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1. 发明授权

US09933571B2 Profiling of cleaved angled end faces of optical fiber(s) 有权
公开(公告)号：US09933571B2
公开(公告)日：2018-04-03
申请号：US13844897
申请日：2013-03-16
申请人： OXFORD FIBER LTD
发明人： Ian Murgatroyd
IPC分类号： G02B6/25
CPC分类号： G02B6/25 , Y10T29/49801 , Y10T225/12 , Y10T225/321
摘要： A method for cleaving one or more optical fiber(s) at an angle to the optic axis is provided and includes clamping the optical fiber(s) with its coating stripped to expose its distal end. An axial force and/or a bending force is applied to the optical fiber to create internal stresses in the fiber. A sharp blade is provided in an orientation such the blade edge is perpendicular to the optical fiber. The blade is further orientated such that a plane bisecting the blade angle formed between two polished surfaces of the blade is slanted relative to the longitudinal axis of the fiber. The at least one optical fiber is scratched with the sharp blade to create a non-perpendicular cleave having a controlled shape in the region of the scratch. A method of splicing the fibers and a tool for cleaving the fibers are also provided.

2. 发明授权

US09862634B2 Method and apparatus for removing peripheral portion of a glass sheet 有权
公开(公告)号：US09862634B2
公开(公告)日：2018-01-09
申请号：US13307592
申请日：2011-11-30
申请人： Nicholas Dominic Cavallaro, III , Keith Mitchell Hill , Harry J Reidy , Liming Wang , Zheming Zheng , Naiyue Zhou
发明人： Nicholas Dominic Cavallaro, III , Keith Mitchell Hill , Harry J Reidy , Liming Wang , Zheming Zheng , Naiyue Zhou
IPC分类号： C03B33/023 , C03B33/033 , C03B33/02
CPC分类号： C03B33/033 , B65G2249/04 , C03B33/0207 , Y10T225/12 , Y10T225/307
摘要： Process for removing peripheral portions such as bead regions of a glass sheet including a step of pushing the glass sheet in the peripheral portion using a pushing mechanism such as a pushing bar, and corresponding apparatus. As a result of the use of the pushing mechanism, the engagement completion time for suction cups, if used, are reduced significantly. A process without using suction cups is enabled with enhanced yield. The increased process stability and enlarged process window are particularly advantageous for processing glass sheets having high flexibility.

3. 发明授权

US09703131B2 Liquid crystal motherboard, manufacturing and cutting methods thereof, and liquid crystal panel obtained thereby 有权
公开(公告)号：US09703131B2
公开(公告)日：2017-07-11
申请号：US14240350
申请日：2014-01-22
申请人： SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Tao Ma , Tao Song , Ming Liu , Guodong Zhao
IPC分类号： G02F1/1339 , G02F1/1333 , C03B33/07
CPC分类号： G02F1/1333 , C03B33/076 , G02F1/133305 , G02F1/133351 , G02F2001/133354 , Y10T225/12
摘要： The present disclosure provides a method for manufacturing a liquid crystal panel motherboard, comprising providing materials that can form projections on a margin area of at least one of two substrates of the liquid crystal panel motherboard, and then fitting said two substrates to each other, so that the margin area of said at least one of the two substrates cannot be fit to a corresponding margin area of the other substrate seamlessly. The present disclosure also provides a method for cutting a liquid crystal panel motherboard, and a liquid crystal panel obtained from the liquid crystal motherboard.

4. 发明授权

US09659764B2 Method of controlled crack propagation for material cleavage using electromagnetic forces 有权
公开(公告)号：US09659764B2
公开(公告)日：2017-05-23
申请号：US14469983
申请日：2014-08-27
申请人： The Board of Trustees of the Leland Stanford Junior University
发明人： Andrei T. Iancu , Friedrich B. Prinz
IPC分类号： B26F3/00 , H01L21/02 , B28D5/00 , H01L21/306
CPC分类号： H01L21/02021 , B28D5/0011 , H01L21/02019 , H01L21/306 , Y02P80/30 , Y10T225/12
摘要： To address the needs in the art, a method of cleaving substrate material that includes forming an initial crack in a bulk substrate material, where the crack is aligned along a cleaving plane of the bulk substrate material, aligning the cleaving plane between two parallel electrodes in a controlled environment, wherein the parallel electrodes include a top electrode and a bottom electrode, where the cleaving plane is parallel with the two parallel electrodes, where a bottom portion of the bulk substrate material is physically and electrically connected to the bottom electrode, and applying a voltage across the two parallel electrodes, where the voltage is at least 50 kV and establishes a uniform electromagnetic force on the top surface of the bulk substrate material, where the electromagnetic force is capable of inducing crack propagation along the cleaving plane and separating a cleaved substrate material from the bulk substrate material.

5. 发明授权

US09630226B2 Method for producing steel fibers 有权
公开(公告)号：US09630226B2
公开(公告)日：2017-04-25
申请号：US14631297
申请日：2015-02-25
申请人： CENT & CENT GMBH & CO KG
发明人： Karl-Hermann Stahl
IPC分类号： B21C37/00 , B21B1/16 , B23D31/00 , B23P17/06 , E04C5/01 , B26F3/00 , C04B14/48
CPC分类号： B21B1/163 , B23D31/002 , B23P17/06 , B26F3/00 , C04B14/48 , E04C5/012 , Y10T225/12 , Y10T428/1234 , Y10T428/12444
摘要： A method of making steel fibers, preferably for use as a concrete additive, and for the supply thereof in making steel fiber concrete, characterized in that to form the steel fibers (2) first a sheet-metal strip (1) is notched either on one face or both faces so as to form steel-fiber wires (4) that are initially connected together by webs (5), and that further, for subsequently converting the webs (5) into thin easily mutually separable separation webs forming separation surfaces that are fracture-rough and low in burring upon separation, the steel-fiber strip is subjected to a flexing process in which each web (5) is subjected to multiple bending deformations about its longitudinal axis in such a way that incipient cracks are produced at the webs (5) due to fatigue fracture and thus the separation webs are produced.

