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1. 发明授权

US12010825B2 Eyewear with RF shielding having grounding springs 有权
公开(公告)号：US12010825B2
公开(公告)日：2024-06-11
申请号：US17694860
申请日：2022-03-15
申请人： Chukwubuikem Marcel Okoli , Ugur Olgun , Stephen Andrew Steger
发明人： Chukwubuikem Marcel Okoli , Ugur Olgun , Stephen Andrew Steger
IPC分类号： H05K9/00 , G02B27/01
CPC分类号： H05K9/0037 , G02B27/017 , H05K9/0035 , H05K9/0039 , G02B2027/0178
摘要： A shield can for an electronic eyewear device is described that reduces RF signals emanating from the electronic eyewear device. The shield can is attached to a ground plate of the electronic eyewear device using leaf springs on a side of the shield can. The leaf springs do not add to the stack-up thickness of the shield can assembly and provide a balanced force against the ground plate. The shield can is attached to a printed circuit board and encompasses radio frequency (RF) electronic components to prevent RF signals emanating from the RF electronic components. The leaf springs have a pair of fingers providing the balanced mechanical point force. A conductive pressure sensitive adhesive is also provided to secure a top surface of the shield can to the ground plate along with a thermal paste.

2. 发明授权

US10624247B2 Circuit board, electronic control unit, and switching control method of electronic control unit 有权
公开(公告)号：US10624247B2
公开(公告)日：2020-04-14
申请号：US15716988
申请日：2017-09-27
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Yuki Wakayama
IPC分类号： H05K1/18 , H05K9/00 , H05K1/02 , H05K5/00
CPC分类号： H05K9/0064 , H05K1/0215 , H05K1/0218 , H05K1/0298 , H05K5/006 , H05K9/0039 , H05K1/024 , H05K1/18 , H05K2201/09736
摘要： An electronic control unit includes; a circuit board including a plurality of layers, the layers including a plurality of ground layers having different thicknesses from one another; a drain line connected to the circuit board; a switching device configured to selectively connect the drain line to one of the plurality of ground layers based on a frequency of an electromagnetic wave inside a vehicle cabin; and a controller configured to control the connection of the switching device based on the frequency of the electromagnetic wave inside the vehicle cabin.

3. 发明申请

US20180228061A1 ELECTROMAGNETIC SHIELD STRUCTURE FOR ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180228061A1
公开(公告)日：2018-08-09
申请号：US15943338
申请日：2018-04-02
申请人： Samsung Electronics Co., Ltd.
发明人： Jung-Sik PARK , Seung-Ki CHOI , Joon HEO , Hyun-Ju HONG
IPC分类号： H05K9/00 , H05K5/00 , H05K1/02
CPC分类号： H05K9/002 , H01L2224/16225 , H05K1/0218 , H05K1/0259 , H05K5/0004 , H05K5/0017 , H05K9/0024 , H05K9/0039 , H05K2201/0919 , H05K2201/09354 , H05K2201/10371
摘要： An electronic device is provided that includes a PCB including a first surface, a second surface, and a side surface; an electronic component arranged on the first surface, adjacent to a portion of the side surface; a shield structure including a cap that covers the electronic component and a sidewall extending from a periphery of the cap toward the first surface of the PCB, wherein the sidewall extends in a first direction that is non-parallel to the first surface of the PCB; a first conductive structure that is formed on a portion of the side surface of the PCB; and a second conductive structure that is formed on a portion of the first surface to be connected to the first conductive structure. The sidewall contacts with the first surface of the PCB and overlaps with the second conductive structure, when viewed from above the first surface of the PCB.

4. 发明申请

US20170325366A1 Circuit shielding structure 审中-公开
公开(公告)号：US20170325366A1
公开(公告)日：2017-11-09
申请号：US15659616
申请日：2017-07-26
申请人： Shanghai Allied Industrial Co.,Ltd
发明人： Yanmin Li , Huanqing Pan
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H01L2924/3025 , H05K9/0032 , H05K9/0039 , H05K9/0088
摘要： A circuit shielding structure, relating to a technical field of electronics, includes a substrate, wherein: at least one radio frequency component circuit is fixed on the substrate; a wave-absorbing material layer is embedded in the substrate; a shielding wall made of wave-absorbing material is arranged on the substrate and around the radio frequency component circuit; a conductive material layer covers the shielding wall; a closed space is formed among the substrate in which the wave-absorbing material layer is embedded, the shielding wall and the conductive material layer, and the radio frequency component circuit is sealed in the closed space, so that omnidirectional shielding is achieved.

