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1. 发明申请

US20160286674A1 FUNCTION COMPONENT UPPER PART FOR A COMPONENT CONSTRUCTION SYSTEM 审中-公开
标题翻译：组件构造系统的功能组件上一部分
公开(公告)号：US20160286674A1
公开(公告)日：2016-09-29
申请号：US15033685
申请日：2014-11-03
申请人： PHOENIX CONTACT GMBH & CO KG
发明人： Joachim BURY , Thomas SALOMON
IPC分类号： H05K7/02 , H01R9/24 , H05K7/10 , H01R12/71
CPC分类号： H05K7/026 , H01R9/2425 , H01R12/714 , H05K7/10 , H05K7/1441 , H05K7/1477 , H05K7/1478
摘要： The invention concerns a function component upper part (500) for placing on a function component lower part (401) of a function component (400), having a first interface for electrically connecting the function component lower part (401) of the function component (400), and a second interface for electrically 409 connecting a housing upper part (403) of the function component (400).
摘要翻译：本发明涉及用于放置在功能部件（400）的功能部件下部（401）上的功能部件上部（500），其具有用于将功能部件（401）的功能部件下部（401）电连接的第一接口 400）和用于电连接功能部件（400）的壳体上部（403）的第二接口。

2. 发明授权

US09148975B2 Electronic interconnect method and apparatus 有权
标题翻译：电子互连方法和装置
公开(公告)号：US09148975B2
公开(公告)日：2015-09-29
申请号：US13530958
申请日：2012-06-22
申请人： Jean-Philippe Fricker
发明人： Jean-Philippe Fricker
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： H05K7/1441 , H05K7/1444 , H05K7/20554 , H05K7/20581 , H05K7/20718
摘要： An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.
摘要翻译：电子底盘在雪橇上具有许多通过蜂窝互连结构互连的可移动板。 Y平面和Z平面中的互连板彼此正交并形成单元。冷却空气在X方向上流过细胞，平行于互连板的表面。可拆卸板具有与Z分隔板互连板边缘配合的连接器。风扇通过蜂巢结构中的电池不受阻碍地吹动，因为没有板垂直于气流。 Z分隔板后部的槽口提供气流均衡，从而使风扇与蜂窝结构间隔更近。在蜂窝互连结构的前面放置有滑动的载体蜂窝结构体，以将雪橇引导到位置。雪橇载体分隔器与Z分隔板偏移，允许可移动板与Z平面中的Z分隔板平行，与气流平行。

3. 发明申请

US20110038113A1 Conversion module and chassis arrangement, and related methods 有权
标题翻译：转换模块和机箱布置及相关方法
公开(公告)号：US20110038113A1
公开(公告)日：2011-02-17
申请号：US12924877
申请日：2010-10-06
申请人： James Dorenkamp , Vern Loch , Jeffrey Peters , Wayne Nelson
发明人： James Dorenkamp , Vern Loch , Jeffrey Peters , Wayne Nelson
IPC分类号： G06F1/16 , H05K7/02 , H05K5/00 , H05K7/00
CPC分类号： G02B6/4452 , H05K7/1425 , H05K7/1441
摘要： A telecommunications arrangement including a chassis, at least one power supply, and a plurality of conversion modules that provide an electrical-to-optical or optical-to-electrical signal conversion. The chassis includes a separate back plane made up of individual back panels. The back panels are attached to the chassis by a tab and swell latch. The conversion modules include a printed circuit board, an input/output arrangement of connectors, and a radius limiter mounted to the printed circuit board.
摘要翻译：一种电信装置，包括底盘，至少一个电源以及提供电光或光电信号转换的多个转换模块。底盘包括由单独的后面板组成的单独的背板。后面板通过卡舌和凸起闩锁连接到机箱。转换模块包括印刷电路板，连接器的输入/输出装置和安装到印刷电路板的半径限制器。

4. 发明授权

US07803020B2 Backplane system having high-density electrical connectors 失效
标题翻译：背板系统具有高密度电连接器
公开(公告)号：US07803020B2
公开(公告)日：2010-09-28
申请号：US11798489
申请日：2007-05-14
申请人： Stanford W. Crane, Jr. , Maria M. Portuondo , Willard Erickson , Maurice Bizzarri
发明人： Stanford W. Crane, Jr. , Maria M. Portuondo , Willard Erickson , Maurice Bizzarri
IPC分类号： H01R29/00 , H01R12/00 , H01R4/66 , H01R11/22 , H01R13/64 , H02B1/056 , H05K1/00
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译：功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。高密度连接器连接电路板。本发明的一些实施例使用单个背板。其他实施例将外围插槽放置在第二无源底板上。

5. 发明申请

US20070025094A1 Backplane having a wired coupling between card slots 审中-公开
标题翻译：背板具有卡插槽之间的有线耦合
公开(公告)号：US20070025094A1
公开(公告)日：2007-02-01
申请号：US10564688
申请日：2004-07-09
申请人： Juergen Fischer , Harald Geiger
发明人： Juergen Fischer , Harald Geiger
IPC分类号： H05K7/10
CPC分类号： H05K7/1441 , G06F13/409 , H05K7/1459
摘要： A backplane for establishing a signal connection between a plurality of cards comprises a support for signaling lines and a plurality of card slots located on the support in a predefined sequence for connecting a card. A plurality of signal-carrier contacts is located at each card slot according to a same pattern. At the card slots, at least two positions of contacts are defined such that a contact at one of these two positions, referred to as the 0-th position, of each card slot that has a successor in the sequence is connected to a contact at the other position of the successor card slot, referred to as the first position, via the backplane.
摘要翻译：用于在多个卡之间建立信号连接的背板包括以预定义的顺序用于连接卡的信号线和位于支撑上的多个卡槽的支撑。根据相同的图案，多个信号载体触点位于每个卡槽处。在卡插槽处，定义了至少两个触点位置，使得在序列中具有后继者的每个卡槽的称为第0位的这两个位置之一处的触点连接到触点后继卡槽的另一个位置，被称为第一位置，通过背板。

