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1. 发明申请

US20180270991A1 ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180270991A1
公开(公告)日：2018-09-20
申请号：US15903584
申请日：2018-02-23
申请人： Toshiba Memory Corporation
发明人： Akitoshi SUZUKI
IPC分类号： H05K7/20 , H05K5/00 , H05K1/02
CPC分类号： H05K7/20436 , H05K1/0203 , H05K1/144 , H05K1/181 , H05K5/0008 , H05K5/006 , H05K7/20136 , H05K7/20472 , H05K2201/042 , H05K2201/10015 , H05K2201/10159 , H05K2201/10189 , H05K2201/10409 , H05K2201/10424 , H05K2201/10522
摘要： An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

2. 发明授权

US09986072B2 Mobile terminal 有权
公开(公告)号：US09986072B2
公开(公告)日：2018-05-29
申请号：US15545599
申请日：2015-03-23
申请人： LG ELECTRONICS INC.
发明人： Joseph Lee , Donghyun Kim , Kyungui Park
IPC分类号： H04M1/02 , H05K7/20
CPC分类号： H04M1/0202 , H05K5/04 , H05K7/20 , H05K7/20454 , H05K7/20472 , H05K7/20481 , H05K9/0024
摘要： There is disclosed a mobile terminal including a case comprising an electric control unit in which electronic components are loaded; a display unit coupled to a front surface of the case; a frame coupled to the case and supporting a rear surface of the display unit, the frame comprising a metallic material; a mainboard loaded in the case; a drive chip loaded in the mainboard; a shield can covering components loaded in the mainboard, the shied comprising a hole formed, corresponding to the drive chip; a thermal conductivity sheet comprising one surface in contact with a top surface of the drive chip and the other surface in contact with an inner surface of the frame; and a flexible material insertedly filling in a space formed between the thermal conductivity sheet and the frame, so that the heat generated in the drive chip of the mobile terminal may be effectively emitted and that only the portion of the mobile terminal, where the drive chip is loaded, may be prevented from being heated when the user is using the mobile terminal and the other components may be prevented from being damaged by the heat.

3. 发明申请

US20180098462A1 HEAT DISSIPATION MECHANISM AND DEVICE INCLUDING THE SAME 审中-公开
公开(公告)号：US20180098462A1
公开(公告)日：2018-04-05
申请号：US15566381
申请日：2016-04-20
申请人： NEC Corporation
发明人： Chitoshi ARAMAKI , Taro HIROSE
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367
CPC分类号： H05K7/20472 , H01L23/36 , H01L23/3672 , H01L23/373 , H01L23/3735 , H01L23/3737 , H01L23/42 , H05K3/28 , H05K7/20
摘要： Provided is a heat dissipation mechanism that allows for a smaller device while also facilitating disassembly. The heat dissipation mechanism is provided with a heat dissipation element, which releases heat externally. The heat dissipation element and a heating element that generates heat are in thermal contact with each other via a thermal conduction film formed from a thermally conductive material having the ability to flow, and via a low-friction film having a lower friction coefficient than the heat dissipation element or the heating element.

4. 发明申请

US20180014426A1 PCB MODULE WITH MULTI-SURFACE HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION PLATE USED IN PCB MODULE, MULTI-LAYER PCB ASSEMBLY, AND MODULE CASE 审中-公开
公开(公告)号：US20180014426A1
公开(公告)日：2018-01-11
申请号：US15358742
申请日：2016-11-22
申请人： Ku Yong KIM
发明人： Ku Yong KIM
IPC分类号： H05K7/20 , H05K1/02 , H05K1/18 , H05K5/00 , H05K1/14
CPC分类号： H05K7/205 , H05K1/0204 , H05K1/144 , H05K1/181 , H05K1/182 , H05K3/4608 , H05K5/0008 , H05K7/20472 , H05K2201/0367 , H05K2201/041 , H05K2201/042 , H05K2201/09063 , H05K2201/09854 , H05K2201/1003 , H05K2201/10242
摘要： A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

5. 发明申请

US20170318659A1 CIRCUIT STRUCTURE 审中-公开
公开(公告)号：US20170318659A1
公开(公告)日：2017-11-02
申请号：US15106565
申请日：2014-12-15
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Tou Chin
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0204 , H05K1/181 , H05K7/20472 , H05K7/209 , H05K2201/066 , H05K2201/09063 , H05K2201/10053 , H05K2201/10409
摘要： A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.

