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1. 发明授权

US11551948B2 Semiconductor manufacturing apparatus 有权
公开(公告)号：US11551948B2
公开(公告)日：2023-01-10
申请号：US16637639
申请日：2018-08-09
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Feibiao Chen , Song Guo
IPC分类号： G11C11/00 , H01L21/67 , B29C45/14 , B29C65/48 , H01L21/677 , H01L21/683 , G11C5/04 , B29L31/34
摘要： A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

2. 发明授权

US11549891B2 Automatic optical inspection device and method 有权
公开(公告)号：US11549891B2
公开(公告)日：2023-01-10
申请号：US16306433
申请日：2017-07-31
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Hailiang Lu , Junwei Jia , Pengli Zhang , Hongji Zhou , Wen Xu , Fan Wang
IPC分类号： G01N21/88 , G01N21/01
摘要： An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122). The synchronization controller (140) is configured to directly or indirectly control the plurality of detectors (111, 112) and the plurality of light sources (121, 122) based on the position of the OUI (102) so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors (111, 112) is able to capture images of the OUI (102) in an illumination mode provided by a corresponding one of the light sources (121, 122), and that when any one of the light sources (121, 122) is illuminating the OUI (102), only the one of the detectors (111, 112) corresponding to this light source (121, 122) is activated. Through the timing control over the multiple light sources (121, 122) and detectors (111, 112) by the synchronization controller (140), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.

3. 发明授权

US11469121B2 Spin coating device and method 有权
公开(公告)号：US11469121B2
公开(公告)日：2022-10-11
申请号：US16618309
申请日：2018-05-25
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Shiliang Lu , Hang Ran , Yihui Li , Xiaoping Yan , Jun Zhao , Shanshan Chen
IPC分类号： H01L21/67 , H01L21/68 , H01L21/687
摘要： A spin coating device and method. The spin coating device includes a rotatable rotary shaft and sucker fixed on an end portion of the shaft, and an electromagnetic induction device below the sucker which includes an annular magnet fixed below the sucker, coil group formed by a first and second coil, and strip-shaped magnet fixed at the rotary shaft. A base on the sucker has a notch. The unbalanced centrifugal force during rotation of the sucker causes vibration. The electromagnetic induction device enables the centrifugal force generated during rotation of the sucker to be in balance with the magnetic force generated by the electromagnetic induction device to adjust the levelness of the sucker surface. The device does not need manual manipulation, enables the sucker to be more stable, reduces damage to the equipment due to vibration, and improves the effect of photoresist spin-coating while saving time and labor.

4. 发明授权

US10971380B2 De-bonding leveling device and de-bonding method 有权
公开(公告)号：US10971380B2
公开(公告)日：2021-04-06
申请号：US16321682
申请日：2017-07-27
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Yuying Gao , Wei Wei
IPC分类号： B32B43/00 , H01L21/67 , B32B38/10
摘要： A debonding leveling device and a debonding method are for leveling during a process for debonding a first object and a second object. The first and second objects are retained by a first fixation plate (11) and a second fixation plate (21), respectively. The device includes: a mounting plate (30), disposed at an outer side of one of the first (11) and second (21) fixation plates; a connecting rod assembly (40) fixed around a center position of the mounting plate (30), the connecting rod assembly (40) connected to the one of the first (11) and second (21) fixation plates sequentially via a sliding pair (50) and a spherical pair (60) connected to the sliding pair (50); and at least three elastic assemblies (70) disposed between the mounting plate and the one of the first and second fixation plates, each of the elastic assemblies coupled to the mounting plate (30) and the one of the first (11) and second (21) fixation plates. The combination of the spherical pair and the sliding pair allows an adaptation of leveling objects to dynamic changes of the reference, and the elastic assemblies performs a leveling for the leveling objects in real-time based on an orientation of the reference. This entails a simple structure with a reasonable layout, which is easy to use in practice and is particularly helping in dynamic leveling applications without requiring an active control.

5. 发明授权

US10915030B2 Light-spot distribution structure, surface shape measurement method, and method for calculating exposure field-of-view control value 有权
公开(公告)号：US10915030B2
公开(公告)日：2021-02-09
申请号：US16071943
申请日：2017-01-19
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Zhenhui Wang
IPC分类号： G03F7/20 , G03F9/00
摘要： A light spot arrangement, a surface profile measuring method and a method for calculating control data for an exposure field are disclosed. The light spot arrangement includes a plurality of measuring light spots (100) which define at least one set of orthogonal line segments, wherein the measuring light spots (100) lying on the orthogonal line segments radiate outward from a center, with each of the orthogonal line segments defined by at least four measuring light spots. With this light spot arrangement comprising at least one set of orthogonal line segments defined by measuring light spots radiating outward from a center, readings of multiple ones of the light spots (100) can be acquired in real time, and exposure can be performed with real-time focusing and leveling based on a surface profile of the wafer (200) derived from a surface fitting process carried out on the readings.

