion of the micro-protrusion-and-recess structures 23 in the main recesses 21 or the main protrusions 22 while the main recesses 21 or the main protrusions 22 are being formed.

2. 发明申请

US20220361974A1 Pop-Up Laminate Structures with Integrated Electronics 有权
公开(公告)号：US20220361974A1
公开(公告)日：2022-11-17
申请号：US17866613
申请日：2022-07-18
申请人： President and Fellows of Harvard College
发明人： Joshua B. Gafford , Samuel B. Kesner , Conor J. Walsh , Michael Karpelson , Robert J. Wood , Zivthan Dubrovsky , Benjamin I. Goldberg , Kathleen O'Donnell , Michael J. Smith
IPC分类号： A61B34/00 , B81C99/00 , A61B18/14 , B81B7/00 , H05K1/02 , H05K1/18
摘要： A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

3. 发明申请

US20220332571A1 SEMICONDUCTOR REMOVING APPARATUS AND OPERATION METHOD THEREOF 有权
公开(公告)号：US20220332571A1
公开(公告)日：2022-10-20
申请号：US17709932
申请日：2022-03-31
申请人： XINTEC INC.
发明人： Yu-Tang SHEN , Shun-Wen LONG , Chih-Hung CHO , Hsing-Yuan CHU
IPC分类号： B81C99/00 , B32B43/00
摘要： An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

4. 发明申请

US20220324703A1 METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE SUBSTRATE 有权
公开(公告)号：US20220324703A1
公开(公告)日：2022-10-13
申请号：US17641559
申请日：2020-09-10
申请人： Federico RIBET , Miku BRODIN-LAAKSO , Simone PAGLIANO , Frank NIKLAUS , Niclas ROXHED , Göran STEMME
发明人： Federico RIBET , Miku BRODIN-LAAKSO , Simone PAGLIANO , Frank NIKLAUS , Niclas ROXHED , Göran STEMME
IPC分类号： B81C3/00 , B81C99/00
摘要： Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).

5. 发明授权

US11469131B2 Heterogeneous integration of components onto compact devices using moire based metrology and vacuum based pick-and-place 有权
公开(公告)号：US11469131B2
公开(公告)日：2022-10-11
申请号：US16472766
申请日：2017-12-22
申请人： Board of Regents, The University of Texas System
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , G06F30/392 , G06F30/398 , G06F30/396 , B81C99/00 , H01L23/544 , G06F117/10
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.

6. 发明授权

US11285308B2 Microstructure for transdermal absorption and method for manufacturing same 有权
公开(公告)号：US11285308B2
公开(公告)日：2022-03-29
申请号：US16064302
申请日：2016-12-22
申请人： ENDODERMA CO., LTD.
发明人： Jae Soo Kim , Soon Chang Kwon , Sang Jin Park
IPC分类号： A61M37/00 , C08L101/16 , B81C1/00 , C09J201/00 , B29C39/02 , A61K9/00 , A61K47/36 , A61K47/38 , B81B1/00 , B81C99/00 , C08B15/04 , C08B37/08 , C09J101/28 , C09J105/00 , B29L31/00
摘要： The present invention relates to a microstructure including a biocompatible polymer or an adhesive and to a method for manufacturing the same. The present inventors optimized the aspect ratio according to the type of each microstructure, thereby ensuring the optimal tip angle and the diameter range for skin penetration. Especially, the B-type to D-type microstructures of the present invention minimize the penetration resistance due to skin elasticity at the time of skin attachment, thereby increasing the penetration rate of the structures (60% or higher) and the absorption rate of useful ingredients into the skin. In addition, the D-type microstructure of the present invention maximizes the mechanical strength of the structure by applying a triple structure, and thus can easily penetrate the skin. When the plurality of microstructures are arranged in a hexagonal arrangement type, a uniform pressure can be transmitted to the whole microstructures on the skin.

