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1. 发明申请

US20190195433A1 LIGHTING ASSEMBLY 审中-公开
公开(公告)号：US20190195433A1
公开(公告)日：2019-06-27
申请号：US16289119
申请日：2019-02-28
申请人： LIFI Labs, Inc.
发明人： Philip Anthony Bosua , Marc Alexander
IPC分类号： F21K9/232 , H05B33/08 , F21V29/83 , H05B37/02
CPC分类号： F21K9/232 , F21S9/022 , F21V3/02 , F21V19/0035 , F21V23/0442 , F21V23/0464 , F21V29/70 , F21V29/83 , F21V29/85 , F21Y2105/00 , F21Y2107/20 , F21Y2115/10 , F21Y2115/15 , H05B33/083 , H05B33/0857 , H05B37/0272
摘要： A lighting assembly including a shell, wherein the shell includes an inner wall defining an inner lumen, an outer wall encircling the inner wall, a set of radial fins connecting the inner and outer walls, the set of fins cooperatively defining a set of cooling channels between adjacent fins, the inner wall, and the outer wall; an insert removably mounted within the inner lumen, the insert defining a power storage lumen; a power storage unit arranged within the power storage lumen; a circuit board coupled to the power storage unit, the circuit board comprising a processor and communication module; a lighting module electrically connected to the circuit board, wherein the lighting module includes a substrate and a set of light emitting elements mounted to a first broad face of the substrate.

2. 发明授权

US09890942B2 Lamp with a heat sink 有权
公开(公告)号：US09890942B2
公开(公告)日：2018-02-13
申请号：US14428648
申请日：2013-09-17
申请人： PHILIPS LIGHTING HOLDING B.V.
发明人： Lihua Lin , Aldo Tralli , Theodoor Cornelis Treurniet , Aldegonda Lucia Weijers , Martijn Evert Paul Jansen , Sait Izmit
IPC分类号： F21V23/00 , F21V29/74 , F21Y101/02
CPC分类号： F21V29/74 , F21K9/23 , F21V23/005 , F21V23/006 , F21V29/713 , F21V29/773 , F21V29/85 , F21Y2101/00 , F21Y2115/10
摘要： A lamp comprising a driver assembly, the driver assembly including a driver board with driver electronics, at least one point light source and a heat sink, the heat sink including a top side and a bottom side, a central space extending from the bottom side to the top side and adapted for receiving the driver board of the driver assembly, a zone provided at the top side and adapted for receiving the at least one point light source, wherein a plurality of fins adapted for dissipating heat are extending on opposite sides of the central space, and an extension of the central space in at least one radial direction of the heat sink is larger than an extension of the zone in the radial direction of the heat sink such that the central space is provided with at least one section arranged offset from and radially adjacent to the zone.

3. 发明授权

US09759415B2 Light module 有权
公开(公告)号：US09759415B2
公开(公告)日：2017-09-12
申请号：US14886769
申请日：2015-10-19
申请人： Molex, LLC
发明人： Victor Zaderej , Daniel B. McGowan , Dan Q. Nguyen , Barbara Grzegorzewska , Michael C. Picini
IPC分类号： H01R33/00 , F21V23/06 , F21V17/16 , F21S4/00 , F21S2/00 , F21V29/85 , F21K9/00 , F21V17/14 , F21V19/00 , F21V29/77 , F21V21/00 , F21K9/20 , F21V29/00 , F21Y115/10
CPC分类号： F21V23/06 , F21K9/00 , F21K9/20 , F21S2/005 , F21S4/00 , F21V17/14 , F21V17/162 , F21V17/164 , F21V19/001 , F21V21/00 , F21V29/004 , F21V29/773 , F21V29/85 , F21Y2115/10
摘要： An illumination module is provided that can be inserted into a receptacle that includes a wall and may be mounted on a support surface, such as a heat sink, and the illumination module include a cover and an LED assembly rotateably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. One of the cover and the receptacle can have a plurality of ramps and the other a plurality of shoulders. The cover can be rotated relative to the receptacle to cause the shoulders to slide relative to the ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

