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1. 发明申请

US20180315699A1 POST-GRIND DIE BACKSIDE POWER DELIVERY 审中-公开
公开(公告)号：US20180315699A1
公开(公告)日：2018-11-01
申请号：US16030053
申请日：2018-07-09
申请人： Intel Corporation
发明人： Min-Tih Ted Lai , Tyler Leuten , Florence R. Pon
IPC分类号： H01L23/498 , H01L21/48 , H01L25/065 , H01L23/522
CPC分类号： H01L23/49838 , H01L23/50 , H01L23/5222 , H01L23/5223 , H01L23/5286 , H01L23/5383 , H01L25/0657 , H01L2224/04042 , H01L2224/16157 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/10253 , H01L2924/15192 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a backside. The top side may include a plurality of pad connections. The plurality of vias may extend through the material layer from the top side to the backside. The plurality of metal channels may be in contact with the backside. Each of the plurality of metal channels may be in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias.

2. 发明授权

US10032707B2 Post-grind die backside power delivery 有权
公开(公告)号：US10032707B2
公开(公告)日：2018-07-24
申请号：US15391587
申请日：2016-12-27
申请人： Intel Corporation
发明人： Min-Tih Ted Lai , Tyler Leuten , Florence R. Pon
IPC分类号： H01L23/498 , H01L21/48 , H01L25/065 , H01L23/06
CPC分类号： H01L23/49838 , H01L23/50 , H01L23/5222 , H01L23/5223 , H01L23/5286 , H01L23/5383 , H01L25/0657 , H01L2224/04042 , H01L2224/16157 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/10253 , H01L2924/15192 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a backside. The top side may include a plurality of pad connections. The plurality of vias may extend through the material layer from the top side to the backside. The plurality of metal channels may be in contact with the backside. Each of the plurality of metal channels may be in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias.

3. 发明授权

US10014270B2 Protrusion bump pads for bond-on-trace processing 有权
公开(公告)号：US10014270B2
公开(公告)日：2018-07-03
申请号：US15215350
申请日：2016-07-20
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Yu-Min Liang , Jiun Yi Wu
IPC分类号： H01L21/00 , H01L23/00 , H01L23/498 , H01L21/48 , H05K3/40 , H01L25/065 , H01L25/00 , H05K1/11 , H05K3/46
CPC分类号： H01L24/16 , H01L21/4853 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L23/49838 , H01L23/49866 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/16157 , H01L2224/16225 , H01L2224/16238 , H01L2225/06513 , H01L2924/12042 , H01L2924/14 , H01L2924/381 , H01L2924/3841 , H05K1/111 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014
摘要： An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface, wherein the exposed top surface is recessed from a top surface of the dielectric layer. Furthermore, the bump pad is disposed over and is electrically connected to a second portion of the conductive trace.

4. 发明申请

US20180182699A1 POST-GRIND DIE BACKSIDE POWER DELIVERY 审中-公开
公开(公告)号：US20180182699A1
公开(公告)日：2018-06-28
申请号：US15391587
申请日：2016-12-27
申请人： Intel Corporation
发明人： Min-Tih Ted Lai , Tyler Leuten , Florence R. Pon
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L25/065
CPC分类号： H01L23/49838 , H01L21/486 , H01L23/49827 , H01L23/5223 , H01L23/5286 , H01L25/0657 , H01L2224/04042 , H01L2224/16157 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2924/10253 , H01L2924/15192 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a backside. The top side may include a plurality of pad connections. The plurality of vias may extend through the material layer from the top side to the backside. The plurality of metal channels may be in contact with the backside. Each of the plurality of metal channels may be in electrical communication with at least one of the plurality of pad connections and at least one of the plurality of vias.

5. 发明申请

US20180082922A1 ELECTRONIC PACKAGE COVER HAVING UNDERSIDE RIB 审中-公开
公开(公告)号：US20180082922A1
公开(公告)日：2018-03-22
申请号：US15791028
申请日：2017-10-23
申请人： International Business Machines Corporation
发明人： Kamal K. Sikka , Krishna R. Tunga
IPC分类号： H01L23/367 , H01L23/00 , H01L21/48 , H01L21/56
CPC分类号： H01L23/3675 , H01L21/563 , H01L23/373 , H01L23/3736 , H01L23/42 , H01L24/16 , H01L2224/16157
摘要： An electronic package lid which includes one or more underside ribs. The ribs have a major length and a minor width and are generally aligned to be parallel with a diagonal or normal bisector of the processing device. The underside rib generally stiffens the cover such that an upper surface of the cover is more apt to stay flat. As such, cover warpage and, therefore, the peeling of the TIM1 and delamination of underfill due to the physical or dimensional expansion of the processing device and/or a carrier may be reduced. As a result, the surface area dedicated for the seal material upon the carrier surface may be reduced, thereby increasing the available surface area upon the carrier for additional electronic components to be placed in close proximity to the processing device.

