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1. 发明授权

US10040681B2 Method and system for MEMS devices 有权
公开(公告)号：US10040681B2
公开(公告)日：2018-08-07
申请号：US12860655
申请日：2010-08-20
申请人： Hua-Shu Wu , Yu-Hao Chien , Shih-Yung Chung , Li-Tien Tseng , Yu-Te Yeh
发明人： Hua-Shu Wu , Yu-Hao Chien , Shih-Yung Chung , Li-Tien Tseng , Yu-Te Yeh
IPC分类号： H01L29/84 , B81C1/00
摘要： A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate.

2. 发明授权

US08754529B2 MEMS device with simplified electrical conducting paths 有权
标题翻译：具有简化导电路径的MEMS器件
公开(公告)号：US08754529B2
公开(公告)日：2014-06-17
申请号：US13401075
申请日：2012-02-21
申请人： Yu-Hao Chien , Hua-Shu Wu , Shih-Yung Chung , Li-Tien Tseng , Yu-Te Yeh
发明人： Yu-Hao Chien , Hua-Shu Wu , Shih-Yung Chung , Li-Tien Tseng , Yu-Te Yeh
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： B81C1/0023 , B81C1/00238 , H01L2924/0002 , H01L2924/00
摘要： A MEMS device comprises a substrate for manufacturing a moving MEMS component is divided into two electrically isolated conducting regions to allow the moving MEMS component and a circuit disposed on its surface to connect electrically with another substrate below respectively through their corresponding conducting regions, thereby the electrical conducting paths and manufacturing process can be simplified.
摘要翻译： MEMS器件包括用于制造移动的MEMS部件的基板被分成两个电绝缘的导电区域，以允许移动的MEMS部件和其表面上的电路分别通过其相应的导电区域与另一个基板电连接，可以简化导电路径和制造工艺。

3. 发明申请

US20120228727A1 METHOD AND STRUCTURE FOR FORMING A GYROSCOPE AND ACCELEROMETER 失效
标题翻译：形成陀螺仪和加速度计的方法和结构
公开(公告)号：US20120228727A1
公开(公告)日：2012-09-13
申请号：US13480351
申请日：2012-05-24
申请人： Dongmin Chen , Justin Payne , Li-Tien Tseng
发明人： Dongmin Chen , Justin Payne , Li-Tien Tseng
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： G01C19/5719 , B81B2201/0235 , B81B2201/0242 , B81C1/00238 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/0831
摘要： A method for fabricating a micro electromechanical device includes providing a first substrate including control circuitry. The first substrate has a top surface and a bottom surface. The method also includes forming an insulating layer on the top surface of the first substrate, removing a first portion of the insulating layer so as to form a plurality of standoff structures, and bonding a second substrate to the first substrate. The method further includes thinning the second substrate to a predetermined thickness and forming a plurality of trenches in the second substrate. Each of the plurality of trenches extends to the top surface of the first substrate. Moreover, the method includes filling at least a portion of each of the plurality of trenches with a conductive material, forming the micro electromechanical device in the second substrate, and bonding a third substrate to the second substrate.
摘要翻译：一种用于制造微机电装置的方法包括提供包括控制电路的第一基板。第一衬底具有顶表面和底表面。该方法还包括在第一衬底的顶表面上形成绝缘层，去除绝缘层的第一部分以形成多个间隔结构，并将第二衬底接合到第一衬底。该方法还包括将第二衬底稀薄至预定厚度，并在第二衬底中形成多个沟槽。多个沟槽中的每一个延伸到第一衬底的顶表面。此外，该方法包括用导电材料填充多个沟槽中的每一个的至少一部分，在第二衬底中形成微机电器件，以及将第三衬底接合到第二衬底。

4. 发明申请

US20120171623A1 FABRICATION OF A HIGH FILL RATIO SILICON SPATIAL LIGHT MODULATOR 有权
标题翻译：高比例硅太阳能光调制器的制造
公开(公告)号：US20120171623A1
公开(公告)日：2012-07-05
申请号：US13418186
申请日：2012-03-12
申请人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , Howard Woo
发明人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , Howard Woo
IPC分类号： B05D5/06 , G03F7/20 , B05D5/12
CPC分类号： G02B26/0841
摘要： A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
摘要翻译：一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。

