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1. 发明授权

US10062519B2 Tantalum capacitor with polymer cathode 有权
公开(公告)号：US10062519B2
公开(公告)日：2018-08-28
申请号：US14853493
申请日：2015-09-14
申请人： Kemet Electronics Corporation
发明人： Yuri Freeman , Steven C. Hussey , Jimmy Dale Cisson , Philip M. Lessner
IPC分类号： H01G9/012 , H01G9/052 , H01G13/00 , H01G9/10 , H01G9/00 , H01G9/042 , H01G9/15 , H01G9/14
CPC分类号： H01G9/012 , H01G9/0036 , H01G9/0425 , H01G9/052 , H01G9/10 , H01G9/14 , H01G9/15 , H01G13/003
摘要： An improved capacitor and a method for forming an improved capacitor is detailed. The method comprises forming a tantalum anode from a tantalum powder with a powder charge of no more than 40,000 μC/g; forming a dielectric on the anode by anodization at a formation voltage of no more than 100 V; and forming a conductive polymeric cathode on the dielectric wherein the capacitor has a breakdown voltage higher than the formation voltage.

2. 发明授权

US09691771B2 Vanadium-containing film forming compositions and vapor deposition of vanadium-containing films 有权
公开(公告)号：US09691771B2
公开(公告)日：2017-06-27
申请号：US15130675
申请日：2016-04-15
申请人： L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
发明人： Clément Lansalot-Matras , Wontae Noh
IPC分类号： C07F9/00 , H01L27/108 , H01L21/285 , H01L49/02 , C23C16/18 , C23C16/32 , C23C16/34 , C23C16/40 , C23C16/42 , C23C16/455 , C23C16/50 , H01G13/00 , H01G4/10 , H01G4/20
CPC分类号： H01L27/1085 , C23C16/18 , C23C16/32 , C23C16/34 , C23C16/405 , C23C16/42 , C23C16/45525 , C23C16/45553 , C23C16/50 , H01G4/10 , H01G4/20 , H01G13/003 , H01L21/28556 , H01L21/28568 , H01L27/10805 , H01L28/60
摘要： Vanadium-containing film forming compositions are disclosed, along with methods of synthesizing the same, and methods of forming Vanadium-containing films on one or more substrates via vapor deposition processes using the Vanadium-containing film forming compositions.

3. 发明授权

US09508492B2 Manganese oxide capacitor for use in extreme environments 有权
标题翻译：用于极端环境的氧化锰电容器
公开(公告)号：US09508492B2
公开(公告)日：2016-11-29
申请号：US14611600
申请日：2015-02-02
申请人： AVX Corporation
发明人： Martin Biler , Jan Petrzilek , Ivana Zednickova
IPC分类号： H01G9/15 , H01G9/052 , H01G9/012 , H01G9/10 , H01G4/228 , H01G13/00 , H01G9/00 , H01G9/032 , H01G9/06 , H01G9/042 , H01G9/08 , H01G2/06 , H01G9/04
CPC分类号： H01G9/10 , H01G2/065 , H01G4/228 , H01G9/0036 , H01G9/012 , H01G9/032 , H01G9/042 , H01G9/0525 , H01G9/06 , H01G9/08 , H01G9/15 , H01G13/003 , H01G2009/05 , Y10T29/417
摘要： A capacitor assembly for use in high voltage and high temperature environments is provided. More particularly, the capacitor assembly includes a capacitor element containing an anodically oxidized porous, sintered body that is coated with a manganese oxide solid electrolyte. To help facilitate the use of the capacitor assembly in high voltage (e.g., above about 35 volts) and high temperature (e.g., above about 175° C.) applications, the capacitor element is enclosed and hermetically sealed within a housing in the presence of a gaseous atmosphere that contains an inert gas. It is believed that the housing and inert gas atmosphere are capable of limiting the amount of moisture supplied to the manganese dioxide. In this manner, the solid electrolyte is less likely to undergo an adverse reaction under extreme conditions, thus increasing the thermal stability of the capacitor assembly. In addition to functioning well in both high voltage and high temperature environments, the capacitor assembly of the present invention may also exhibit a high volumetric efficiency.
摘要翻译：提供了一种用于高压和高温环境的电容器组件。更具体地说，电容器组件包括一个电容器元件，该电容器元件含有被氧化锰固体电解质涂覆的阳极氧化的多孔烧结体。为了有助于电容器组件在高电压（例如高于约35伏特）和高温（例如高于约175℃）的应用）下的使用，电容器元件被封闭并密封在壳体内，存在含有惰性气体的气体气氛。据信壳体和惰性气体气氛能够限制供应到二氧化锰的水分量。以这种方式，固体电解质在极端条件下不太可能发生不利反应，从而增加电容器组件的热稳定性。除了在高电压和高温环境中都能很好地发挥作用之外，本发明的电容器组件也可表现出高体积效率。

