专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20180324943A1 PRINTED WIRING BOARD 审中-公开
公开(公告)号：US20180324943A1
公开(公告)日：2018-11-08
申请号：US15773797
申请日：2016-10-12
申请人： FUJIKURA LTD.
发明人： Yasuo Fukuda , Takayuki Okamura
IPC分类号： H05K1/02 , H05K1/11 , H05K1/09 , H05K1/14
CPC分类号： H05K1/0281 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/147 , H05K2201/032 , H05K2201/0332
摘要： A printed wiring board includes: an insulating base material; a first conductive layer disposed on a main surface of the insulating base material in a first region and a second region defined on a plane along the main surface; a second conductive layer disposed on a main surface of the first conductive layer in the first region; and an insulating layer disposed on the main surface of the first conductive layer in the second region. The ratio of a first evaluation value E1 to a second evaluation value E2 is 0.91 or more and 0.99 or less. The first evaluation value E1 is an evaluation value of strength of a first laminated part in the first region and the second evaluation value E2 is an evaluation value of strength of a second laminated part in the second region.

2. 发明申请

US20180270953A1 BUILD-UP HIGH-ASPECT RATIO OPENING 审中-公开
公开(公告)号：US20180270953A1
公开(公告)日：2018-09-20
申请号：US15464123
申请日：2017-03-20
申请人： Intel Corporation
发明人： Frank Truong , Dilan Seneviratne
IPC分类号： H05K1/11 , H05K1/09 , H05K3/06 , H05K3/46
CPC分类号： H05K3/06 , H05K1/09 , H05K1/111 , H05K1/116 , H05K3/061 , H05K3/068 , H05K3/4644 , H05K2201/0166 , H05K2201/032
摘要： Embodiments herein relate to creating a high-aspect ratio opening in a package. Embodiments may include applying a first laminate layer on a side of a substrate, applying a seed layer to at least part of the laminate layer, building up one or more copper pads on the seed layer, etching the seed layer to expose a portion of the first laminate layer, applying a second laminate layer to fill in around the sides of one or more copper pads, and removing part of the buildup copper pads. Other embodiments may be described and/or claimed.

3. 发明授权

US09930773B2 Flexible interconnect 有权
公开(公告)号：US09930773B2
公开(公告)日：2018-03-27
申请号：US15188453
申请日：2016-06-21
申请人： Microsoft Technology Licensing, LLC
发明人： James David Holbery , Siyuan Ma , Michael David Dickey
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/10 , H05K3/46 , G06F1/16
CPC分类号： H05K1/0272 , G06F1/1613 , H01R12/59 , H01R12/77 , H05K1/028 , H05K1/0281 , H05K1/03 , H05K1/092 , H05K1/148 , H05K3/10 , H05K3/1275 , H05K3/361 , H05K3/4644 , H05K2201/032 , H05K2201/0338 , H05K2201/0391 , H05K2201/055 , H05K2201/09009 , H05K2201/09736 , H05K2203/0776
摘要： Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

4. 发明申请

US20170273182A1 COMPOSITION FOR FORMING CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN USING SAME, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN 有权
公开(公告)号：US20170273182A1
公开(公告)日：2017-09-21
申请号：US15503637
申请日：2015-09-01
申请人： LG CHEM, LTD.
发明人： Chee-Sung PARK , Cheol-Hee PARK , Ha Na LEE , Ha Nah JEONG , Jae Hyun KIM , Hsin Hee JUN , Eun Kyu SEONG , Su Jeong LEE
IPC分类号： H05K1/09 , H05K3/10 , C23C18/20 , C08K3/22 , C08J7/12 , C23C18/16 , H05K1/03 , H05K3/18
CPC分类号： H05K1/09 , C08J7/123 , C08J2369/00 , C08K3/22 , C08K2003/2248 , C08K2003/2293 , C23C18/1612 , C23C18/1641 , C23C18/2013 , C23C18/204 , H01B1/22 , H01B5/14 , H01B13/00 , H05K1/0353 , H05K3/105 , H05K3/181 , H05K2201/032
摘要： The present invention relates to a composition for forming a conductive pattern which allows micro conductive patterns to be formed on various polymeric resin products or resin layers by a very simplified process, a method for forming a conductive pattern using the composition, and a resin structure having the conductive pattern. The composition for forming a conductive pattern comprises: a polymeric resin; and a nonconductive metallic compound including a first metal, a second metal and a third metal, wherein the nonconductive metallic compound has a three-dimensional structure including a plurality of first layers (edge-shared octahedral layers) having a structure in which octahedrons comprising two metals from among the first metal, the second metal and the third metal which share the edges thereof with one another are two-dimensionally connected to one other, and a second layer which includes a metal of a different type from the first layer and is arranged between adjacent first layers, and wherein a metallic core including the first metal, the second metal or the third metal or an ion thereof is formed from the nonconductive metallic compound by electromagnetic radiation.

5. 发明申请

US20170130354A1 METHOD OF FORMING A METAL LAYER AND METHOD OF MANUFACTURING A SUBSTRATE HAVING SUCH METAL LAYER 有权
公开(公告)号：US20170130354A1
公开(公告)日：2017-05-11
申请号：US15127433
申请日：2015-03-12
申请人： Atotech Deutschland GmbH
发明人： Tadahiro NISHIGAWA , Jun HIGUCHI , Hitoshi ISHIKAWA
IPC分类号： C25D5/34 , H05K1/02 , H05K3/42 , C25D3/38 , H05K3/46
CPC分类号： C25D5/34 , C25D3/38 , C25D5/56 , H05K1/0296 , H05K3/424 , H05K3/427 , H05K3/467 , H05K2201/032 , H05K2201/0329 , H05K2203/0793 , H05K2203/0796
摘要： In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.