7. 发明授权

US11254566B2 Preparation method of bionic adhesive material with tip-expanded microstructural array 有权
公开(公告)号：US11254566B2
公开(公告)日：2022-02-22
申请号：US17288536
申请日：2020-06-11
申请人： Nanjing University of Aeronautics and Astronautics , Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company
发明人： Zhendong Dai , Keju Ji , Enhua Cui , Jian Chen , Cong Yuan , Yiqiang Tang
IPC分类号： B81C1/00 , B29C33/38 , B81B1/00 , B81C99/00 , C09J109/00 , C09J133/08 , C09J183/04 , C25D7/00 , B29K83/00 , B29K105/00
摘要： A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

8. 发明授权

US11203523B2 Bionic SERS substrate with metal-based compound eye bowl structure and its construction method and application 有权
公开(公告)号：US11203523B2
公开(公告)日：2021-12-21
申请号：US17082878
申请日：2020-10-28
申请人： JIANGNAN UNIVERSITY
发明人： Gang Shi , Ying Li , Jianhua Li , Xuan Jin , Dawei Wang , Likui Wang , Jingguo Yang , Xinxin Sang , Caihua Ni
IPC分类号： B81B7/04 , B81C1/00 , B81C99/00 , B82Y30/00 , B82Y40/00 , C23C18/16 , C23C18/38 , C23C18/42 , G01N21/65 , G01N33/02
摘要： The present invention discloses a bionic SERS substrate of a metal-based compound eye bowl structure, a construction method and application. The bionic SERS substrate of the metal-based compound eye bowl structure of the present invention consists of a metal bowl and a cone-shaped structure substrate in an ordered hierarchy manner. The metal bowl is of a continuously and closely arranged single-layer bowl structure. A height of the metal bowl is 0.01-10 μm, and a bowl opening diameter is 0.01-10 μm. A cone is a micron pyramid cone, and a height of the micron pyramid cone is 1-100 μm. The present invention assembles the metal bowl on a surface of the substrate of the micron pyramid cone structure with great fluctuation by a solid-liquid interface chemical reduction method and a small ball template method, and further constructs a 3D SERS substrate with a bionic compound eye structure.

9. 发明授权

US11066296B1 Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits 有权
公开(公告)号：US11066296B1
公开(公告)日：2021-07-20
申请号：US16547239
申请日：2019-08-21
申请人： Iowa State University Research Foundation, Inc.
发明人： Metin Uz , Surya Mallapragada
IPC分类号： B81C1/00 , B81B3/00 , B81C99/00
摘要： This work develops a novel microfluidic method to fabricate conductive graphene-based 3D micro-electronic circuits on any solid substrate including, Teflon, Delrin, silicon wafer, glass, metal or biodegradable/non-biodegradable polymer-based, 3D microstructured, flexible films. It was demonstrated that this novel method can be universally applied to many different natural or synthetic polymer-based films or any other solid substrates with proper pattern to create graphene-based conductive electronic circuits. This approach also enables fabrication of 3D circuits of flexible electronic films or solid substrates. It is a green process preventing the need for expensive and harsh postprocessing requirements for other fabrication methods such as ink-jet printing or photolithography. We reported that it is possible to fill the pattern channels with different dimensions as low as 10×10 μm. The graphene nanoplatelet solution with a concentration of 60 mg/mL in 70% ethanol, pre-annealed at 75° C. for 3 h, provided ˜0.5-2 kOhm resistance. The filling of the pattern channels with this solution at a flow rate of 100 μL/min created a continuous conductive graphene pattern on flexible polymeric films. The amount of graphene used to coat 1 cm2 of area is estimated as ˜10 μg. A second method regarding the transfer of graphene material-based circuits with small features size (5 μm depth, 10 μm width) from any solid surface to flexible polymeric films via polymer solvent casting approach was demonstrated. This method is applicable to any natural/synthetic polymer and their respective organic/inorganic solvents.

10. 发明申请

US20210208187A1 ELECTRICAL TEST STRUCTURE AND METHOD FOR MONITORING DEEP TRENCH IMPEDANCE TO SUBSTRATE 有权
公开(公告)号：US20210208187A1
公开(公告)日：2021-07-08
申请号：US16737575
申请日：2020-01-08
申请人： Texas Instruments Incorporated
发明人： Thomas Edward Lillibridge , Neil L. Gardner
IPC分类号： G01R27/16 , B81B7/00 , H01L23/64 , B81C99/00 , B81C1/00 , H01L21/768
摘要： A microelectronic device includes a deep trench test structure in semiconductor material of a substrate. The deep trench test structure has pad trench segments with a liner of electrically non-conductive material and a trench fill material on the liner, extending to tops of the pad trench segments. The pad trench segments extend across a probe pad region; at least 20 microns in every lateral direction. The trench fill material at the top of the pad trench segments occupies at least 25 percent of the probe pad region. The liner may electrically isolate the trench fill material from the semiconductor material, or the deep trench test structure may include a contact trench segment wherein the trench fill material contacts the semiconductor material. The deep trench test structure may be probed on the pad trench segments to measure an impedance between the trench fill material and the semiconductor material.

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