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    • 3. 发明申请
    • PROCESS FOR PREPARING PHASE CHANGE MICROCAPSULE HAVING THERMALLY CONDUCTIVE SHELL
    • 用于制备具有导热壳的相变微生物的方法
    • US20160151757A1
    • 2016-06-02
    • US14556539
    • 2014-12-01
    • NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    • YEN-FENG SHIHYI-HSIUAN YUYEN-LIN TSENGHOU-AN HSIEH
    • B01J13/14C09K5/06
    • B01J13/14C09K5/06C09K5/063F28D20/023Y02E60/145
    • A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer. Therefore, the thermally conductive material can be dispersed stably during the encapsulation of the microcapsules, and the phase change microcapsule having the thermally conductive shell can be obtained successfully.
    • 引入了具有导热壳的相变微胶囊的制备方法。 通过加入导热纳米材料,增加了相变微胶囊封装材料的导热性。 乙烯基硅烷化合物与丙烯酸单体聚合,首先形成共聚物,然后加入导热性无机材料。 然后,准备以相变材料为芯,含有导热材料的共聚物为壳的相变微胶囊。 导热性无机材料表面的极性官能团与乙烯基硅烷化合物凝结形成化学键合,从而大大增加了导热无机材料与共聚物之间的相容性。 因此,可以在封装微胶囊期间稳定地分散导热材料,并且可以成功获得具有导热性壳的相变微胶囊。
    • 10. 发明授权
    • Method of establishing a thermal joint on a heat sink
    • 在散热器上建立热接头的方法
    • US06651331B2
    • 2003-11-25
    • US09947552
    • 2001-09-06
    • Manford L. Eaton
    • Manford L. Eaton
    • B23P1526
    • H01L23/4275C09K5/06C09K5/063F28F13/00F28F2013/005F28F2013/006H01L23/3737H01L2924/0002H01L2924/3011Y10T29/4935Y10T29/49393Y10T29/49885H01L2924/00
    • A method for depositing a thermal interface onto a heat sink including the selection of a highly thixotropic compound formed into a bulk form so as to present a tip which is melted upon contact with a preheated heat sink. The tip cross section preferably corresponds to the cross section of the heat sink. Upon depressing a tip of the compound against the heat sink a resulting vacuum therebetween cooperates with the ambient air pressure to preclude migration of the melted compound beyond the exterior of the tip such that the compound is deposited on the heat sink in the desired cross section form. Upon displacement of the tip from the heat sink, the ambient air pressure precludes subsequent migration of the compound onto the heat sink precluding a build up of the deposited material thereon. The component may then be subsequently pressed against the subsequent heat sink without a deformation of the compound tip precluding a subsequent deposit. Alternatively, after cooling the heat sink with pad may be reheated to melt the thermal pad for subsequent placement of a component thereon.
    • 一种用于在散热器上沉积热界面的方法,包括选择形成为大块形式的高触变性化合物,以便呈现与预热的散热器接触时熔化的尖端。 尖端横截面优选对应于散热器的横截面。 当将化合物的尖端压靠在散热器上时,所得到的真空与环境空气压力配合,以排除熔化的化合物超出尖端的外部的迁移,使得化合物以期望的横截面形式沉积在散热器上 。 当尖端从散热器移位时,环境空气压力排除了化合物随后迁移到散热器上,排除了沉积材料在其上的积聚。 然后可以将组件随后压靠随后的散热器,而不会使化合物尖端变形,从而阻止随后的沉积。 或者,在冷却之后,可以重新加热具有焊盘的散热器以熔化热焊盘,以便随后将部件放置在其上。