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1. 发明申请

US20170373011A1 SEMICONDUCTOR DIE BACKSIDE DEVICES AND METHODS OF FABRICATION THEREOF 审中-公开
公开(公告)号：US20170373011A1
公开(公告)日：2017-12-28
申请号：US15194775
申请日：2016-06-28
申请人： General Electric Company
发明人： Arun Virupaksha Gowda , Risto Ilkka Tuominen
IPC分类号： H01L23/538 , H01L21/52 , H01L25/065
CPC分类号： H01L23/5389 , B81C1/00246 , B81C2203/0735 , G02B6/4201 , G06K19/07745 , H01L23/34 , H01L23/5227 , H01L23/5228 , H01L23/5384 , H01L23/5386 , H01L23/57 , H01L23/58 , H01L24/02 , H01L24/19 , H01L24/20 , H01L25/16 , H01L27/0694 , H01L2223/54446 , H01L2224/02371 , H01L2224/02375 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2224/32225 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H01L2924/1434 , H01L2924/1461 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104
摘要： A die for a semiconductor chip package includes a first surface including an integrated circuit formed therein. The die also includes a backside surface opposite the first surface. The backside surface has a total surface area defining a substantially planar region of the backside surface. The die further includes at least one device formed on the backside surface. The at least one device includes at least one extension extending from the at least one device beyond the total surface area.

2. 发明授权

US09483725B2 Semiconductor device including a radio frequency identification tag 有权
标题翻译：包括射频识别标签的半导体装置
公开(公告)号：US09483725B2
公开(公告)日：2016-11-01
申请号：US14927042
申请日：2015-10-29
申请人： Infineon Technologies AG
发明人： Jose Javier Padilla Alcaide , Carlos Castro Serrato
IPC分类号： G06K19/077
CPC分类号： G06K19/07758 , G06K19/07749 , H01L23/051 , H01L23/3107 , H01L23/544 , H01L2223/54413 , H01L2223/54446 , H01L2223/54486 , H01L2924/0002 , H01L2924/00
摘要： A device includes a semiconductor element and a radio frequency identification (RFID) tag. The RFID tag is configured to provide information about at least one of a property of the device and a property of a manufacturing of the device.
摘要翻译：一种装置包括半导体元件和射频识别（RFID）标签。 RFID标签被配置为提供关于设备的属性和设备的制造的属性中的至少一个的信息。

3. 发明申请

US20110169641A1 System and Method To Embed A Wireless Communication Device Into Semiconductor Packages 审中-公开
标题翻译：将无线通信设备嵌入到半导体封装中的系统和方法
公开(公告)号：US20110169641A1
公开(公告)日：2011-07-14
申请号：US12977049
申请日：2010-12-22
申请人： Chang-Ming Lin
发明人： Chang-Ming Lin
IPC分类号： G08B13/14
CPC分类号： H01L23/48 , H01L23/49855 , H01L23/544 , H01L23/573 , H01L23/66 , H01L24/48 , H01L25/0657 , H01L2223/54446 , H01L2223/54486 , H01L2223/6677 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be embedded in the encapsulation materials of the microelectronic device. The wireless tag may also be embedded in the package filler material of the microelectronic device. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.
摘要翻译：无线标签包括全部形成在薄膜基板上的无线收发器，存储器和天线。将无线标签插入到微电子装置的包装材料中以实现跟踪和认证功能。在一些实施例中，无线通信设备存储用于微电子设备和/或结合微电子设备的衍生系统产品的身份或其他识别信息。无线标签可以嵌入微电子器件的封装材料中。无线标签也可以嵌入在微电子器件的封装填充材料中。以这种方式，无线通信设备可用于跟踪和认证微电子器件以及结合微电子器件的衍生系统产品。

4. 发明申请

US20110168786A1 System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages 审中-公开
标题翻译：将无线通信设备嵌入到包括芯片级封装和3D半导体封装的半导体封装中的系统和方法
公开(公告)号：US20110168786A1
公开(公告)日：2011-07-14
申请号：US12977050
申请日：2010-12-22
申请人： Chang-Ming Lin
发明人： Chang-Ming Lin
IPC分类号： G06K19/077 , H01L21/50
CPC分类号： H01L23/48 , H01L23/49855 , H01L23/544 , H01L23/573 , H01L23/66 , H01L24/48 , H01L25/0657 , H01L2223/54446 , H01L2223/54486 , H01L2223/6677 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be affixed to a package lid of the microelectronic device. The wireless tag may further be affixed to a chip scale package or a three dimensional semiconductor package. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.
摘要翻译：无线标签包括全部形成在薄膜基板上的无线收发器，存储器和天线。将无线标签插入到微电子装置的包装材料中以实现跟踪和认证功能。在一些实施例中，无线通信设备存储用于微电子设备和/或结合微电子设备的衍生系统产品的身份或其他识别信息。无线标签可以固定到微电子器件的封装盖上。无线标签还可以固定到芯片级封装或三维半导体封装。以这种方式，无线通信设备可用于跟踪和认证微电子器件以及结合微电子器件的衍生系统产品。

