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1. 发明申请

US20180142060A1 BIODEGRADABLE POLYESTER COMPOSITION 审中-公开
公开(公告)号：US20180142060A1
公开(公告)日：2018-05-24
申请号：US15578249
申请日：2016-12-15
申请人： Hongmei YANG
发明人： Changli LU , Zhimin YUAN , Tongmin CAI , Xianbo HUANG , Xiangbin ZENG , Jian JIAO , Renxu YUAN , Yuke ZHONG , Kai XIONG , Hui YANG , Kaijin MAI , Xueteng DONG
IPC分类号： C08G63/183 , C08G63/06 , C08L67/02 , C08L67/04 , C08K3/04 , C08L3/04
CPC分类号： C08G63/183 , C08G63/06 , C08K3/04 , C08K3/26 , C08K3/34 , C08K5/07 , C08K5/11 , C08K5/20 , C08K13/02 , C08L3/02 , C08L3/04 , C08L63/00 , C08L67/02 , C08L67/04 , C08L2201/06 , C08L2205/02 , C08L2205/03 , C08L33/068 , C08K3/013 , C08L97/02 , C08K3/36
摘要： A biodegradable polyester composition based on a total weight of the biodegradable polyester composition, including a weight content of cyclopentanone which is 0.5 ppm-85 ppm is provided. The cyclopentanone is added into the composition and controlling the content of cyclopentanone in the composition within a range of 0.5 ppm-85 ppm to realize a lubrication degree of a film of biodegradable polyester during a blow molding process. When a velocity of film blowing is 176 Kg/h, a range of a film thickness is less than 0.2 μm and a relative deviation of the film thickness is less than 1%.

2. 发明授权

US09920198B2 Durable high performance heat resistant polycarbonate (PC) and polylactide (PLA) blends and compositions and methods of making those 有权
公开(公告)号：US09920198B2
公开(公告)日：2018-03-20
申请号：US15148704
申请日：2016-05-06
申请人： University of Guelph
发明人： Amar K. Mohanty , Yury Yuryev , Manjusri Misra
IPC分类号： C08L69/00 , C08K3/26
CPC分类号： C08L69/00 , C08K3/013 , C08K3/26 , C08K3/34 , C08K3/346 , C08K7/14 , C08K9/04 , C08K2003/265 , C08L23/0884 , C08L33/068 , C08L33/08 , C08L67/04 , C08L67/02 , C08K3/0033
摘要： A polycarbonate (PC) and poly(lactic acid) (PLA) blend comprising (a) Bisphenol A PC, (b) PLA, (c) a chain extender, and (d) a glycidyl methacrylate (GMA) functionalized polyolefin copolymer/terpolymer and method of manufacturing the PC and PLA blend, including blending (i) Bisphenol A PC, (ii) PLA, (iii) a chain extender, and (iv) a glycidyl methacrylate (GMA) functionalized polyolefin copolymer/terpolymer at an elevated temperature, wherein the elevated temperature is between about 250 and 300° C.

3. 发明授权

US09834708B2 Adhesive composition for polarizing plate, adhesive film for polarizing plate comprising the same, polarizing plate comprising the same and display device comprising the same 有权
公开(公告)号：US09834708B2
公开(公告)日：2017-12-05
申请号：US14326173
申请日：2014-07-08
申请人： SAMSUNG SDI CO., LTD.
发明人： Tatsuhiro Suwa , Hiroshi Ogawa
IPC分类号： C08F2/46 , C08G61/04 , C09J133/14 , C09J163/00 , C09J4/06 , C09J133/06 , C08F2/48 , C08F220/20
CPC分类号： C09J133/14 , C08F2/48 , C08F220/20 , C08L33/068 , C08L63/00 , C09J4/06 , C09J133/068 , C09J163/00 , Y10T428/31515
摘要： An adhesive composition for a polarizing plate has good initial curing and an adhesive property. The adhesive composition includes (A) a polymerizable functional group-containing monomer capable of providing an anchor effect; (B) an epoxy group-containing compound; (D) a photoacid generator; and (E) at least one of a photopolymerization initiator and a photosensitizer.