5. 发明授权

US08159740B2 Fabrication of a high fill ratio silicon spatial light modulator 有权
标题翻译：高填充率硅空间光调制器的制造
公开(公告)号：US08159740B2
公开(公告)日：2012-04-17
申请号：US12690878
申请日：2010-01-20
申请人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , Howard Woo
发明人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , Howard Woo
IPC分类号： G02B26/08 , G02B26/00 , G02F1/29
CPC分类号： G02B26/0841
摘要： A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
摘要翻译：一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。

6. 发明申请

US20110111544A1 MEMS MIRROR SYSTEM FOR LASER PRINTING APPLICATIONS 有权
标题翻译：用于激光打印应用的MEMS镜面系统
公开(公告)号：US20110111544A1
公开(公告)日：2011-05-12
申请号：US13009964
申请日：2011-01-20
申请人： Xiao Yang , William Spencer Worley, III , Dongmin Chen , Ye Wang
发明人： Xiao Yang , William Spencer Worley, III , Dongmin Chen , Ye Wang
IPC分类号： H01L21/02
CPC分类号： G02B26/0841 , B41J2/471 , G02B26/105
摘要： A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.
摘要翻译：用于激光打印应用的MEMS镜包括提供包括一对电极的CMOS衬底，以及提供可移动到衬底和电极上的反射镜。施加到电极的电压产生静电力，导致反射镜的一端被吸引到基板。可以通过感测镜端和底层电极之间的电容变化来检测和控制反射镜的精确位置。

7. 发明授权

US07671461B2 Method and system for hermetically sealing packages for optics 有权
标题翻译：用于光学封装封装的方法和系统
公开(公告)号：US07671461B2
公开(公告)日：2010-03-02
申请号：US11560784
申请日：2006-11-16
申请人： Xiao Yang , Dongmin Chen
发明人： Xiao Yang , Dongmin Chen
IPC分类号： H01L23/22
CPC分类号： H01L21/50 , G02B26/0833 , H01L27/14618 , H01L27/14621 , H01L31/0203 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/01021 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/1461 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T156/1092 , Y10T156/1093 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A system for hermetically sealing devices. The system includes a substrate, which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The system also includes a transparent member of a predetermined thickness, which includes a plurality of recessed regions arranged in a spatial manner as a second array and each of the recessed regions are bordered by a standoff region. The substrate and the transparent member are aligned in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. Each of the chips within one of the respective recessed regions is hermetically sealed by contacting the standoff region of the transparent member to the plurality of first street regions and second street regions using at least a bonding process to isolate each of the chips within one of the recessed regions.
摘要翻译：一种密封装置的系统。该系统包括基板，其包括多个独立的芯片。每个芯片包括多个器件，并且每个芯片以空间方式布置为第一阵列。该系统还包括预定厚度的透明构件，其包括以空间方式布置为第二阵列的多个凹陷区域，并且每个凹陷区域由分隔区域界定。衬底和透明构件以将多个凹陷区域中的每一个耦合到所述多个芯片中的相应一个芯片的方式排列。通过使用至少粘合工艺将透明构件的支架区域与多个第一街道区域和第二街道区域接触来隔离各个凹陷区域之一内的每个芯片，凹陷区域。

8. 发明授权

US07453624B2 Projection display system including a high fill ratio silicon spatial light modulator 有权
标题翻译：投影显示系统包括高填充率硅空间光调制器
公开(公告)号：US07453624B2
公开(公告)日：2008-11-18
申请号：US11448537
申请日：2006-06-05
申请人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , William Spencer Worley, III , Dongmin Chen , Howard Woo
发明人： Xiao Yang , Yuxiang Wang , Wook Ji , Justin Allen Payne , Ye Wang , William Spencer Worley, III , Dongmin Chen , Howard Woo
IPC分类号： G02B26/00
CPC分类号： G02B26/0841
摘要： A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.
摘要翻译：显示系统包括光源和耦合到光源并适于沿照明路径提供照明光束的第一光学系统。显示系统还包括位于照明路径中的空间光调制器。空间光调制器包括包括多个电极器件和耦合到半导体衬底的铰链结构的半导体衬底。铰链结构包括硅材料。空间光调制器还包括耦合到铰链结构并且延伸到半导体衬底预定距离的镜柱和耦合到镜柱并且覆盖多个电极器件的镜板。显示系统还包括耦合到空间光调制器并适于将图像投影到投影表面上的第二光学系统。

