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    • 10. 发明授权
    • Two mask process for electroplating metal employing a negative electrophoretic photoresist
    • 使用负电泳光致抗蚀剂的电镀金属的两个掩模工艺
    • US09340892B2
    • 2016-05-17
    • US13584326
    • 2012-08-13
    • Gareth G. HoughamGerard McVickerAnna Pratt
    • Gareth G. HoughamGerard McVickerAnna Pratt
    • G03F7/213C25D17/12G03F7/20G03F7/00C25D1/00C25D5/02C25D13/00
    • C25D17/12C25D1/003C25D5/022C25D13/00G03F7/0037G03F7/2022G03F7/203Y10T428/24562
    • A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.
    • 将负电泳光致抗蚀剂施加在基板上的多个突出的一次性模板部分上。 筒状结构放置在横向包围多个突出的一次性模板部分的负电泳光致抗蚀剂的平面部分上。 负电泳光致抗蚀剂利用筒仓结构和第一平版印刷掩模进行光刻曝光,第一光刻掩模包括具有分离的不透明图案的透明基板。 在移除筒仓结构之后,使用第二光刻掩模将负电泳光致抗蚀剂光刻曝光,其包括覆盖负电泳光刻胶的平面部分的透明区域的图案,而不是随后通过电镀形成的金属结构的基底区域 。 负电泳光致抗蚀剂被开发以在其中形成空腔,并且通过在腔内电镀形成金属结构。 负电泳光致抗蚀剂和多个突出的一次性模板部分可以随后被去除。