4. 发明申请

US20170218198A1 POLYCARBONATE RESIN COMPOSITION AND OPTICAL MOLDED PRODUCT COMPRISING THE SAME 审中-公开
公开(公告)号：US20170218198A1
公开(公告)日：2017-08-03
申请号：US15501098
申请日：2016-03-31
申请人： LG CHEM, LTD.
发明人： Hyong Min BAHN , Byoung Kyu CHUN , Un KO , Moo Ho HONG , Young Young HWANG , Min Jeong KIM , Jung Jun PARK , Ki Jae LEE , Young Wook SON
IPC分类号： C08L69/00 , G02B1/04 , F21V8/00
CPC分类号： C08L69/00 , C08G65/20 , C08L33/02 , C08L63/10 , C08L71/02 , C08L2205/03 , G02B1/045 , G02B6/0065 , G02B6/10 , C08L33/068
摘要： The present invention relates to a polycarbonate resin composition and an optical molded product comprising the same. The polycarbonate resin composition according to the present invention is excellent in transmittance and color uniformity which are required for a light guide plate, and also excellent in processability. Thus, it can be effectively used as a material of the light guide plate.

5. 发明授权

US09659763B2 Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device 有权
公开(公告)号：US09659763B2
公开(公告)日：2017-05-23
申请号：US12989353
申请日：2009-04-24
申请人： Hyun Jee Yoo , Dong Han Kho , Jang Soon Kim , Hyo Soon Park , Jong Wan Hong , Hyo Sook Joo
发明人： Hyun Jee Yoo , Dong Han Kho , Jang Soon Kim , Hyo Soon Park , Jong Wan Hong , Hyo Sook Joo
IPC分类号： C09J163/00 , C09J7/02 , C09J5/06 , C08L33/00 , C08L61/06 , C08L61/12 , C08L61/20 , C08L63/00 , H01L21/02 , C08G59/62 , H01L21/683 , C08L33/06
CPC分类号： H01L21/02002 , C08G59/621 , C08K5/13 , C08L33/066 , C08L33/068 , C08L61/06 , C08L61/12 , C08L61/20 , C08L63/00 , C08L2666/02 , C09J5/06 , C09J7/20 , C09J133/066 , C09J133/068 , C09J163/00 , C09J2201/36 , C09J2201/60 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01L21/6836 , Y10T428/269 , Y10T428/287 , Y10T428/2891 , Y10T428/31515
摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

6. 发明授权

US09512310B2 Polyvinyl acetal-based resin composition 有权
标题翻译：聚乙烯醇缩醛类树脂组合物
公开(公告)号：US09512310B2
公开(公告)日：2016-12-06
申请号：US14431324
申请日：2013-09-20
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Yasuharu Nagai , Kaoru Mikayama
IPC分类号： C08F2/44 , C08F261/12 , C08L29/14 , C08L33/04 , C08L33/14
CPC分类号： C08L33/14 , C08F261/12 , C08L29/14 , C08L2205/22 , C08L33/06 , C08L51/003 , C08L33/068 , C08F220/18
摘要： The present invention provides a polyvinyl acetal resin composition exerting excellent mechanical strength over a wide temperature range from low temperatures to high temperatures. The present invention provides a polyvinyl acetal resin composition containing a polyvinyl acetal resin and a resin having a crosslinked structure, the polyvinyl acetal resin composition having a structure in which the resin having a crosslinked structure is dispersed as a dispersed phase in the polyvinyl acetal resin as a continuous phase, the polyvinyl acetal resin composition having a maximum value of a loss tangent derived from the polyvinyl acetal resin at 40° C. or higher and a maximum value of a loss tangent derived from the resin having a crosslinked structure at 10° C. or lower in measurement of a dynamic viscoelasticity spectrum at a frequency of 10 Hz.
摘要翻译：本发明提供一种在低温至高温的宽温度范围内具有优异的机械强度的聚乙烯醇缩醛树脂组合物。本发明提供含有聚乙烯醇缩醛树脂和具有交联结构的树脂的聚乙烯醇缩醛树脂组合物，所述聚乙烯醇缩醛树脂组合物具有将具有交联结构的树脂作为分散相分散在聚乙烯醇缩醛树脂中的结构，连续相，聚乙烯醇缩醛树脂组合物在40℃以上具有衍生自聚乙烯醇缩醛树脂的损耗角正切的最大值和由10℃下具有交联结构的树脂衍生的损耗角正切的最大值或更低的在10Hz的频率下的动态粘弹性谱的测量。