5. 发明授权

US09795043B2 Radio frequency subscriber drop units having printed circuit boards with ground plane layers and/or housings with ground walls 有权
公开(公告)号：US09795043B2
公开(公告)日：2017-10-17
申请号：US14487283
申请日：2014-09-16
申请人： CommScope, Inc. of North Carolina
发明人： Shi Man Li , Chi-Min Kang , Jui-Huang Chung
IPC分类号： H01P5/12 , H05K5/00 , H05K9/00
CPC分类号： H05K5/0026 , H04Q2213/13003 , H05K9/0039 , H05K9/006
摘要： Radio frequency subscriber drop units include a housing having an input port and an output port and a printed circuit board mounted in an interior of the housing. The printed circuit board includes a dielectric layer, a wiring layer that includes conductive wirings that comprise at least part of a communications path between the input port and the output port that is on a first face of the dielectric layer, and a ground plane layer that includes a conductive ground plane that is on a second face of the dielectric layer.

6. 发明申请

US20170207557A1 SPRING SHEET 审中-公开
公开(公告)号：US20170207557A1
公开(公告)日：2017-07-20
申请号：US15242015
申请日：2016-08-19
申请人： LE HOLDINGS (BEIJING) CO., LTD. , LEMOBILE INFORMATION TECHNOLOGY (BEIJING) CO., LTD.
发明人： Xiangxin HUANG , Dan YU
IPC分类号： H01R12/57 , H05K1/02 , H01R13/24 , H05K9/00
CPC分类号： H01R12/57 , H01R13/2435 , H05K1/0215 , H05K3/4015 , H05K9/0039 , H05K2201/0311
摘要： The present disclosure relates to a spring sheet, which includes a first spring foot, a second spring foot and a soldering part; the first spring foot includes a first elastic wall and a first hook; the second spring foot includes a second elastic wall and a second hook; the first spring foot and/or the second spring foot are/is connected with the soldering part, and bend/bends and extend/extends outward relative to the soldering part. By the present disclosure, the grounding stability of the spring sheet may be reinforced, and it may be realized that two components in an electronic device are grounded simultaneously.

7. 发明申请

US20170170799A1 CAPACITIVE COMPENSATION STRUCTURES USING PARTIALLY MESHED GROUND PLANES 审中-公开
公开(公告)号：US20170170799A1
公开(公告)日：2017-06-15
申请号：US14966635
申请日：2015-12-11
申请人： Intel Corporation
发明人： Jackson Chung Peng Kong , Bok Eng Cheah , Khang Choong Yong , Howard L. Heck , Wil Choon Song
IPC分类号： H03H7/38 , H05K1/18 , G06F17/50 , H01P3/08 , G06F13/38 , H05K3/00 , H05K1/02
CPC分类号： H03H7/38 , G06F13/382 , G06F17/5036 , G06F17/5072 , G06F17/5081 , G06F2217/82 , H01P3/026 , H01P3/08 , H05K1/0215 , H05K1/0216 , H05K1/0218 , H05K1/0224 , H05K1/0245 , H05K1/025 , H05K1/0298 , H05K1/18 , H05K3/0005 , H05K9/0039 , H05K2201/09218 , H05K2201/0929 , H05K2201/093 , H05K2201/09327 , H05K2201/09681
摘要： Techniques for reducing multi-reflection noise via compensation structures are described herein. An example system includes a capacitive component. The example system further includes a capacitive compensation structure coupled to two ends of the capacitive component. The example system includes a partially meshed ground plane coupled to one side of a dielectric substrate. The example system also includes one or more signal conductors coupled to another side of the dielectric substrate and electrically coupled to the capacitive component. The one or more signal conductors are located parallel to a meshed length of the partially meshed ground plane.