6. 发明申请

US20060034061A1 Signal-segregating connector system 有权
公开(公告)号：US20060034061A1
公开(公告)日：2006-02-16
申请号：US11097450
申请日：2005-04-01
申请人： Kevin Grundy , Gary Yasumura , Joseph Fjelstad , William Wiedemann , Para Segaram
发明人： Kevin Grundy , Gary Yasumura , Joseph Fjelstad , William Wiedemann , Para Segaram
IPC分类号： H01R12/16
CPC分类号： H01R12/52 , H01R12/7011 , H01R12/7082 , H01R12/714 , H01R12/716 , H01R12/721 , H01R13/24 , H01R31/06 , H05K1/0237 , H05K1/14 , H05K1/147 , H05K3/222 , H05K7/1441 , H05K2201/044 , H05K2201/10189 , H05K2201/10356
摘要： A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

7. 发明申请

US20050219805A1 Back plane and mid-plane assemblies and related systems and methods 有权
标题翻译：后平面和中平面装配及相关系统和方法
公开(公告)号：US20050219805A1
公开(公告)日：2005-10-06
申请号：US10816696
申请日：2004-04-01
申请人： An Lam
发明人： An Lam
IPC分类号： G06F1/20 , H05K7/14 , H05K7/20
CPC分类号： H05K7/20727 , G06F1/20 , H05K7/1441
摘要： Back plane and mid-plane assemblies and related systems and methods are described. In one embodiment, a system comprises an enclosure and a plane assembly mounted within the enclosure and configured to connect with multiple pluggable devices. The plane assembly comprises a first plane portion having multiple connectors; and at least a second plane portion having multiple connectors, with the second plane portion being offset from the first plane portion.
摘要翻译：描述了背板和中平面组件及相关系统和方法。在一个实施例中，系统包括外壳和安装在外壳内并被配置为与多个可插拔设备连接的平面组件。平面组件包括具有多个连接器的第一平面部分; 以及具有多个连接器的至少第二平面部分，其中第二平面部分从第一平面部分偏移。

8. 发明申请

US20050042893A1 Fragmented backplane system for I/O applications 失效
标题翻译：用于I / O应用的分段背板系统
公开(公告)号：US20050042893A1
公开(公告)日：2005-02-24
申请号：US10958890
申请日：2004-10-05
申请人： Pierre Debord , Rene Glaise , Claude Gomez
发明人： Pierre Debord , Rene Glaise , Claude Gomez
IPC分类号： H05K1/14 , H05K7/14 , H05K7/20 , H01R12/00
CPC分类号： H05K7/20563 , H05K1/14 , H05K7/1441 , H05K7/1444
摘要： A backplane system allowing a very large number of interconnections between high-connectivity printed circuit boards and a backplane is disclosed. The backplane is fragmented into a plurality of backplane parts that comprise connectors on their edges to mate connectors arranged on the high-connectivity printed circuit boards. These backplane parts may also include other connectors on their edges to couple to extension printed circuit boards requiring less interconnections or cables. Interposers can be used to link several backplane parts and provide enhanced air circulation.
摘要翻译：公开了一种背板系统，其允许在高连通性印刷电路板和背板之间进行非常大量的互连。背板被分割成多个背板部件，其包括在它们的边缘上的连接器，以配合设置在高连通性印刷电路板上的连接器。这些背板部件还可以包括其边缘上的其它连接器，以耦合到需要较少互连或电缆的延伸印刷电路板。内插器可用于连接多个背板部件，并提供增强的空气循环。

9. 发明申请

US20040010638A1 Modular architecture for high bandwidth computers 有权
标题翻译：高带宽计算机的模块化架构
公开(公告)号：US20040010638A1
公开(公告)日：2004-01-15
申请号：US10402962
申请日：2003-04-01
申请人： Silicon Bandwidth, Inc.
发明人： Stanford W. Crane JR.
IPC分类号： H05K007/18 , H05K007/14 , G06F013/14 , G06F013/00
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译：功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。类似地，可以通过更换包含外围控制器的印刷电路板简单地改变所使用的一种外围总线。高密度连接器连接电路板。本发明的一些实施例使用单个背板。其他实施例将外围插槽放置在第二无源底板上。

10. 发明授权

US06568860B2 Electronic device with data bus and energy bus connection 有权
公开(公告)号：US06568860B2
公开(公告)日：2003-05-27
申请号：US09932582
申请日：2001-08-17
申请人： Jörg Koch , Rudi Singer , Gerd Lausberg , Marc Stanesby , Udo Kienapfel
发明人： Jörg Koch , Rudi Singer , Gerd Lausberg , Marc Stanesby , Udo Kienapfel
IPC分类号： G02B636
CPC分类号： H01R9/2675 , H05K7/1441 , H05K7/1478
摘要： An electronic device that can be pushed onto a support rail (15), having a housing (1), with an electronic module that can be inserted detachably into the housing, and bus contacts are provided for the transmission of data and/or energy to neighboring electronic devices that are pushed onto the support rail (15) and have an identical design, with appropriately designed bus terminal. The bus contacts can be displaced relative to the housing (1). The bus contacts can be immobilized via a latching fixture so that when in a latched position they can be brought into contact of the bus terminals in the neighboring device.

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