7. 发明申请

US20160319137A1 ELECTRICALLY CONDUCTIVE POLYMER DISPERSION AND ELECTRICALLY CONDUCTIVE COATING FILM 有权
标题翻译：电导电聚合物分散和电导电涂膜
公开(公告)号：US20160319137A1
公开(公告)日：2016-11-03
申请号：US15108749
申请日：2015-01-09
申请人： SHIN-ETSU POLYMER CO., LTD.
发明人： Sou Matsubayashi , Norimasa Shinada , Kazuyoshi Yoshida
IPC分类号： C09D5/24 , H01B1/12 , C09D133/06 , C09D181/02 , C09D167/02
CPC分类号： C09D5/24 , C08G2261/1424 , C08G2261/3223 , C08G2261/794 , C08L65/00 , C08L2203/206 , C09D7/40 , C09D7/63 , C09D133/068 , C09D167/02 , C09D181/02 , C09D201/00 , H01B1/124 , H01B1/127 , H01B1/128 , C08L25/18 , C08L33/068 , C08L67/04
摘要： A conductive polymer dispersion is provided which is capable of easily forming a conductive coating film having both excellent water resistance and excellent solvent resistance.The conductive polymer dispersion of the present invention includes a π-conjugated conductive polymer, a polyanion, a polyester resin having an alkali metal salt of an acid group, and a glycidyl group-containing acrylic resin. In the conductive polymer dispersion, the ratio (α/β) of total mass α of the polyester resin and the glycidyl group-containing acrylic resin to total mass β of the π-conjugated conductive polymer and the polyanion is in a range of 6.90 to 62.5.
摘要翻译：本发明的导电性聚合物分散体包括π共轭导电性聚合物，聚阴离子，具有酸基的碱金属盐的聚酯树脂和含缩水甘油基的丙烯酸树脂。在导电性聚合物分散体中，聚酯树脂和含缩水甘油基的丙烯酸树脂的总质量α与π共轭导电性聚合物和聚阴离子的总质量β的比（α/β）在6.90〜 62.5。

8. 发明申请

US20160297181A1 LAMINATE 审中-公开
标题翻译：层压板
公开(公告)号：US20160297181A1
公开(公告)日：2016-10-13
申请号：US15038360
申请日：2014-11-25
申请人： ZEON CORPORATION
发明人： Akihiro TANABE
IPC分类号： B32B27/08 , C08L45/00 , B32B27/36 , C08F232/08 , B32B27/30 , B32B27/32
CPC分类号： B32B27/08 , B32B27/18 , B32B27/306 , B32B27/325 , B32B27/36 , B32B2307/412 , B32B2307/7242 , B32B2457/20 , C08F232/08 , C08L45/00 , C08L2201/08 , C08L2201/10 , C08L33/068 , C08L43/04
摘要： A laminate comprised of a base film with a glass transition temperature of 60 to 160° C. on which a resin film is formed, wherein the resin film is formed using a resin composition containing a cyclic olefin polymer (A) having a protonic polar group, a cross-linking agent (B), a (meth)acrylate compound (C), a radical generator (D), and an antioxidant (E), a content of the cross-linking agent (B) in the resin composition is 5 to 40 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A) having a protonic polar group, and a content of the (meth)acrylate compound (C) in the resin composition is 0.5 to 10 parts by weight, is provided.
摘要翻译：一种由形成有树脂膜的玻璃化转变温度为60〜160℃的基膜构成的层叠体，其中，使用含有具有质子极性基团的环状烯烃聚合物（A）的树脂组合物形成树脂膜，，交联剂（B），（甲基）丙烯酸酯化合物（C），自由基发生剂（D）和抗氧化剂（E）中，树脂组合物中的交联剂（B）的含量为相对于具有质子极性基团的环状烯烃系聚合物（A）100重量份，树脂组合物中的（甲基）丙烯酸酯化合物（C）的含量为5〜40重量份，为0.5〜10重量份重量。