9. 发明授权

US07449284B2 Method and structure for fabricating mechanical mirror structures using backside alignment techniques 有权
标题翻译：使用背面对准技术制造机械镜面结构的方法和结构
公开(公告)号：US07449284B2
公开(公告)日：2008-11-11
申请号：US10843909
申请日：2004-05-11
申请人： Xiao Charles Yang
发明人： Xiao Charles Yang
IPC分类号： G03F7/00
CPC分类号： B81C1/00484 , B81C2203/036 , B81C2203/051
摘要： A method for fabricating mechanical structures from bonding substrates. The method includes providing a bonded substrate structure, which includes a first substrate having a first thickness of silicon material and a first face. The bonded substrate also includes a second substrate having a second thickness and a second face. At least the first substrate or at least the second substrate (or both) has an alignment mark comprising a front-size zero mark within a portion of either the first thickness or the second thickness. The method includes applying a layer of photomasking material overlying a first backside surface of the first substrate. The method includes illuminating electromagnetic radiation using a coherent light source through the layer of photoresist material and through a portion of the first thickness. The method includes detecting an indication of the alignment mark using a signal associated with a portion of the electromagnetic radiation from a second backside of the second substrate. The method also includes exposing a portion of the layer of photomasking material once a pattern a portion of a reticle structure has been aligned using the alignment mark.
摘要翻译：一种从接合基板制造机械结构的方法。该方法包括提供键合衬底结构，其包括具有第一厚度的硅材料和第一面的第一衬底。键合衬底还包括具有第二厚度和第二面的第二衬底。至少第一基板或至少第二基板（或两者）具有在第一厚度或第二厚度的一部分内包括前尺寸零标记的对准标记。该方法包括施加覆盖在第一衬底的第一背面上的光掩模材料层。该方法包括使用相干光源穿过光致抗蚀剂材料层并通过第一厚度的一部分来照射电磁辐射。该方法包括使用与来自第二基板的第二背面的电磁辐射的一部分相关联的信号来检测对准标记的指示。该方法还包括使用对准标记将掩模版结构的一部分的图案一旦曝光一部分光掩模材料层。

10. 发明申请

US20080211043A1 METHOD AND SYSTEM FOR FLIP CHIP PACKAGING OF MICRO-MIRROR DEVICES 有权
标题翻译：用于微镜装置的芯片包装的方法和系统
公开(公告)号：US20080211043A1
公开(公告)日：2008-09-04
申请号：US12039550
申请日：2008-02-28
申请人： Dongmin Chen
发明人： Dongmin Chen
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81B7/0067 , B81C2203/0118 , H01L24/81 , H01L27/14618 , H01L27/14627 , H01L27/14634 , H01L27/14687 , H01L31/0203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01322 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A package for a micro-electromechanical device includes a substrate adapted to support the micro-electromechanical device. The micro-electromechanical device is electrically coupled to a plurality of electrodes. The package also includes a thermally conductive structure coupled to the substrate, an electrical contact layer having a plurality of traces in electrical communication with the plurality of electrodes, and an interposer structure coupled to the substrate. The interposer structure includes a continuous annular region defining a recessed region bounded by a bond surface. The package further includes a transparent cover coupled to the interposer structure and sealing the micro-electromechanical device in the recessed region to isolate the micro-electromechanical device in a controlled environment.
摘要翻译：用于微机电装置的封装包括适于支撑微机电装置的基板。微机电器件电耦合到多个电极。封装还包括耦合到衬底的导热结构，具有与多个电极电连通的多个迹线的电接触层，以及耦合到衬底的插入器结构。插入器结构包括限定由接合表面限定的凹陷区域的连续环形区域。该封装还包括耦合到插入器结构的透明盖，并且将微机电装置密封在凹陷区域中以在受控环境中隔离微机电装置。

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