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    • 1. 发明授权
    • Flexible timepiece guidance
    • 灵活的钟表指导
    • US09323222B2
    • 2016-04-26
    • US14795448
    • 2015-07-09
    • Nivarox-FAR S.A.
    • Marc Stranczl
    • G04B17/04G04B15/14
    • G04B15/14G04B17/04G04B17/045G04B31/06
    • A device for elastic guidance in rotation for a timepiece mechanism allowing rotation of one element relative to another element about an axis of rotation Z defining an axial direction, including construction blades, each construction blade includes an assembly fixing part including a body and a functional part extending from the body as far as one end, the assembly fixing part and the functional part being separated by at least one slot in at least two extensions which are elastically connected and extend in a radial direction transverse to the axial direction, and anchorage zones which are disposed at opposite axial ends of the flexible guidance device, and configured to be fixed to the elements.
    • 一种用于时钟机构的旋转弹性引导装置,允许一个元件相对于另一个元件围绕限定包括构造刀片的轴向的旋转轴线Z旋转,每个构造刀片包括组件固定部件,该组件固定部件包括主体和功能部件 所述组件固定部分和所述功能部分在至少两个延伸部分中至少一个狭槽分开,所述至少两个延伸部弹性地连接并且在横向于轴向的径向方向上延伸,以及锚固区域 设置在柔性引导装置的相对轴向端部,并且被构造成固定到元件。
    • 2. 发明授权
    • Heterogeneous LIGA method
    • 异质LIGA方法
    • US08470154B2
    • 2013-06-25
    • US13124986
    • 2009-10-07
    • Gilles Rey-Mermet
    • Gilles Rey-Mermet
    • C25D1/00C25D2/10C25D5/02
    • C25D1/00C25D1/003G03F7/00G04B19/042G04B29/027G04B31/06
    • The method of fabricating metal microstructures includes the following steps: a) taking a substrate that has a conductive strike surface; b) to d) forming a first resin mould by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface of the substrate; e) electroforming the first element by galvanic deposition of a first metal material in the apertures of the first resin mould, f) removing the first mould around the first element to expose the conductive strike surface of the substrate; g) to i) forming a new resin mould by UV photolithography, the apertures in the new resin mould revealing the first element, and the conductive strike surface of the substrate; j) electroforming the second element by galvanic deposition of a second metal material in the apertures of the new resin mould to form said metal microstructure; k) separating said metal microstructure from the substrate and from said new mould.
    • 制造金属微结构的方法包括以下步骤:a)取出具有导电冲击表面的基底; b)d)通过UV光刻法形成第一树脂模具,第一树脂模具中的孔露出衬底的导电冲击表面; e)通过在所述第一树脂模具的孔中电沉积第一金属材料来电铸所述第一元件,f)移除所述第一元件周围的所述第一模具以暴露所述基板的导电冲击表面; g)以i)通过UV光刻法形成新的树脂模具,新树脂模具中的孔露出第一元件和基板的导电冲击表面; j)通过在所述新树脂模具的孔中电沉积第二金属材料来电铸所述第二元件以形成所述金属微结构; k)从所述基底和所述新模具分离所述金属微结构。