6. 发明授权

US09591752B2 Articles with conductive micro-wire pattern 有权
标题翻译：具有导电微线图案的文章
公开(公告)号：US09591752B2
公开(公告)日：2017-03-07
申请号：US14836052
申请日：2015-08-26
申请人： Eastman Kodak Company
发明人： Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright , Julie A. Cummings
IPC分类号： H05K1/00 , H05K1/09 , H05K3/00 , H05K1/02 , H05K3/04 , H05K3/22 , G03F7/00 , H05K1/03
CPC分类号： H05K1/09 , G03F7/0002 , G03F7/0035 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0313 , H05K3/0023 , H05K3/04 , H05K3/22 , H05K2201/0108 , H05K2201/032
摘要： Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity
摘要翻译：导电性物品和器件具有通过在变形温度低于150℃的透明柔性基底上固化光固化层形成的导电微线。光固化层在温度微通道形成时的粘度<5,000帕斯卡 - 秒微通道的平均宽度小于或等于4μm，平均深度和平均宽度比大于或等于1.光固化层暴露于固化紫外线辐射以形成光固化微观图案并且在光固化微通道中形成包含金属纳米颗粒的导电组合物。导电组合物以光固化微通道的图案固化，以在透明柔性基底上的光固化微通道的图案中提供导电微线图案。至少50％的导电微细线中的每一个具有小于0.025欧姆/平方的薄层电阻。

7. 发明申请

US20170027066A1 Printed circuit board and corresponding method for producing a printed circuit board 审中-公开
标题翻译：印刷电路板及印刷电路板的制造方法
公开(公告)号：US20170027066A1
公开(公告)日：2017-01-26
申请号：US15286269
申请日：2016-10-05
申请人： Rohde & Schwarz GmbH & Co. KG
发明人： Uwe Hassel
IPC分类号： H05K3/40 , H05K1/11 , H05K3/06
CPC分类号： H05K3/4084 , C23C16/14 , C23C28/023 , C25D7/123 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/064 , H05K3/427 , H05K2201/032 , H05K2201/0959 , H05K2203/1476 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.
摘要翻译：具有至少一个在相应的上表面上和相应的下表面上具有信号线的基底层的印刷电路板在上表面和下表面之间的至少一个通孔的圆周上具有套筒尺寸的导电层，用于导电连接在上表面上的至少一个信号线和下表面上的至少一个信号线之间。套筒尺寸的导电层的轴向扩大在上表面上的铜基底层上方在下表面上的铜基底下方径向弯曲。

8. 发明申请

US20160330835A1 WIRING BOARD 审中-公开
标题翻译：接线板
公开(公告)号：US20160330835A1
公开(公告)日：2016-11-10
申请号：US15110977
申请日：2015-01-23
申请人： TOPPAN FORMS CO., LTD.
发明人： Kumi Hirose , Takuya Sekiguchi , Nariaki Nawa
IPC分类号： H05K1/09 , H05K3/12 , G06F3/041 , H05K1/02
CPC分类号： H05K1/092 , G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0225 , H05K1/0274 , H05K3/1275 , H05K2201/032 , H05K2201/09681 , H05K2201/098
摘要： A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
摘要翻译：布线板包括：通过印刷方法形成在基板上的细银线，其中细银线被构造成使得其在与其线长度方向垂直的方向上的横截面中的宽度为20μm或更小，其顶部的宽度小于与基板接触的接触部分的宽度，并且细银线的体积电阻率为15μΩ·cm以下。

9. 发明授权

US09485856B2 Transparent electrode sheet, method for manufacturing transparent electrode sheet, and capacitive touch panel using such transparent electrode sheet 有权
标题翻译：透明电极片，透明电极片的制造方法以及使用该透明电极片的电容式触摸面板
公开(公告)号：US09485856B2
公开(公告)日：2016-11-01
申请号：US14291201
申请日：2014-05-30
申请人： FUJIFILM Corporation
发明人： Akira Ichiki
IPC分类号： G06F3/041 , H05K1/02 , G06F3/044 , H05K1/03 , H05K3/10
CPC分类号： H05K1/0274 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/03 , H05K3/106 , H05K2201/0108 , H05K2201/0317 , H05K2201/032
摘要： A transparent electrode sheet includes a transparent support having thereon a patterned electrode, wherein the electrode is made from a metal thin wire, a thickness of the metal thin wire is 0.1 μm or more, and an absolute value of a difference between a reflection chromaticity b1* of a surface of the electrode at far side from the transparent support and a reflection chromaticity b2* of a surface of the electrode at near side to the transparent support is not more than 2.
摘要翻译：透明电极片包括其上具有图案化电极的透明支撑体，其中电极由金属细线制成，金属细线的厚度为0.1μm以上，反射色度b1 *远离透明支撑体的电极表面的反射色度b *和透明支撑体附近的电极表面的反射色度b2 *不大于2。

10. 发明授权

US09167690B1 Carrier for LTCC components 有权
标题翻译： LTCC组件的载体
公开(公告)号：US09167690B1
公开(公告)日：2015-10-20
申请号：US14299701
申请日：2014-06-09
申请人： SCIENTIFIC COMPONENTS CORPORATION
发明人： Harvey L. Kaylie , Aron Raklyar
IPC分类号： H05K7/10 , H05K7/12 , H05K1/11 , H05K1/09
CPC分类号： H05K1/111 , H01L23/13 , H01L23/15 , H01L23/49805 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/09 , H05K1/113 , H05K2201/032 , H05K2201/0753 , H05K2201/10378 , H01L2924/00
摘要： An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.
摘要翻译：由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。通孔防止不期望的电感路径限制电路的高频操作。顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式