5. 发明申请

US20060213988A1 System for tracking elements using tags 有权
标题翻译：使用标签跟踪元素的系统
公开(公告)号：US20060213988A1
公开(公告)日：2006-09-28
申请号：US11091647
申请日：2005-03-28
申请人： Chih-Hsin Wang
发明人： Chih-Hsin Wang
IPC分类号： G06Q30/00 , G06F7/00
CPC分类号： H01L23/544 , G06Q10/00 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/54433 , H01L2223/54446 , H01L2223/54486 , H01L2224/32057 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A management system for tracking elements through steps and stages of a chain employing fixed tags permanently attached to elements that progress through the steps and stages. The elements are tracked by the fixed tags from an initial stage, through multiple work-in-process stages to a final stage of the chain. The fixed tags include radio-frequency (RF) communication units that have wireless communication with RF communicators in one or more of the stages of the supply chain. The wireless communications between the RF tags and the RF communicators operate with a tag communication protocol that defines the operations and sequences for storing information into and retrieval of information from tags. The hierarchy of data storage in RF tags, in RF communicators and otherwise in storage locations in the system is controlled to operate within the memory hierarchy.
摘要翻译：用于通过链条的步骤和阶段跟踪元件的管理系统，其使用永久附着到通过步骤和阶段进行的元素的固定标签。这些元素由固定的标签从初始阶段跟踪，通过多个在制品阶段到链的最后阶段。固定标签包括与供应链的一个或多个阶段中的RF通信器进行无线通信的射频（RF）通信单元。 RF标签和RF通信器之间的无线通信使用标签通信协议进行操作，标签通信协议定义用于将信息存储到标签中并从其检索信息的操作和序列。在RF标签，RF通信器中以及在系统中的存储位置中的数据存储层级被控制以在存储器层次结构内操作。

6. 发明申请

US20170242071A1 COMPOSITE INTEGRATED CIRCUITS AND METHODS FOR WIRELESS INTERACTIONS THEREWITH 审中-公开
公开(公告)号：US20170242071A1
公开(公告)日：2017-08-24
申请号：US15589435
申请日：2017-05-08
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Min-Jer WANG , Ching-Nen PENG , Chewn-Pu JOU , Feng Wei KUO , Hao CHEN , Hung-Chih LIN , Huan-Neng CHEN , Kuang-Kai YEN , Ming-Chieh LIU , Tsung-Hsiung LEE
IPC分类号： G01R31/302 , H01L25/065 , G01R31/28 , H02J50/20
CPC分类号： H02J50/40 , G01R31/2856 , G01R31/2884 , G01R31/2889 , G01R31/3025 , G06F17/5068 , H01L23/538 , H01L23/544 , H01L24/16 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2223/54446 , H01L2224/14181 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/81193 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06596 , H01L2924/15192 , H01L2924/15311 , H02J5/005 , H02J50/10 , H02J50/20 , H02J50/80 , H01L2224/81 , H01L2224/1403
摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

7. 发明申请

US20170168910A1 MULTICHIP DEBUGGING METHOD AND MULTICHIP SYSTEM ADOPTING THE SAME 审中-公开
公开(公告)号：US20170168910A1
公开(公告)日：2017-06-15
申请号：US15378871
申请日：2016-12-14
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jong-min KIM , Chan-ho YOON , Jung-pil LEE , Hyung-joon PARK , Jae-ho SIM
IPC分类号： G06F11/22 , G06F11/07 , G06F11/273 , H01L23/544
CPC分类号： G06F11/2215 , G06F11/079 , G06F11/273 , G06F11/2733 , G06F11/3656 , H01L23/544 , H01L2223/54433 , H01L2223/54446
摘要： Provided are a multichip debugging method and a multichip system adopting the same. The multichip system includes: a first chip including a first debugging port and first identification (ID) information, a second chip including a second debugging port and second ID information, and a test access port (TAP) electrically connected to the first debugging port and the second debugging port and configured to connect to a test apparatus via the TAP.

