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1. 发明授权

US09955617B2 Electronic circuit component mounting method and mounting system 有权
公开(公告)号：US09955617B2
公开(公告)日：2018-04-24
申请号：US14769552
申请日：2013-02-25
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Mizuho Nozawa
IPC分类号： H05K13/04 , H05K3/30 , H05K13/08
CPC分类号： H05K13/0404 , H05K3/30 , H05K13/0417 , H05K13/043 , H05K13/0452 , H05K13/08 , H05K13/085
摘要： A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body, and a bulk feeder which is head-side feeder moved to any position on a movement plane covering a circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder is improved. A reception order is determined, so as to reduce the number of times a mounting head moves between the circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder and the receiving of first type components supplied from the tape feeder and the receiving of second type components supplied from the bulk feeder are respectively performed together as a batch.

2. 发明申请

US20180007794A1 METHOD AND SYSTEM FOR POPULATING PRINTED CIRCUIT BOARDS 审中-公开
公开(公告)号：US20180007794A1
公开(公告)日：2018-01-04
申请号：US15542974
申请日：2015-11-17
申请人： Siemens Aktiengesellschaft
发明人： Alexander Pfaffinger , Christian Royer
IPC分类号： H05K3/00 , G05B19/418
CPC分类号： H05K3/0005 , G05B19/41865 , H05K3/0097 , H05K13/085
摘要： Provided is a method for populating printed circuit boards, which includes the steps of registering jobs in each case relating to the population of a number of printed circuit boards of a printed circuit board type with components of predetermined component types, assigning printed circuit board types of the registered jobs to a predetermined number of fixed set-up families, optimizing the assignment in such a way that a characteristic number relating to all the pick-and-place lines of the pick-and-place system is optimized as far as possible, and populating the printed circuit boards on one of the pick-and-place lines by using one of the fixed set-ups.

3. 发明授权

US09474194B2 Electronic component mounting system 有权
标题翻译：电子元件安装系统
公开(公告)号：US09474194B2
公开(公告)日：2016-10-18
申请号：US13992060
申请日：2011-12-07
申请人： Takeyuki Kawase , Kazuhiko Itose
发明人： Takeyuki Kawase , Kazuhiko Itose
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0452 , H05K13/04 , H05K13/08 , H05K13/085 , Y10T29/4913 , Y10T29/53174
摘要： An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.
摘要翻译：通过将多个具有第一安装通道（L1）和第二安装通道（L2）的电子部件安装装置（M2）连接到（M5 *）而构成的电子部件安装系统被构造成能够执行从使一个操作性能机构的第一操作模式中选择的任何一个执行操作性能，同时仅将作为对应于操作性能机构的基板传送机构的基板作为目标，并且其中一个操作性能机构能够以多个基板输送机构输送的多个基板作为目标，并且只有两个电子部件安装装置（M5 *）分别配备有托盘进给器（30））进入第二操作模式。

4. 发明授权

US09456505B2 Component mounting method 有权
标题翻译：组件安装方法
公开(公告)号：US09456505B2
公开(公告)日：2016-09-27
申请号：US14116256
申请日：2012-03-08
申请人： Masaru Sakamoto
发明人： Masaru Sakamoto
IPC分类号： H05K3/30 , H05K13/04 , H05K13/08 , H05K3/00
CPC分类号： H05K3/301 , H05K3/0008 , H05K13/0452 , H05K13/08 , H05K13/085 , Y10T29/4913 , Y10T29/49778
摘要： The present invention relates to a setup method for deciding component feeding apparatuses to be attached to each of mounting machines in a component mounting system. The setup method includes a first step of deciding component feeding apparatuses to be attached to each of the mounting machines based on substrate data defining components to be mounted by each of the mounting machines; a second step of determining whether or not there is within the components included in the substrate data a sole mounted component to be mounted by only one mounting machine among the multiple mounting machines; and a third step of deciding, when the determination is made that the sole mounted component exists, to attach component feeding apparatuses feeding the sole mounted component or an alternative component capable of replacing the sole mounted component onto at least one mounting machine other than the only one mounting machine.
摘要翻译：本发明涉及一种用于在部件安装系统中确定要安装到每个安装机上的部件供给装置的设置方法。该设置方法包括：第一步骤，基于基于定义要由每个安装机器安装的部件的基板数据来确定要附接到每个安装机器的部件供给装置; 确定在所述多个安装机中仅由一个安装机安装的唯一安装部件中是否存在包括在所述基板数据中的部件内的第二步骤; 以及第三步骤，当确定存在唯一安装的部件时，将馈送鞋底安装部件的部件进给装置或能够将唯一安装的部件替换到除了唯一安装部件之外的至少一个安装机器的替代部件一台安装机。

