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    • 4. 发明授权
    • Planar avalanche photodiode
    • 平面雪崩光电二极管
    • US07348607B2
    • 2008-03-25
    • US10502110
    • 2003-02-03
    • Cheng C. KoBarry Levine
    • Cheng C. KoBarry Levine
    • H01L29/732
    • H01L31/1075H01L31/035281Y02E10/50
    • The present invention includes a planar avalanche photodiode having a first n-type semiconductor layer defining a planar contact area, and a second n-type semiconductor layer having a p-type diffusion region. Further features of the structure includes an n-type semiconductor multiplication layer, an n-type semiconductor absorption layer, and a p-type contact layer. Further embodiments include a planar avalanche photodiode having a first n-type semiconductor layer defining a planar contact area, an n-type semiconductor multiplication layer, an n-type semiconductor absorption layer and a p-type semiconductor layer electrically coupled to a p-type contact layer.
    • 本发明包括具有限定平面接触面积的第一n型半导体层的平面雪崩光电二极管和具有p型扩散区域的第二n型半导体层。 该结构的其它特征包括n型半导体倍增层,n型半导体吸收层和p型接触层。 另外的实施例包括具有限定平面接触面积的第一n型半导体层的平面雪崩光电二极管,n型半导体倍增层,n型半导体吸收层和与p型电耦合的p型半导体层 接触层。
    • 5. 发明授权
    • Precision fiber attachment
    • 精密纤维附件
    • US07263266B2
    • 2007-08-28
    • US10538248
    • 2003-12-10
    • Steven L. Williamson
    • Steven L. Williamson
    • G02B6/00
    • G02B6/4238G02B6/3628
    • This invention is directed to a fiber attachment including a hot pad and solder glass that attaches an optical fiber to the hot pad. The attached is formed by positioning the optical fiber over the hot pad and aligning the optical fiber. The optical fiber is then raised and solder glass preforms are positioned on the hot pad. Heat is applied to the glass preforms such that they melt. Once the preforms are melted, the optical fiber is lowered into the molten solder glass. The current is then removed and the solder glass solidifies as it cools to form an attachment between the optical fiber and the hot pad.
    • 本发明涉及一种光纤附件,其包括将光纤连接到热垫上的热焊盘和焊料玻璃。 通过将光纤定位在热垫上并对准光纤而形成附接。 然后将光纤升起,将焊接玻璃预制件放置在热垫上。 将热量施加到玻璃预制件上使得它们熔化。 一旦预成型件熔化,则将光纤降低到熔融的焊料玻璃中。 然后去除电流,并且焊料玻璃在其冷却时固化以形成光纤和热垫之间的附接。