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    • 9. 发明申请
    • ACOUSTIC WAVE DEVICE AND METHOD OF FABRICATING THE SAME
    • 声波装置及其制造方法
    • US20140354114A1
    • 2014-12-04
    • US14290746
    • 2014-05-29
    • TAIYO YUDEN CO., LTD.
    • Akira MORIYAOsamu KAWACHI
    • H03H9/10H03H3/02B06B1/06
    • B06B1/0662H03H3/08H03H9/0547H03H9/1071Y10T29/42
    • An acoustic wave device includes: a support substrate; a piezoelectric substrate; and a cap substrate, wherein the cap substrate includes a first region located along an outer peripheral portion of the cap substrate, a second region located along an inside of the first region and having a thickness less than a thickness of the first region, and a third region located inside the second region and having a thickness less than a thickness of the second region, and a surface of the first region is bonded to the surface of the outer peripheral portion of the support substrate, a surface of the second region is bonded to a surface of an outer peripheral portion of the piezoelectric substrate, and a surface of the third region is located away from a surface of the piezoelectric substrate to form a space for the excitation electrode to vibrate.
    • 声波装置包括:支撑基板; 压电基板; 以及盖基板,其中所述盖基板包括沿着所述盖基板的外周部分定位的第一区域,沿着所述第一区域的内侧设置并且具有小于所述第一区域的厚度的厚度的第二区域,以及 第三区域,其位于第二区域的内部,其厚度小于第二区域的厚度,第一区域的表面接合到支撑基板的外周部的表面,第二区域的表面被接合 到压电基板的外周部的表面,并且第三区域的表面位于远离压电基板的表面的位置,以形成用于激发电极振动的空间。