5. 发明申请

US20160143197A1 METHOD FOR EQUIPPING PRINTED CIRCUIT BOARDS 有权
标题翻译：装备印刷电路板的方法
公开(公告)号：US20160143197A1
公开(公告)日：2016-05-19
申请号：US14932152
申请日：2015-11-04
申请人： ASM Assembly Systems GmbH & Co. KG
发明人： Franz HEUBERGER , Rudolf KIENER , Christian MEISSNER
IPC分类号： H05K13/04 , H05K13/08 , H05K13/00 , H05K3/30
CPC分类号： H05K13/0495 , H05K3/30 , H05K13/0015 , H05K13/0061 , H05K13/08 , H05K13/085 , Y10T29/49124 , Y10T29/49131
摘要： A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2). According to the method, first printed circuit boards (5) of the first length are stored temporarily in a buffer region (6) of the equipping section (2), and consequently have a shorter transport path to an equipping post (4) of the equipping section (2) than from the input section (1).
摘要翻译：一种用于将印刷电路板装配在装备机器上的方法，所述印刷电路板具有第一长度，并且所述装备机器被实现为装备第二长度的印刷电路板，所述第二长度是所述第一长度的两倍以上长度。装备机具有输入部分（1）和装备部分（2），装备部分（2）在印刷电路板的输送方向（F）之后设置在输入部分（1）之后，输入部分（1）沿着印刷电路板的传送方向，第一长度的印刷电路板和第二长度的印刷电路板在其纵向方向上从输入部分（1）输送到装备站（2）。根据该方法，将第一长度的第一印刷电路板（5）临时存储在装备部分（2）的缓冲区域（6）中，因此具有较短的到达装备部分（4）的输送路径装备部分（2）比输入部分（1）。

6. 发明授权

US09247685B2 Multi-component nozzle system 有权
标题翻译：多组分喷嘴系统
公开(公告)号：US09247685B2
公开(公告)日：2016-01-26
申请号：US13838416
申请日：2013-03-15
申请人： John S. Youngquist
发明人： John S. Youngquist
IPC分类号： H05K13/00 , H05K13/04
CPC分类号： G06T7/001 , G06T7/0004 , G06T11/00 , G06T2207/10016 , G06T2207/30141 , H01L24/75 , H01L2224/75745 , H01L2224/75753 , H01L2224/75901 , H01L2924/12042 , H01L2924/12043 , H05K13/0408 , H05K13/0409 , H05K13/0417 , H05K13/0419 , H05K13/08 , H05K13/0812 , H05K13/0815 , H05K13/085 , H01L2924/00
摘要： A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes a vacuum nozzle to pick up the components from the tape and a rack gear to engage and drive the feeder gear of the feeder cartridge via translational motion of the pickup head when operatively disposed with respect to a selected feeder cartridge.
摘要翻译：拾取和放置机器和方法包括使用包括进给齿轮的无源元件供给盒。进给齿轮的旋转会使一个部件承载带通过进料盒进给。拾取头包括一个真空喷嘴，用于从胶带上拾取部件和一个齿条，用于在相对于选定的进料盒操作地设置时通过拾取头的平移运动来接合和驱动进给盒的进料器齿轮。

7. 发明申请

US20160007513A1 ELECTRONIC CIRCUIT COMPONENT MOUNTING METHOD AND MOUNTING SYSTEM 有权
标题翻译：电子电路组件安装方法和安装系统
公开(公告)号：US20160007513A1
公开(公告)日：2016-01-07
申请号：US14769552
申请日：2013-02-25
申请人： FUJI MACHINE MFG. CO., LTD.
发明人： Mizuho NOZAWA
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0404 , H05K3/30 , H05K13/0417 , H05K13/043 , H05K13/0452 , H05K13/08 , H05K13/085
摘要： A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body, and a bulk feeder which is head-side feeder moved to any position on a movement plane covering a circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder is improved. A reception order is determined, so as to reduce the number of times a mounting head moves between the circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder and the receiving of first type components supplied from the tape feeder and the receiving of second type components supplied from the bulk feeder are respectively performed together as a batch.
摘要翻译：一种由电子电路部件安装机进行的安装方法，该电子电路部件安装机包括由安装机主体固定的安装机主体侧进料器的带式进料器和头部进料器移动到任何位置的批量进料器在覆盖电路基板输送保持装置的移动面和安装机 - 主体侧进料器上。确定接收订单，以便减少安装头在电路基板输送保持装置与安装机 - 主体侧进料器之间移动的次数以及从带供给的第一类型部件的接收进料器和从批量进料器供应的第二类型部件的接收分别一起作为批次执行。