6. 发明申请

US20170170109A1 INTEGRATED CIRCUIT STRUCTURES WITH INTERPOSERS HAVING RECESSES 审中-公开
公开(公告)号：US20170170109A1
公开(公告)日：2017-06-15
申请号：US15038001
申请日：2015-06-25
申请人： Intel Corporation
发明人： KYU-OH LEE , ISLAM A. SALAMA
IPC分类号： H01L23/498 , H01L23/66 , H01L21/48 , H01L23/00
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/4857 , H01L23/13 , H01L23/48 , H01L23/49822 , H01L23/49833 , H01L23/50 , H01L23/5385 , H01L23/66 , H01L24/16 , H01L25/0655 , H01L25/0657 , H01L2223/6666 , H01L2224/16157 , H01L2224/16197 , H01L2224/16225 , H01L2924/1205 , H01L2924/15311
摘要： Disclosed herein are integrated circuit (IC) structures having interposers with recesses. For example, an IC structure may include: an interposer having a resist surface; a recess disposed in the resist surface, wherein a bottom of the recess is surface-finished; and a plurality of conductive contacts located at the resist surface. Other embodiments may be disclosed and/or claimed.

7. 发明授权

US09530745B2 Electronic apparatus and method for fabricating the same 有权
公开(公告)号：US09530745B2
公开(公告)日：2016-12-27
申请号：US15142690
申请日：2016-04-29
申请人： FUJITSU LIMITED
发明人： Kozo Shimizu , Seiki Sakuyama
IPC分类号： H01L23/00 , H01L25/065 , H01L23/367 , H01L25/00 , B23K1/00 , B23K3/08 , H01L23/488 , H01L23/498 , H01L23/31 , H05K1/02 , H05K3/34 , H01L23/14
CPC分类号： H01L24/17 , B23K1/0008 , B23K1/0016 , B23K3/085 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K2101/40 , B23K2101/42 , H01L23/145 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/488 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/73 , H01L24/75 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05624 , H01L2224/05647 , H01L2224/11334 , H01L2224/1146 , H01L2224/13016 , H01L2224/13076 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1601 , H01L2224/16145 , H01L2224/16157 , H01L2224/16235 , H01L2224/16238 , H01L2224/16505 , H01L2224/16507 , H01L2224/24137 , H01L2224/24195 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/75253 , H01L2224/75501 , H01L2224/75502 , H01L2224/759 , H01L2224/81005 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81411 , H01L2224/81815 , H01L2224/81948 , H01L2224/81986 , H01L2225/06513 , H01L2924/014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/10335 , H01L2924/13091 , H01L2924/15311 , H01L2924/15313 , H01L2924/1579 , H01L2924/16235 , H01L2924/16251 , H01L2924/1659 , H01L2924/16747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3512 , H01L2924/35121 , H05K1/0203 , H05K1/09 , H05K1/113 , H05K3/3436 , H05K3/3463 , H05K2201/0248 , H05K2201/09972 , H05K2201/1056 , H05K2203/1121 , H05K2203/304 , H01L2924/00012 , H01L2924/01047 , H01L2924/00014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01079 , H01L2924/01046 , H01L2924/00
摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

8. 发明授权

US09508617B2 Test chip, test board and reliability testing method 有权
标题翻译：测试芯片，测试板和可靠性测试方法
公开(公告)号：US09508617B2
公开(公告)日：2016-11-29
申请号：US13411193
申请日：2012-03-02
申请人： Shiang-Ruei Su , Liang-Chen Lin , Chia-Wei Tu
发明人： Shiang-Ruei Su , Liang-Chen Lin , Chia-Wei Tu
IPC分类号： H01L21/66 , G01R31/28
CPC分类号： G01R31/2856 , H01L21/4853 , H01L22/14 , H01L22/34 , H01L24/16 , H01L2224/16157 , H01L2924/0002 , H01L2924/00
摘要： A test board includes a first chip mounting area, a first input area, a second input area, a first output area, and a second output area. The test board also includes a first conductive pattern, a second conductive pattern, a third conductive pattern, and a fourth conductive pattern. The first conductive pattern electrically connects a first pin of the first input area and a first pin of the first chip mounting area. The second conductive pattern electrically connects a first pin of the second input area and a second pin of the first chip mounting area. The third conductive pattern electrically connects a first pin of the first output area and a third pin of the first chip mounting area. The fourth conductive pattern electrically connects a first pin of the second output area and a fourth pin of the first chip mounting area.
摘要翻译：测试板包括第一芯片安装区域，第一输入区域，第二输入区域，第一输出区域和第二输出区域。测试板还包括第一导电图案，第二导电图案，第三导电图案和第四导电图案。第一导电图形电连接第一输入区域的第一引脚和第一芯片安装区域的第一引脚。第二导电图形电连接第二输入区域的第一引脚和第一芯片安装区域的第二引脚。第三导电图形电连接第一输出区域的第一引脚和第一芯片安装区域的第三引脚。第四导电图形电连接第二输出区域的第一引脚和第一芯片安装区域的第四引脚。