6. 发明授权

US09713294B2 Display apparatus including heat-radiating sheet 有权
公开(公告)号：US09713294B2
公开(公告)日：2017-07-18
申请号：US14716753
申请日：2015-05-19
申请人： Samsung Display Co., Ltd.
发明人： Hwanjin Kim , Minki Kim , Yunho Kim , Kangyong Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/20963 , H05K7/20472
摘要： A display apparatus includes a display panel, and a heat-radiating sheet located on a non-display surface of the display panel, wherein the heat-radiating sheet includes a first heat-radiating sheet in a central portion of the display panel, and a second heat-radiating sheet in edge portions of the display panel, and locations (heights) of the first heat-radiating sheet and the second heat-radiating sheet in a vertical direction are different from each other.

7. 发明申请

US20160295740A1 ELECTRONIC CONTROL UNIT 审中-公开
标题翻译：电子控制单元
公开(公告)号：US20160295740A1
公开(公告)日：2016-10-06
申请号：US15090169
申请日：2016-04-04
申请人： DENSO CORPORATION
发明人： Shinji Shibata
IPC分类号： H05K7/20 , H05K5/00 , H05K7/02
CPC分类号： H05K7/20454 , H05K7/20472 , H05K7/209
摘要： An electronic control unit includes a substrate, a plurality of electronic components, and a heat sink. The plurality of electronic components are mounted on the substrate, and include an integrated circuit and a plurality of tall components. The plurality of tall components are taller than the integrated circuit. The heat sink includes a recess collectively accommodating the plurality of tall components, and is provided on a side on which the plurality of tall components are mounted on the substrate.
摘要翻译：电子控制单元包括基板，多个电子部件和散热器。多个电子部件安装在基板上，并且包括集成电路和多个高部件。多个高分量比集成电路高。散热器包括集中容纳多个高部件的凹部，并且设置在多个高部件安装在基板上的一侧。

8. 发明申请

US20150195956A1 DOUBLE INSULATED HEAT SPREADER 有权
标题翻译：双重绝热散热器
公开(公告)号：US20150195956A1
公开(公告)日：2015-07-09
申请号：US14591355
申请日：2015-01-07
申请人： Enphase Energy, Inc.
发明人： Ryan Linderman
IPC分类号： H05K7/20 , H05K1/02
CPC分类号： H05K7/20409 , H01F27/022 , H01F27/08 , H01F2027/065 , H01L33/483 , H01L33/642 , H02M7/003 , H02S40/42 , H05K1/0203 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K1/181 , H05K5/064 , H05K7/2039 , H05K7/20418 , H05K7/20436 , H05K7/20463 , H05K7/20472 , H05K7/2049 , H05K7/205 , H05K7/209 , H05K2201/066
摘要： An apparatus for thermal management for an electric device. In one embodiment the apparatus comprises a primary heat spreader disposed within an enclosure that contains a printed circuit board (PCB) populated with at least one electrical component, wherein the primary heat spreader is thermally conductive and wherein the interior of the enclosure is at least partially filled with an encapsulating material; a secondary heat spreader coupled to an exterior face of a first wall of the enclosure, wherein the secondary heat spreader is thermally conductive; and a thermal interface coupled between the primary head spreader and the PCB, wherein the thermal interface is thermally conductive and electrically insulating.
摘要翻译：一种用于电气设备的热管理装置。在一个实施例中，该装置包括设置在外壳内的主要散热器，其包含填充有至少一个电气部件的印刷电路板（PCB），其中所述主散热器是导热的，并且其中所述外壳的内部至少部分地填充有封装材料; 耦合到所述外壳的第一壁的外表面的二次散热器，其中所述二次散热器是导热的; 以及耦合在主头扩展器和PCB之间的热界面，其中该热界面是导热的并且是电绝缘的。