4. 发明授权

US09749602B2 Illumination unit, projection display unit, and direct view display unit 有权
公开(公告)号：US09749602B2
公开(公告)日：2017-08-29
申请号：US15180848
申请日：2016-06-13
申请人： Sony Corporation
发明人： Koji Miura
IPC分类号： H04N9/31 , G03B21/00 , F21K9/00 , F21V5/00 , F21V29/85 , F21V5/04 , F21V9/08
CPC分类号： G03B21/005 , F21K9/00 , F21V5/004 , F21V5/007 , F21V5/008 , F21V5/045 , F21V9/08 , F21V29/85 , G03B21/00 , H04N9/3138 , H04N9/315 , H04N9/3161
摘要： An illumination unit includes one or more light sources each including a solid-state light-emitting device configured to emit light from a light emission region including a single or a plurality of light-emitting spots. The solid-state light-emitting device includes a single chip or a plurality of chips each emitting a light beam. Three or more of the light-emitting spots are provided within the whole of one or more light sources, to allow the whole of one or more light sources to emit light beams in two or more wavelength bands different from one another, and the solid-state light emitting device in a first light source which is at least one of the one or more light sources, has a plurality of light-emitting spots which emit light in the same wavelength band.

5. 发明申请

US20170198881A1 Luminaire Assemblies with Composite Housings 审中-公开
公开(公告)号：US20170198881A1
公开(公告)日：2017-07-13
申请号：US15313534
申请日：2015-05-28
申请人： Quarkstar LLC
发明人： Charles R. McCreary, JR. , Ferdinand Schinagl
IPC分类号： F21V7/00 , F21K9/61 , F21V29/70 , F21V8/00
CPC分类号： F21V7/0016 , F21K9/61 , F21V7/0008 , F21V15/01 , F21V29/70 , F21V29/85 , F21V29/87 , F21Y2103/10 , F21Y2115/00 , F21Y2115/10 , G02B6/0023 , G02B6/0031 , G02B6/0055 , G02B6/0068 , G02B6/0085 , G02B6/0088 , G02B6/0091 , G02B6/0093
摘要： A luminaire assembly includes a substrate; light emitting elements (LEEs) secured to the substrate; optical couplers arranged along the substrate, each optical coupler being positioned to receive light emitting from a corresponding one of the LEEs and to direct the light in a forward direction orthogonal to the substrate; a redirecting surface spaced apart from the couplers along the forward direction to reflect the light from the optical couplers to an ambient environment in a backward angular range; a housing comprising a support structure and a layer of a heat conducting material disposed on the support structure, where a thermal conductivity of the layer of heat conducting material is greater than a thermal conductivity of a material forming the support structure; and a heat coupling layer arranged between the substrate and the housing, the heat coupling layer being adjacent to the heat conducting material of the housing.

6. 发明授权

US09657931B2 Thermal management for light-emitting diodes 有权
公开(公告)号：US09657931B2
公开(公告)日：2017-05-23
申请号：US13977400
申请日：2011-12-21
申请人： Ketan R. Shah , Sean M. Halton
发明人： Ketan R. Shah , Sean M. Halton
IPC分类号： F21V29/00 , B60Q1/06 , F21V29/506 , F21V29/85 , F21V29/74 , H01L33/64 , F21V3/02 , F21V29/71 , F21V29/77 , F21V29/78 , F21K9/232 , F21V3/04 , F21V29/83 , F21V29/87 , F21V29/89 , F21Y101/00
CPC分类号： F21V29/506 , F21K9/135 , F21K9/232 , F21V3/02 , F21V3/0418 , F21V3/0436 , F21V3/061 , F21V3/062 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/77 , F21V29/773 , F21V29/78 , F21V29/83 , F21V29/85 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2101/02 , F21Y2115/10 , H01L33/642 , H01L2924/00 , H01L2924/0002
摘要： Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

7. 发明申请

US20170139108A1 LIGHT GUIDE FOR LOW PROFILE LUMINAIRE 有权
公开(公告)号：US20170139108A1
公开(公告)日：2017-05-18
申请号：US15419667
申请日：2017-01-30
申请人： Lighting Science Group Corporation
发明人： Mark Penley Boomgaarden , Ricardo Romeu , Ryan Kelley , Eric Holland
IPC分类号： F21V8/00 , F21S8/02 , F21V29/70 , F21V23/02
CPC分类号： G02B6/0041 , F21K9/20 , F21K9/23 , F21K9/61 , F21K9/68 , F21S8/026 , F21V21/20 , F21V23/02 , F21V23/0471 , F21V29/70 , F21V29/83 , F21V29/85 , F21V2200/20 , F21Y2101/00 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , G02B6/00 , G02B6/0031 , G02B6/0035 , G02B6/0065 , G02B6/0068 , G02B6/0073 , G02B6/0085
摘要： A luminaire comprising a heat sink, a light source and a light guide. The light source is carried by the heat sink and configured to emit a source light. The light source includes a heat spreader having an inner surface and an outer surface, and a plurality of light-emitting diodes (LEDs) carried by a circuit board and disposed generally along an outer peripheral perimeter portion of the inner surface of the heat spreader, and positioned in thermal communication with the heat spreader. The light guide includes a lens with a plurality of optical elements disposed within the lens.