9. 发明授权

US09490232B2 Electronic apparatus and method for fabricating the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US09490232B2
公开(公告)日：2016-11-08
申请号：US14532032
申请日：2014-11-04
申请人： FUJITSU LIMITED
发明人： Kozo Shimizu , Seiki Sakuyama
IPC分类号： H01L25/065 , H01L23/367 , H01L23/00 , H01L25/00 , B23K1/00 , B23K3/08 , H01L23/488 , H01L23/498 , H01L23/31 , H05K1/02 , H05K3/34 , H01L23/14
CPC分类号： H01L24/17 , B23K1/0008 , B23K1/0016 , B23K3/085 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K2101/40 , B23K2101/42 , H01L23/145 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/488 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/73 , H01L24/75 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05624 , H01L2224/05647 , H01L2224/11334 , H01L2224/1146 , H01L2224/13016 , H01L2224/13076 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1601 , H01L2224/16145 , H01L2224/16157 , H01L2224/16235 , H01L2224/16238 , H01L2224/16505 , H01L2224/16507 , H01L2224/24137 , H01L2224/24195 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/75253 , H01L2224/75501 , H01L2224/75502 , H01L2224/759 , H01L2224/81005 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81411 , H01L2224/81815 , H01L2224/81948 , H01L2224/81986 , H01L2225/06513 , H01L2924/014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/10335 , H01L2924/13091 , H01L2924/15311 , H01L2924/15313 , H01L2924/1579 , H01L2924/16235 , H01L2924/16251 , H01L2924/1659 , H01L2924/16747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3512 , H01L2924/35121 , H05K1/0203 , H05K1/09 , H05K1/113 , H05K3/3436 , H05K3/3463 , H05K2201/0248 , H05K2201/09972 , H05K2201/1056 , H05K2203/1121 , H05K2203/304 , H01L2924/00012 , H01L2924/01047 , H01L2924/00014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01079 , H01L2924/01046 , H01L2924/00
摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
摘要翻译：电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。接合部分包含杆状化合物，从而提高接合部分的强度。当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。在该状态下将接合材料冷却并固化。通过这样做，形成极点状化合物。

10. 发明申请

US20150162312A1 ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20150162312A1
公开(公告)日：2015-06-11
申请号：US14532032
申请日：2014-11-04
申请人： FUJITSU LIMITED
发明人： Kozo Shimizu , Seiki Sakuyama
IPC分类号： H01L25/065 , B23K3/08 , H01L25/00 , B23K1/00 , H01L23/367 , H01L23/00
CPC分类号： H01L24/17 , B23K1/0008 , B23K1/0016 , B23K3/085 , B23K35/0244 , B23K35/262 , B23K35/264 , B23K2101/40 , B23K2101/42 , H01L23/145 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/488 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/73 , H01L24/75 , H01L24/81 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/05082 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05624 , H01L2224/05647 , H01L2224/11334 , H01L2224/1146 , H01L2224/13016 , H01L2224/13076 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1601 , H01L2224/16145 , H01L2224/16157 , H01L2224/16235 , H01L2224/16238 , H01L2224/16505 , H01L2224/16507 , H01L2224/24137 , H01L2224/24195 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/75253 , H01L2224/75501 , H01L2224/75502 , H01L2224/759 , H01L2224/81005 , H01L2224/81075 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81411 , H01L2224/81815 , H01L2224/81948 , H01L2224/81986 , H01L2225/06513 , H01L2924/014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/10335 , H01L2924/13091 , H01L2924/15311 , H01L2924/15313 , H01L2924/1579 , H01L2924/16235 , H01L2924/16251 , H01L2924/1659 , H01L2924/16747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3512 , H01L2924/35121 , H05K1/0203 , H05K1/09 , H05K1/113 , H05K3/3436 , H05K3/3463 , H05K2201/0248 , H05K2201/09972 , H05K2201/1056 , H05K2203/1121 , H05K2203/304 , H01L2924/00012 , H01L2924/01047 , H01L2924/00014 , H01L2924/01029 , H01L2924/01028 , H01L2924/01079 , H01L2924/01046 , H01L2924/00
摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
摘要翻译：电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。接合部分包含杆状化合物，从而提高接合部分的强度。当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。在该状态下将接合材料冷却并固化。通过这样做，形成极点状化合物。

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