4. 发明申请

US20160307708A1 TANTALUM-CONTAINING FILM FORMING COMPOSITIONS AND VAPOR DEPOSITION OF TANTALUM-CONTAINING FILMS 审中-公开
标题翻译：含TATALUM膜的成膜组合物和含TANTALUM膜的蒸气沉积
公开(公告)号：US20160307708A1
公开(公告)日：2016-10-20
申请号：US15130702
申请日：2016-04-15
申请人： L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
发明人： Clément LANSALOT-MATRAS , Wontae NOH
IPC分类号： H01G13/00 , C23C16/50 , C23C16/18 , C23C16/42 , C23C16/32 , C23C16/40 , C23C16/455 , C23C16/34
CPC分类号： H01L27/1085 , C23C16/18 , C23C16/32 , C23C16/34 , C23C16/405 , C23C16/42 , C23C16/45525 , C23C16/45553 , C23C16/50 , H01G4/10 , H01G4/20 , H01G13/003 , H01L21/28556 , H01L21/28568 , H01L27/10805 , H01L28/60
摘要： Tantalum-containing film forming compositions are disclosed, along with methods of synthesizing the same, and methods of forming Tantalum-containing films on one or more substrates via vapor deposition processes using the Tantalum-containing film forming compositions.
摘要翻译：公开了含钽的成膜组合物及其合成方法，以及通过使用含钽成膜组合物的气相沉积法在一个或多个基材上形成含钽膜的方法。

5. 发明申请

US20160189885A1 ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND MOUNT STRUCTURE OF ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20160189885A1
公开(公告)日：2016-06-30
申请号：US15062337
申请日：2016-03-07
申请人： Murata Manufacturing Co., Ltd.
发明人： Hiroshi ABE , Yoshiyuki NOMURA , Junichi SAITO
IPC分类号： H01G13/00
CPC分类号： H01G4/224 , H01G2/065 , H01G4/232 , H01G4/2325 , H01G4/248 , H01G4/30 , H01G13/003 , H05K1/181 , H05K3/3436 , H05K2201/0769 , H05K2201/10015 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： An electronic component includes a main body, first and second external electrodes, and a water-repellent film. The first and second external electrodes are provided on a portion of a surface of the main body. The water-repellent film is provided on another portion of the surface of the main body and on a surface of the first external electrode. The water-repellent film contains a non-cross-linked silicone resin. An angle of contact of water of about 25° C. with the water-repellent film is not less than about 100° and not greater than about 160°.

6. 发明申请

US20150348710A1 CASE-MOLD-TYPE CAPACITOR AND METHOD FOR PRODUCING SAME 有权
标题翻译：壳模型电容器及其制造方法
公开(公告)号：US20150348710A1
公开(公告)日：2015-12-03
申请号：US14648662
申请日：2013-11-27
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Shinya SATO , Toshihisa MIURA
IPC分类号： H01G4/236 , H01G4/005 , H01G4/224 , H01G4/06
CPC分类号： H01G4/236 , H01G2/04 , H01G2/10 , H01G2/103 , H01G4/005 , H01G4/06 , H01G4/224 , H01G4/228 , H01G13/003 , H01G13/006 , Y10T29/51
摘要： A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.
摘要翻译：壳体型电容器包括电容器元件，连接到电容器元件的第一和第二电极的第一和第二母线，容纳电容器元件的壳体和第一和第二汇流条，以及填充壳体的模制树脂其中。壳体具有设置在其中的切口部分。连接到壳体以密封切口部分的密封板。第一和第二母线穿过密封板并固定到密封板上。壳模式电容器在不增加材料成本的情况下提高第一和第二母线的端子部之间的尺寸精度，并且具有高可靠性。

7. 发明授权

US08947857B2 Manganese oxide capacitor for use in extreme environments 有权
标题翻译：用于极端环境的氧化锰电容器
公开(公告)号：US08947857B2
公开(公告)日：2015-02-03
申请号：US13313367
申请日：2011-12-07
申请人： Martin Biler , Jan Petrzilek , Ivana Zednickova
发明人： Martin Biler , Jan Petrzilek , Ivana Zednickova
IPC分类号： H01G9/00 , H01G4/06 , H01G4/228 , H01G9/08 , H01G2/06 , H01G9/012 , H01G9/10 , H01G9/15 , H01G9/042
CPC分类号： H01G9/10 , H01G2/065 , H01G4/228 , H01G9/0036 , H01G9/012 , H01G9/032 , H01G9/042 , H01G9/0525 , H01G9/06 , H01G9/08 , H01G9/15 , H01G13/003 , H01G2009/05 , Y10T29/417
摘要： A capacitor assembly for use in high voltage and high temperature environments is provided. More particularly, the capacitor assembly includes a capacitor element containing an anodically oxidized porous, sintered body that is coated with a manganese oxide solid electrolyte. To help facilitate the use of the capacitor assembly in high voltage (e.g., above about 35 volts) and high temperature (e.g., above about 175° C.) applications, the capacitor element is enclosed and hermetically sealed within a housing in the presence of a gaseous atmosphere that contains an inert gas.
摘要翻译：提供了一种用于高压和高温环境的电容器组件。更具体地说，电容器组件包括一个电容器元件，该电容器元件含有被氧化锰固体电解质涂覆的阳极氧化的多孔烧结体。为了有助于电容器组件在高电压（例如高于约35伏特）和高温（例如高于约175℃）的应用）下的使用，电容器元件被封闭并密封在壳体内，存在含有惰性气体的气体气氛。