9. 发明申请

US20160295686A1 FLEXIBLE WIRING BOARD AND USE THEREOF 审中-公开
标题翻译：柔性接线板及其使用
公开(公告)号：US20160295686A1
公开(公告)日：2016-10-06
申请号：US15077203
申请日：2016-03-22
申请人： NORITAKE CO., LIMITED
发明人： Shuhei FUKAYA , Hirohito KAKIZOE , Tatsuya BABA , Terusada SUGIURA , Yasushi YOSHINO
IPC分类号： H05K1/02 , C08G59/32 , C08K7/18 , H05K1/03 , C08G59/22
CPC分类号： C08G59/24 , C08G59/36 , C08G59/38 , C08K3/08 , C08K2003/0806 , C08K2201/001 , C08L33/068 , C08L63/00
摘要： Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
摘要翻译：提供具有高耐久性的柔性布线板。本发明提供一种柔性布线板，其包括形成在柔性基板上的柔性基板和导电膜。导电膜含有导电粉末和热固性树脂的凝乳产品。基于JIS K5600 5-4（1999）的铅笔刮擦硬度试验，导电膜的铅笔硬度至少为2H。根据JIS K5400（1990），导电膜通过100平方的横切试验具有至少95/100的粘合性。

10. 发明授权

US09447274B2 Biologically-degradable polyester mixture 有权
标题翻译：生物降解聚酯混合物
公开(公告)号：US09447274B2
公开(公告)日：2016-09-20
申请号：US13182030
申请日：2011-07-13
申请人： Ursula Seeliger , Gabriel Skupin , Dirk Stärke
发明人： Ursula Seeliger , Gabriel Skupin , Dirk Stärke
IPC分类号： C08L67/02 , C08L67/04 , C08K5/101 , C08K5/20 , C08L25/14 , C08L33/06 , C08L63/00 , C08L91/00 , C08L101/06
CPC分类号： C08L67/02 , C08K5/101 , C08K5/20 , C08L25/14 , C08L33/068 , C08L63/00 , C08L67/04 , C08L91/00 , C08L101/06 , C08L2666/02 , C08L2666/14
摘要： The invention relates to biodegradable polyester mixture, comprising i) from 5 to 80% by weight, based on the total weight of components i to ii, of at least one polyester based on aliphatic and aromatic dicarboxylic acids and on aliphatic dihydroxy compounds, and ii) from 20 to 95% by weight, based on the total weight of components i to ii, of at least one biodegradable homo- or copolyester selected from the group consisting of polylactide, polycaprolactone, polyhydroxyalkanoates, and polyesters composed of aliphatic dicarboxylic acids and of aliphatic diols, and iii) from 0.1 to 15% by weight, based on the total weight of components i to ii, a) of a copolymer containing epoxy groups and based on styrene, acrylate, and/or methacrylate, b) of a bisphenol A epoxide, or c) of a fatty acid amide or fatty acid ester or natural oil containing epoxy groups; and iv) from 0 to 15% by weight of additive; and v) from 0 to 50% by weight of inorganic or organic filler, and also to processes for their preparation and a method for their use.

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