8. 发明授权

US09553217B2 Method of manufacturing semiconductor device and structure with trenches in passivation film 有权
标题翻译：半导体器件制造方法及其在钝化膜中的沟槽结构
公开(公告)号：US09553217B2
公开(公告)日：2017-01-24
申请号：US14734155
申请日：2015-06-09
申请人： CANON KABUSHIKI KAISHA
发明人： Masao Ishioka , Nobutaka Ukigaya
IPC分类号： H01L21/00 , H01L31/0203 , H01L27/146 , H01L31/18 , H01L21/78 , H01L23/544
CPC分类号： H01L31/0203 , H01L21/78 , H01L23/544 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/1868 , H01L2223/54446 , H01L2223/54453
摘要： A method of manufacturing a semiconductor device is provided. The method includes forming a passivation film on a substrate including a first element region, a second element region adjacent to the first element region in a first direction, a third element region adjacent to the first region in a second direction, and a first scribe region extending to the first direction between the first element region and the third element region, forming a first trench in the passivation film between the first scribe region and the first element region, forming a second trench in the passivation film between the third element region and the first scribe region, and forming a film on the passivation film where the trenches have been formed by coating. The each of trenches is formed continuously along the first and the second element region.
摘要翻译：提供一种制造半导体器件的方法。该方法包括在基板上形成钝化膜，该基板包括第一元件区域，与第一元件区域相邻的第二元件区域，在第二方向上与第一区域相邻的第三元件区域，以及第一划线区域在所述第一元件区域和所述第三元件区域之间延伸到所述第一方向，在所述钝化膜中在所述第一划线区域和所述第一元件区域之间形成第一沟槽，在所述第三元件区域和所述第一元件区域之间的所述钝化膜中形成第二沟槽，第一刻划区域，并且通过涂覆在其上形成沟槽的钝化膜上形成膜。每个沟槽沿着第一和第二元件区域连续地形成。

9. 发明申请

US20130341783A1 INTERPOSER WITH IDENTIFICATION SYSTEM 审中-公开
标题翻译：具有识别系统的插件
公开(公告)号：US20130341783A1
公开(公告)日：2013-12-26
申请号：US13529736
申请日：2012-06-21
申请人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
发明人： Michael Alfano , Joe Siegel , Michael Z. Su , Bryan Black , Julius Din
IPC分类号： H01L21/50 , H01L23/52
CPC分类号： H01L23/49827 , H01L22/14 , H01L22/20 , H01L23/147 , H01L23/49822 , H01L23/5382 , H01L23/544 , H01L24/16 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2223/5444 , H01L2223/54446 , H01L2223/54453 , H01L2223/54473 , H01L2223/54486 , H01L2224/1134 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13164 , H01L2224/13169 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2224/81 , H01L2924/01047 , H01L2924/00012 , H01L2924/01029 , H01L2924/00014 , H01L2924/00
摘要： Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.
摘要翻译：公开了各种插入件及其制造方法。一方面，提供一种制造方法，其包括将识别结构耦合到插入器。识别结构可操作以提供关于插入器的识别信息。识别结构是可编程的，以创建或改变识别信息。

10. 发明授权

US08322626B2 Integrated circuit with embedded RFID 有权
标题翻译：集成电路与嵌入式RFID
公开(公告)号：US08322626B2
公开(公告)日：2012-12-04
申请号：US13078919
申请日：2011-04-01
申请人： Hee-Bok Kang , Jin-Hong Ahn
发明人： Hee-Bok Kang , Jin-Hong Ahn
IPC分类号： G06K19/06
CPC分类号： H01L23/544 , G06K19/07749 , G06K19/07775 , G06K19/07779 , H01L2223/54433 , H01L2223/54446 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) die includes a high capacitance solid state circuit region configured to perform predetermined operations and an RFID block configured for wireless communication with an external source. The RFID block is configured to record results from a plurality of stages of a manufacturing process. The RFID block is further configured to generate an internal BIST command in response to an external command wirelessly received by the RFID. The integrated circuit die also includes a built-in self-test (BIST) block coupled to carry out testing of the high capacitance solid state circuit region in response to the internal BIST command. The RFID block is configured to be capable of storing store information relating to the testing. The RFID block is further configured to enable wireless retrieval of the test results from the testing of the high capacitance solid state circuit region.
摘要翻译：集成电路（IC）管芯包括被配置为执行预定操作的高电容固态电路区域和被配置为与外部源无线通信的RFID块。 RFID块被配置为记录来自制造过程的多个阶段的结果。 RFID块还被配置为响应于RFID无线接收的外部命令而生成内部BIST命令。集成电路管芯还包括内部自检（BIST）块，其耦合以响应于内部BIST命令执行高电容固态电路区域的测试。 RFID块被配置为能够存储与测试相关的存储信息。 RFID块还被配置为使得能够从测试高电容固态电路区域的无线检索测试结果。

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