9. 发明授权

US08879263B2 Conducting heat away from a printed circuit board assembly in an enclosure 有权
标题翻译：从外壳中的印刷电路板组件传导热量
公开(公告)号：US08879263B2
公开(公告)日：2014-11-04
申请号：US13467621
申请日：2012-05-09
申请人： Neal Frank Gunderson
发明人： Neal Frank Gunderson
IPC分类号： H05K7/20 , H05K13/00 , H05K5/02
CPC分类号： H05K5/0256 , H05K5/0269 , H05K7/20454 , H05K7/20472 , Y10T29/49002
摘要： A printed circuit board assembly (PCBA) is connected to a frame within a passage. The PCBA includes a circuitry package attached to a printed circuit board. The circuitry package has a peripheral edge extending from the printed circuit board to a distal end joined to a cap. A cover is attached to the frame to enclose the PCBA. A thermal interface material (TIM) is disposed between the cover and the PCBA, the TIM defining an opening sized to receivingly engage the circuitry package in a close mating engagement contacting the TIM simultaneously against the cap and the peripheral edge to conduct heat away from the circuitry package. A heat conductor attached to the other side of the printed circuit board in an overlapping opposition to the circuitry package conducts heat away from the printed circuit board that is generated by the circuitry package.
摘要翻译：印刷电路板组件（PCBA）连接到通道内的框架。 PCBA包括附接到印刷电路板的电路封装。电路封装具有从印刷电路板延伸到连接到盖的远端的外围边缘。盖子连接到框架以封闭PCBA。热界面材料（TIM）设置在盖和PCBA之间，TIM限定开口，其尺寸设计成以紧密匹配的接合方式接合电路封装件，同时接触TIM与盖和周边边缘，以将热量从电路封装。以与电路组件重叠的方式连接到印刷电路板的另一侧的导热体将热量从电路封装产生的印刷电路板传导出去。

10. 发明申请

US20140231491A1 METHOD OF MANUFACTURING ELECTRONIC COMPONENT UNIT 审中-公开
标题翻译：制造电子元件单元的方法
公开(公告)号：US20140231491A1
公开(公告)日：2014-08-21
申请号：US14260969
申请日：2014-04-24
申请人： Seiji YAMASHITA , Tamotsu TESHIMA , Amane MURAO , Hiroshi ISHIZAKI , Takashi HONDA , Hitoshi KUROYANAGI , Tomoyuki MASUBUCHI
发明人： Seiji YAMASHITA , Tamotsu TESHIMA , Amane MURAO , Hiroshi ISHIZAKI , Takashi HONDA , Hitoshi KUROYANAGI , Tomoyuki MASUBUCHI
IPC分类号： H05K7/20 , H05K13/04
CPC分类号： H05K7/20509 , B23K1/0016 , B23K37/003 , B23K2101/42 , H01L2224/32225 , H01L2224/83385 , H01L2924/15151 , H01L2924/19105 , H05K7/20 , H05K7/20472 , H05K7/20854 , H05K13/0465
摘要： An electronic component unit manufacturing method includes: preparing a circuit board including a heat generating element mounted thereon and a bonding metal foil layer formed thereon, a heat transfer board including an insulative layer formed on one face thereof and a heat transfer metal foil layer formed on the insulative layer, and a heat sink; applying a cream solder to form a solder layer on the board bonding metal foil layer or the heat transfer metal foil layer; superimposing the bonding metal foil layer and the heat transfer metal foil layer with each other via the solder layer; re-melting the solder layer to solder the bonding metal foil layer and the heat transfer metal foil layer; and superimposing the other face of the heat transfer board with the heat sink to thereby assemble the circuit board with the heat sink via the heat transfer board.
摘要翻译：一种电子部件单元的制造方法，其特征在于，包括：准备包括安装在其上的发热元件和形成在其上的接合金属箔层的电路板，传热板，其一面形成有绝缘层，传热金属箔层形成在绝缘层和散热片; 施加膏状焊料以在焊接金属箔层或传热金属箔层的板上形成焊料层; 通过焊料层将接合金属箔层和传热金属箔层重叠; 重新熔化焊料层以焊接接合金属箔层和传热金属箔层; 并且将传热板的另一面与散热器重叠，从而通过传热板将电路板与散热器组装在一起。

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