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    • 7. 发明授权
    • Sensor auto-calibration
    • 传感器自动校准
    • US09581466B2
    • 2017-02-28
    • US13673950
    • 2012-11-09
    • QUALCOMM Incorporated
    • Disha AhujaVictor KulikCarlos M. PuigAshish Nagesh Desai
    • G01R21/00G01C25/00G01K15/00G01R35/00G06F15/00G01P21/00G06F19/00G06F1/32
    • G01C25/00G01K15/00G01P21/00G01R35/00G06F1/3206G06F1/329G06F15/00G06F19/00Y02D10/24
    • Aspects of the disclosure relate to computing technologies. In particular, aspects of the disclosure relate to mobile computing device technologies, such as systems, methods, apparatuses, and computer-readable media for scheduling an execution of a task, such as a non-real time, non-latency sensitive background task on a computing device. In one implementation, the technique includes detecting a first state of a device, wherein the first state of the device is associated with a first power level and a first task, wherein the first power level is at least partially based on power consumption of a first task, determining that the first power level associated with the first state is above a threshold, and in response to determining that the first power level associated with the first state is above the threshold, and scheduling an execution of a second task on the device, wherein the second task is associated with automatically collecting of calibration data using at least one sensor.
    • 本公开的方面涉及计算技术。 特别地,本公开的方面涉及移动计算设备技术,例如用于调度任务的执行的系统,方法,设备和计算机可读介质,诸如非实时非延迟敏感的后台任务 计算设备。 在一个实现中,该技术包括检测设备的第一状态,其中设备的第一状态与第一功率电平和第一任务相关联,其中第一功率电平至少部分地基于第一功率电平的功率消耗 确定与第一状态相关联的第一功率电平高于阈值,并且响应于确定与第一状态相关联的第一功率电平高于阈值,并且调度设备上的第二任务的执行, 其中所述第二任务与使用至少一个传感器自动收集校准数据相关联。
    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND TEMPERATURE SENSOR SYSTEM
    • 半导体器件和温度传感器系统
    • US20160282202A1
    • 2016-09-29
    • US15177396
    • 2016-06-09
    • Renesas Electronics Corporation
    • Tadashi KAMEYAMATakanobu NARUSETakayasu ITO
    • G01K15/00G01K7/01
    • G01K15/00G01K1/00G01K7/00G01K7/01
    • To suppress an increase in the number of voltage comparators with an expansion in a chip temperature detection range, a temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage obtained by the reference voltage generating circuit with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range. It is possible to expand the chip temperature detection range by changing the correspondence between the chip temperature detection signal and the chip temperature, without increasing the number of voltage comparators.
    • 为了抑制芯片温度检测范围扩大的电压比较器的数量的增加,半导体器件中的温度传感器包括:温度检测电路,用于根据芯片温度输出电压;基准电压产生电路,用于产生 多个参考电压,以及多个电压比较器,用于将由参考电压产生电路获得的每个参考电压与温度检测电路的输出电压进行比较,从而生成配置有多个位的芯片温度检测信号。 此外,温度传感器包括控制电路,用于基于芯片温度检测信号来控制由基准电压产生电路产生的参考电压,从而改变芯片温度检测信号和芯片温度之间的对应关系,以移动芯片温度检测范围。 通过改变芯片温度检测信号和芯片温度之间的对应关系,可以扩大芯片温度检测范围,而不增加电压比较器的数量。