8. 发明授权

US09651236B2 Light emitting device with a heat sink composed of two materials 有权
公开(公告)号：US09651236B2
公开(公告)日：2017-05-16
申请号：US14169914
申请日：2014-01-31
申请人： CHRISTIE DIGITAL SYSTEMS USA, INC.
发明人： Daniel Robert Adema , Graham Hill , Simon Guthrie , Darren Pastrik
IPC分类号： F21V29/00 , F21V29/70 , F21V29/503 , G03B21/20 , F21V29/502 , F21V29/89 , F21V29/85 , G03B21/16 , F21V9/16 , F21Y115/30 , F21Y115/10
CPC分类号： F21V29/503 , F21V9/30 , F21V29/502 , F21V29/70 , F21V29/85 , F21V29/89 , F21Y2115/10 , F21Y2115/30 , G03B21/16 , G03B21/204 , Y10T29/49863 , Y10T29/49865
摘要： A light emitting device with a heat sink composed of two materials is provided. The device comprises: a light emitting material; and, a heat sink comprising: a first material configured to cool the light emitting material, the first material comprising a first coefficient of thermal expansion (CTE); and, a second material bonded to the first material at an interface there between, the second material comprising a second CTE lower than the first CTE, the light emitting material bonded to the first material but not the second material.

9. 发明申请

US20170059143A1 OVEN LIGHT 有权
标题翻译：烤炉灯
公开(公告)号：US20170059143A1
公开(公告)日：2017-03-02
申请号：US15153166
申请日：2016-05-12
申请人： BJB GmbH & Co. KG
发明人： Olaf Baumeister , Detlef Scholz
IPC分类号： F21V29/503 , F21V33/00 , F21V29/77 , F21V29/85 , F21V29/87
CPC分类号： F21V29/503 , A21B3/10 , F21V29/15 , F21V29/773 , F21V29/85 , F21V29/87 , F21V33/0044 , F21W2131/307 , F21Y2115/10 , F24C15/008 , H05B6/6444
摘要： An oven light including an attachment sleeve which is attachable in a recess of a cooking cavity wall; a light permeable cover which closes the recess of the cooking cavity wall; an illuminant which is arranged behind the light permeable cover and whose emitted light is used for illuminating the cooking cavity, wherein the illuminant is formed by at least one LED which emits light in a light cone (K), wherein the LED is arranged on a cooling element which dissipates operating heat of the LED, wherein a heat barrier is arranged between the cover and the LED and protects the LED from a cooking temperature, wherein the light cone penetrates an arrangement plane of the heat barrier, characterized in that the heat barrier includes at least one in particular light permeable heat shield with an opening through which light of the LED propagates in a direction towards the cover.
摘要翻译：一种烤箱灯，包括可附接在烹饪腔壁的凹部中的附接套筒; 封闭烹饪腔壁的凹部的透光盖; 该发光体配置在透光性罩的后面，其发光用于照明烹调腔，其特征在于：所述发光体由发光部（9）中的至少一个LED构成，所述LED以光锥（K）散热LED的工作热的冷却元件，其中在所述盖和LED之间布置有热障，并且保护所述LED免受烹饪温度的影响，其中所述光锥穿透所述隔热屏的布置平面，其特征在于，所述隔热层包括至少一个特别是透光的热屏蔽件，其具有开口，LED的光沿朝向盖子的方向传播。

10. 发明授权

US09585239B2 Methods of manufacturing lighting assembly with thermal overmolding 有权
标题翻译：制造具有热过模制的照明装置的方法
公开(公告)号：US09585239B2
公开(公告)日：2017-02-28
申请号：US14268476
申请日：2014-05-02
申请人： Jeffrey Nall , Matthew Mrakovich
发明人： Jeffrey Nall , Matthew Mrakovich
IPC分类号： H05K3/30 , H05K1/02 , F21V29/00 , G09F9/33 , H05K3/28 , F21V9/16 , F21V23/00 , F21V29/70 , F21V29/85 , F21V23/02 , F21V31/04 , F21V3/04 , F21Y101/00 , F21Y101/02
CPC分类号： H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
摘要： One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要翻译：一个或多个发光二极管二极管（LED）连接到印刷电路板。所连接的LED可通过印刷电路板的电路与电源连接。包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。在一些实施例中，自由高的导热材料是热塑性材料。

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