8. 发明授权

US09204586B2 Electronic-circuit assembling process 有权
标题翻译：电子电路组装过程
公开(公告)号：US09204586B2
公开(公告)日：2015-12-01
申请号：US13154837
申请日：2011-06-07
申请人： Daisuke Kato , Hiroyuki Haneda
发明人： Daisuke Kato , Hiroyuki Haneda
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/0452 , H05K13/08 , H05K13/084 , H05K13/085 , Y10T29/49124
摘要： An electronic-circuit assembling process to be carried out in an electronic-circuit assembling system, for assembling an electronic circuit, by mounting electronic circuit components supplied from a component supplier, onto a circuit board, wherein the electronic circuit components includes at least one of different-property components having respective different electrical properties. The process includes: (a) a different-property-component-related information obtaining step of obtaining a different-property-component-related information including (a-i) a property-related information that enables recognition of the electrical property of the different-property component supplied from the component supplier and (a-ii) a different-property-component supply position that is a position of the component supplier supplying the different-property component, such that the different-property-component-related information is obtained by detecting the property-related information and/or the different-property-component supply position; (b) a mounting step of mounting, based on information related to the different-property-component supply position, the electronic circuit components including the different-property component, onto the circuit board; and (c) a property-related information providing step of providing the circuit board with the property-related information of the different-property component mounted on the circuit board.
摘要翻译：一种在电子电路组装系统中进行的电子电路组装过程，用于组装电子电路，通过将从部件供应商提供的电子电路部件安装到电路板上，其中电子电路部件包括以下各项中的至少一个：不同性质的组分具有不同的电性能。该过程包括：（a）不同的属性组件相关信息获取步骤，用于获得不同的属性组件相关信息，所述信息包括（ai）能够识别不同属性的电性能的属性相关信息从组件供应商提供的组件和（a-ii）作为供应不同属性组件的组件供应商的位置的不同的属性组件供应位置，使得通过检测不同的属性组件相关信息财产相关信息和/或不同的财产成分供应位置; （b）基于与所述不同特性成分供给位置有关的信息，将包含所述不同特性成分的所述电子电路部件安装到所述电路基板上的安装步骤; （c）属性相关信息提供步骤，向电路板提供安装在电路板上的不同属性部件的属性相关信息。

9. 发明申请

US20150223370A1 WORK SYSTEM FOR SUBSTRATES AND WORKING MACHINE 有权
标题翻译：基板和机床工作系统
公开(公告)号：US20150223370A1
公开(公告)日：2015-08-06
申请号：US14414928
申请日：2012-07-17
申请人： Junichi Suzuki
发明人： Junichi Suzuki
IPC分类号： H05K13/04 , B65G43/08 , B65G43/00 , B65G37/00
CPC分类号： B65G43/10 , B65G37/00 , B65G43/00 , B65G43/08 , B65G2811/0673 , H05K13/0061 , H05K13/04 , H05K13/08 , H05K13/0817 , H05K13/085
摘要： In a work system for substrates which includes plural working machines conveying circuit substrates through two paths and in which the circuit substrates are conveyed through the two paths from the working machine disposed upstream out of the plural working machines to the working machine disposed downstream, a circuit substrate of which the work result is not good is conveyed to the downstream working machine earlier than the circuit substrate of which the work result is good in a state in which the circuit substrate of which the work result is good and the circuit substrate of which the work result is not good are able to be conveyed to the downstream working machine by the upstream working machine.
摘要翻译：在基板的工作系统中，包括通过两条路径输送电路基板的多个工作机械，其中，电路基板从设置在多个加工机械的上游的作业机械的两条路径输送到设置在下游的工作机械，工作结果不好的基板比工作结果良好的电路基板的状态良好地输送到下游工作机械，其中工作结果良好的电路基板和其工作结果良好的电路基板工作结果不好，能够通过上游工作机向下游工作机输送。

10. 发明申请

US20150160648A1 Allocation of Printed Circuit Boards on Fitting Lines 审中-公开
标题翻译：印刷电路板在配线上的分配
公开(公告)号：US20150160648A1
公开(公告)日：2015-06-11
申请号：US14412790
申请日：2013-04-24
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Daniel Craiovan , Norbert Herold , Thorsten Kemper , Alexander Pfaffinger , Christian Royer
IPC分类号： G05B19/418
CPC分类号： G05B19/418 , G05B2219/45031 , H05K13/08 , H05K13/085
摘要： A method for allocating printed circuit boards to the fitting lines of a fitting system configured for fitting printed circuit boards with electronic components includes: determining requirements for fitting each of a plurality of printed circuit boards with respective components; and allocating the printed circuit boards to fitting lines under predetermined conditions by integral linear programming. The allocation is carried out such that differences between the component variances of the fitting lines are minimized. The component variance of a fitting line represent the number of different components configured to be fitted to all printed circuit boards allocated to the fitting line.
摘要翻译：一种用于将印刷电路板分配到配置用于将印刷电路板与电子部件配合的配合系统的装配线的方法包括：确定将多个印刷电路板中的每一个与各个部件相配合的要求; 并且通过积分线性规划在预定条件下将印刷电路板分配到拟合线。执行分配，使得拟合线的分量方差之间的差最小化。拟合线的分量变化表示配置成拟合到分配给拟合线的所有印刷电路板的不同部件的数量。

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