8. 发明申请

US20160057898A1 SHIELDING FILM AND METHOD OF MANUFACTURING SAME 有权
标题翻译：屏蔽薄膜及其制造方法
公开(公告)号：US20160057898A1
公开(公告)日：2016-02-25
申请号：US14463105
申请日：2014-08-19
申请人： T-Kingdom Co., LTD.
发明人： Yu Hao LAI
IPC分类号： H05K9/00
CPC分类号： H05K9/0026 , H01L23/585 , H01L23/60 , H01L2924/0002 , H05K9/0039 , H05K9/0084 , H05K9/0086 , H05K9/0088 , H01L2924/00
摘要： A shielding film includes an insulation layer, a conductive shielding layer and an adhesive layer; and is manufactured in a method including the steps of connecting a conductive shielding layer to a substrate material and forming a plurality of cavities on them; forming an insulation layer on the conductive shielding layer to fill up all the cavities; forming a carrier film on a top of the insulation layer; removing the substrate material from the conductive shielding layer, such that a plurality of downward protruded metal grounding electrodes are formed on a lower side of the conductive shielding layer corresponding to the cavities; and providing an adhesive layer on the lower side of the conductive shielding layer, such that the metal grounding electrodes are exposed from the adhesive layer to present a geometric pattern. The produced shielding film shows good grounding effect and bonding strength to ensure enhanced electromagnetic shielding effect.
摘要翻译：屏蔽膜包括绝缘层，导电屏蔽层和粘合剂层; 并且以包括将导电屏蔽层连接到基板材料并在其上形成多个空腔的步骤的方法制造; 在导电屏蔽层上形成绝缘层以填充所有空腔; 在所述绝缘层的顶部上形成载体膜; 从导电屏蔽层去除基板材料，使得在对应于空腔的导电屏蔽层的下侧形成多个向下突出的金属接地电极; 并且在导电屏蔽层的下侧设置粘合剂层，使得金属接地电极从粘合剂层露出以呈现几何图案。所产生的屏蔽膜具有良好的接地效果和接合强度，以确保增强的电磁屏蔽效果。

9. 发明授权

US09271436B2 Electronic packaged device and manufacturing method thereof 有权
标题翻译：电子封装器件及其制造方法
公开(公告)号：US09271436B2
公开(公告)日：2016-02-23
申请号：US14286965
申请日：2014-05-23
申请人： UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
发明人： Jen-Chun Chen , Pai-Sheng Shih
IPC分类号： H05K5/00 , H05K13/04 , H05K9/00
CPC分类号： H05K9/0022 , H01L21/568 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2924/1815 , H01L2924/3025 , H05K1/181 , H05K9/0037 , H05K9/0039 , H05K9/0064 , H05K13/046 , H05K2201/09036 , H05K2201/10371 , Y10T29/49155
摘要： A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.
摘要翻译：电子封装装置的制造方法包括以下。多个电子部件设置在基板载体上。封装构件设置在基板载体上并覆盖电子部件。衬底载体与封装构件分离。多个第一沟槽布置在封装构件的第一表面上。导电材料设置在第一表面上并进入第一沟槽中以形成导电层。在第一表面上形成导电层以形成电路层。电路层包括至少一个接地垫。多个第二沟槽布置在封装构件的第二表面上。在第一沟槽和第二沟槽中形成至少一个屏蔽结构。电磁屏蔽层连接到接地垫。

10. 发明授权

US09191474B2 Shielding structure for use in an electronic device 有权
标题翻译：用于电子设备的屏蔽结构
公开(公告)号：US09191474B2
公开(公告)日：2015-11-17
申请号：US14138220
申请日：2013-12-23
申请人： Samsung Electronics Co., Ltd.
发明人： Young-Kwang Song , Sung-Won Park , Yong-Lak Cho
IPC分类号： H04M1/02 , H04B1/3888 , H05K9/00 , H04M1/19
CPC分类号： H04M1/0277 , H04B1/3888 , H04M1/19 , H05K9/0039
摘要： An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.
摘要翻译：提供一种电子设备，包括具有地面的主板; 耦合到主板的导电支架; 以及弹性构件，其联接到所述主板，并且与所述主板的地面电连接; 其中所述弹性构件与所述导电支架弹性接触; 并且其中所述弹性构件电连接到所述导电支架。

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