6. 发明授权

US10907952B2 Optical measurement device and method with improved measurement precision 有权
公开(公告)号：US10907952B2
公开(公告)日：2021-02-02
申请号：US16338636
申请日：2017-09-25
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Yuzhi Li , Bing Xu , Zhiyong Yang , Chang Zhou
IPC分类号： G01B11/00 , G03F7/20 , G01N21/956 , H01L21/68
摘要： An optical measurement device and method are disclosed. A position measurement device is provided with a device for measuring inclinations of an optical detection module (5) and a substrate carrier (6) which are measured during movement of the optical detection unit and the substrate carrier. Calculation and correction can be made according to the inclination data and with reference to displacements of the optical detection module (5) and the substrate carrier (6) and coordinates of their positions. During measurement for a certain point on the substrate, measured data related to the point is corrected by using the device and the method, which improves measurement precision, thus eliminating a large error caused in measurement for a large-sized substrate (9).

7. 发明授权

US10658327B1 Chip bonding apparatus and bonding method 有权
公开(公告)号：US10658327B1
公开(公告)日：2020-05-19
申请号：US16338260
申请日：2017-09-26
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Tianming Wang , Xiaoyu Jiang , Hai Xia , Feibiao Chen
IPC分类号： H01L23/00
摘要： Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (10); a substrate supply unit (20); a first pick-up assembly (30) arranged between the chip supply unit (10) and the substrate supply unit (20), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly (40) comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly (30) picks up a chip (60) from the chip supply unit (10) or the second pick-up assembly (40), and delivers the chip (60) onto a substrate of the substrate supply unit (20) to complete the bonding; and a vision unit (50) for realizing the alignment of the chip (60) and the substrate on the first pick-up assembly (30), wherein the chip supply unit (10), the substrate supply unit (20), the second pick-up assembly (40) and the vision unit (50) are respectively located on four work positions of the first pick-up head. The chip (60) is transported through rotation, improving the productivity of chip (60) bonding; and the chip (60) is reversed by utilizing the second pick-up assembly (40), which is compatible with two ways of bonding, i.e. a mark face of the chip (60) facing upwards and downwards.

8. 发明授权

US10423072B2 Exposure apparatus and method 有权
公开(公告)号：US10423072B2
公开(公告)日：2019-09-24
申请号：US15744577
申请日：2016-07-13
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Renbiao Xie , Zhiyong Yang , Angli Bai , Jian Wang
IPC分类号： G03F7/20 , G02B27/09 , H01L33/00 , H01L21/027 , H01L21/67 , H01L21/68
摘要： An exposure apparatus includes an exposure unit for exposing a wafer. The exposure unit includes an illumination system and masks. The illumination system includes a light-homogenizing unit. The light-homogenizing unit includes a light-homogenizing quartz rod having a regular hexagonal cross section. Each of the masks has a regular hexagonal shape matching with the cross section of the light-homogenizing quartz rod. A field of exposure resulting from this arrangement is less affected by objective field of view distortion and allows a higher useful depth of focus (UDoF) when compared to other fields of exposure of the same size. In addition, with the same projection objective DoF, a greater field of exposure can be obtained.

9. 发明授权

US10416568B2 Light intensity modulation method 有权
公开(公告)号：US10416568B2
公开(公告)日：2019-09-17
申请号：US16090032
申请日：2017-03-30
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Pengchuan Ma , Yiqiang Tian
IPC分类号： G03F7/20
摘要： A light intensity modulation method implemented by using a mask (101) includes the steps of: 1) based on a circle of confusion (CoC) function of an illumination system (102), an initial light intensity distribution of an illumination field of view (FOV) and a target light intensity distribution of the illumination FOV, calculating a transmittance distribution of the mask (101) used to modulate the initial light intensity distribution into the target light intensity distribution; 2) meshing the mask (101) according to a desired accuracy of the target light intensity distribution and determining a distribution of opaque dots in each of cells resulting from the meshing based on the transmittance distribution of the mask (101) and a desired accuracy of the transmittance distribution; and 3) fabricating the mask (101) based on the determined distribution of the opaque dots and then deploying the mask (101) in the illumination system. Advantages including a high modulation accuracy, an applicability to wide FOV size, light intensity and wavelength ranges and compatibility with established manufacturing processes can be attained.

10. 发明授权

US10345247B2 Apparatus for detecting degree of particulate contamination on flat panel 有权
公开(公告)号：US10345247B2
公开(公告)日：2019-07-09
申请号：US15907736
申请日：2018-02-28
申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
发明人： Yongqiang Shen , Xiaoqing Yang , Xueshan Han
IPC分类号： G01N21/88 , G01N21/94 , G01N21/95 , G01N21/956
摘要： An apparatus for detecting a degree of particulate contamination on a flat panel is disclosed, including: an illuminator for producing a radiation beam which results in scattered radiation from its scattering by contaminants on a surface of the flat panel under test and reflected radiation from its reflection by the surface of the flat panel under test; a detector for collecting the scattered radiation, the detector having a radiation collection surface perpendicular to a normal of the surface of the flat panel under test; and a beam trimmer for separating the reflected radiation from the scattered radiation, the beam trimmer including a first optical member, disposed in correspondence with the scattered radiation and configured for directing the scattered radiation to be collected by the detector, and a second optical member disposed in correspondence with the reflected radiation and configured for directing the reflected radiation not to be collected by the detector.

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