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    • 3. 发明申请
    • Electronic Device Housing Utilizing A Metal Matrix Composite
    • 使用金属基复合材料的电子设备外壳
    • US20160373154A1
    • 2016-12-22
    • US15175840
    • 2016-06-07
    • II-VI Incorporated
    • Giovanni BarbarossaMichael K. Aghajanian
    • H04B1/3888H04M1/02H05K5/00H05K5/03C22C29/06H05K5/04
    • H04B1/3888C22C29/065C22C32/0063C22C47/12C22C49/06C22C2001/1047H04M1/0202H04M1/185
    • A housing used for electronic devices includes a structural frame element formed of a metal matrix composite (MMC) for providing improved stiffness over other materials currently in use. The MMC is a metal matrix (formed of a material such as aluminum), with a reinforcing material (such as a glass fiber or ceramic) dispersed within the metal matrix. The composition of the reinforcing material, as well as the ratio of reinforcing material to metal, define the stiffness (resistance to bending) and/or strength (resistance to breaking) achieved, and various compositions may be used for different housings, depending on the use of the electronic device. The element may be configured as a structural frame member, or may be embedded within another material forming the structural frame element. In another embodiment, the MMC may be used to form various components of the complete housing, including the enclosure itself.
    • 用于电子设备的壳体包括由金属基质复合材料(MMC)形成的结构框架元件,用于相对于当前使用的其它材料提供改进的刚度。 MMC是分散在金属基体内的金属基体(由诸如铝的材料形成的)与增强材料(例如玻璃纤维或陶瓷)。 增强材料的组成以及增强材料与金属的比例限定了实现的刚度(抗弯曲性)和/或强度(抗断裂性),并且各种组合物可用于不同的外壳,取决于 使用电子设备。 元件可以被构造为结构框架构件,或者可以嵌入形成结构框架元件的另一种材料中。 在另一个实施例中,MMC可用于形成整个外壳的各种部件,包括外壳本身。