8. 发明授权

US08697277B2 Film-clad battery and method of producing film-clad battery 有权
标题翻译：薄膜包覆电池和生产薄膜包覆电池的方法
公开(公告)号：US08697277B2
公开(公告)日：2014-04-15
申请号：US10574562
申请日：2004-09-30
申请人： Makihiro Otohata , Hiroshi Yageta
发明人： Makihiro Otohata , Hiroshi Yageta
IPC分类号： H01M2/02 , H01M2/08
CPC分类号： H01M2/08 , B29C53/063 , B29C59/007 , B29C65/02 , B29C65/08 , B29C66/0324 , B29C66/1122 , B29C66/433 , B29C66/4332 , B29C66/72321 , B29C66/7234 , B29C66/80 , B29C66/83221 , B29L2009/00 , B29L2031/7146 , H01G9/08 , H01G13/003 , H01M2/021 , H01M2/0212 , H01M2/0267 , H01M2/0275 , H01M2/0287 , Y10T29/49108 , Y10T29/4911
摘要： A joint section where covering films 2a, 2b of film-covered battery 1 are heat-sealed together is formed with flat surface 6′ having thickness t1 and groove 6 having thickness t2. Groove 6 serves to reduce the projection area of film-covered battery 1 by folding side 2c toward receiving section 2a1 with groove 6 serving as an edge, and groove 6 is made thinner than flat surface 6′ by Δt=t1−t2. Therefore, the length of covering films 2a, 2b produced on outer side 6a is shortened as compared with the case of folding the portion that has thickness t1.
摘要翻译：将覆盖有电池1的膜2a，2b的覆膜热合在一起的接合部形成有具有厚度t1的平坦面6'和厚度为t2的槽6。槽6用于通过将具有槽6用作边缘的接收部分2a1折叠侧面2c来减小膜覆盖的电池1的投影面积，并且使槽6比平坦表面6'比D = t-t1-t2更薄。因此，与折叠厚度为t1的部分的情况相比，在外侧6a上产生的覆盖膜2a，2b的长度缩短。

9. 发明申请

US20110127694A1 METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) 有权
标题翻译：制造树脂模制电子元件的方法（如修订版）
公开(公告)号：US20110127694A1
公开(公告)日：2011-06-02
申请号：US13056702
申请日：2010-06-17
申请人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
发明人： Junichi Kurita , Hiroshi Takahashi , Kenji Kuranuki , Motoaki Morioka , Keizo Nakagawa , Masashi Minakuchi , Yukihiro Shimasaki
IPC分类号： H01G4/224
CPC分类号： B29C43/18 , B29C39/006 , B29C39/10 , B29C39/38 , B29C39/405 , B29C70/70 , B29C70/72 , B29C2043/181 , B29C2043/182 , B29K2023/38 , B29K2105/0002 , H01G9/012 , H01G9/10 , H01G9/15 , H01G13/003
摘要： A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.
摘要翻译：使用具有开口顶面的空腔的第一模具和与顶部的第一模具结合的第二模具的树脂模制电子部件的制造方法包括以下步骤：（A）将电子部件的元件和液体树脂前体进入第一模具的空腔，液体树脂前体在40℃下的粘度为10Pa·s以下。（B）在所述工序（A）之后，将所述第二模具配置成使得所述元件和所述树脂前体被夹持; 和（C）在第一模具和第二模具之间挤压元件和树脂前体，并且在步骤（B）之后，通过来自第二模具的热量使树脂前体固化。将第二模具的温度设定为高于第一模具的温度。

10. 发明授权

US07899529B2 Apparatus and method for packaging a capacitor 有权
标题翻译：用于封装电容器的装置和方法
公开(公告)号：US07899529B2
公开(公告)日：2011-03-01
申请号：US10574343
申请日：2004-09-21
申请人： Daniel J. Powers
发明人： Daniel J. Powers
IPC分类号： A61N1/39
CPC分类号： H01G2/106 , A61N1/3968 , H01G9/08 , H01G9/10 , H01G13/003
摘要： An electronic device includes a housing (20) having a first interior region (26) and a second interior region (28). The second interior region (28) is sized to receive an electronic interface (18). The device also includes a wound capacitor core (14) adapted for electrical communication with the second interior region (28), and a capacitor potting material (38) disposed in contact with the first interior region (26) and the wound capacitor core (14).
摘要翻译：电子设备包括具有第一内部区域（26）和第二内部区域（28）的壳体（20）。第二内部区域（28）的尺寸被设计成接收电子接口（18）。该装置还包括适于与第二内部区域（28）电连通的缠绕电容器芯（14）和与第一内部区域（26）和卷绕的电容器芯（14）接触设置的电容器灌封材料（38））。

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