6. 发明申请

US20170087744A1 DEVICE AND METHOD FOR CLEAVING 审中-公开
公开(公告)号：US20170087744A1
公开(公告)日：2017-03-30
申请号：US15339923
申请日：2016-10-31
申请人： LatticeGear, LLC
发明人： Gal Moyal
IPC分类号： B28D5/00 , B26D5/00 , B26F3/00
CPC分类号： B28D5/0011 , B26D3/06 , B26D5/007 , B26F3/002 , B28D1/225 , B28D5/0023 , B28D5/0041 , B28D5/0076 , B28D7/02 , Y10T83/0333 , Y10T225/12 , Y10T225/325 , Y10T225/371
摘要： A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

7. 发明授权

US09399310B2 Method for producing thin rock-faced veneers from granitic stone slabs 有权
标题翻译：从花岗岩石板生产薄型岩石单板的方法
公开(公告)号：US09399310B2
公开(公告)日：2016-07-26
申请号：US13987037
申请日：2013-06-28
申请人： D. L. Cetrangolo
发明人： D. L. Cetrangolo
IPC分类号： B28D1/22
CPC分类号： B28D1/222 , Y10T225/12 , Y10T225/20
摘要： Granitic stone slabs can be split into thin rock-faced veneers by opposed tools forced into the slab from opposite sides. One tool comprises a radiused contact surface and the other a sharp edge, with a beveled surface on one side thereof.
摘要翻译：花岗岩石板可以通过相对的工具从相对的两侧强制进入板坯，分裂成薄的岩石面板。一个工具包括圆角接触表面，另一个工具包括一个锋利的边缘，其一侧具有斜面。

8. 发明授权

US09212081B2 Methods of cutting a laminate strengthened glass substrate 有权
标题翻译：切割层压强化玻璃基板的方法
公开(公告)号：US09212081B2
公开(公告)日：2015-12-15
申请号：US13800003
申请日：2013-03-13
申请人： Corning Incorporated
发明人： Gaozhu Peng , Xinghua Li , Rui Zhang
IPC分类号： B23K26/00 , B26F3/00 , C03B33/07 , C03B33/09 , C03B33/095
CPC分类号： C03B33/076 , B32B17/06 , C03B33/07 , C03B33/093 , C03B33/0955 , C03C3/087 , C03C3/089 , C03C3/091 , C03C3/093 , Y02P40/57 , Y10T225/12
摘要： Methods of cutting laminate strengthened glass substrates are disclosed. A method is disclosed which includes providing a laminate strengthened glass substrate having a glass core layer with first and second surface portions, and at least one glass cladding layer fused to the first surface portion or the second surface portion of the glass core layer. The glass core layer has a core coefficient of thermal expansion that is larger than a cladding coefficient of thermal expansion. The method further includes forming an edge defect on the laminate strengthened glass substrate, heating first and second regions of the laminate strengthened glass substrate on the at least one glass cladding layer. The first and second regions are offset from first and second sides of a desired line of separation, respectively. The method further includes propagating a crack imitated at the edge defect between the first and second regions.
摘要翻译：公开了层压强化玻璃基板的切割方法。公开了一种方法，其包括提供具有第一和第二表面部分的玻璃核心层的层压强化玻璃基板和与玻璃芯层的第一表面部分或第二表面部分熔合的至少一个玻璃包覆层。玻璃核心层的核心热膨胀系数大于热膨胀系数。所述方法还包括在所述层压强化玻璃基板上形成边缘缺陷，在所述至少一个玻璃包覆层上加热层压强化玻璃基板的第一和第二区域。第一和第二区域分别从期望的分离线的第一和第二侧偏移。该方法还包括传播在第一和第二区域之间的边缘缺陷处模拟的裂纹。

9. 发明申请

US20150321941A1 SEPARATION APPARATUSES FOR SEPARATING SHEETS OF BRITTLE MATERIAL AND METHODS FOR SEPARATING SHEETS OF BRITTLE MATERIAL 审中-公开
标题翻译：用于分离高分子材料的分离装置和分离材料薄片的方法
公开(公告)号：US20150321941A1
公开(公告)日：2015-11-12
申请号：US14801279
申请日：2015-07-16
申请人： Corning Incorporated
发明人： Keith Mitchell Hill , Ritesh Satish Lakhkar , Mark Thomas Massaro , Liming Wang , Naiyue Zhou
IPC分类号： C03B33/02 , C03B33/033 , C03B33/023 , B28D5/00
CPC分类号： C03B33/0207 , B28D5/0029 , C03B33/0235 , C03B33/033 , Y02P40/57 , Y10T225/12 , Y10T225/329 , Y10T225/371
摘要： Methods and apparatuses for separating sheets of brittle material are disclosed. According to one embodiment, a separation apparatus for separating a sheet of brittle material includes a first separation cam positioned adjacent to a sheet conveyance pathway and a second separation cam positioned opposite from and downstream of the first separation cam. The first and second separation cams may be rotated such that the contact faces of the separation cams periodically extend across a centerline of the conveyance pathway. Rotation of the first and second separation cams may be synchronized such that at least the portion of the contact face of the first separation cam and at least the portion of the contact face of the second separation cam periodically extend across the centerline of the conveyance pathway at a separation time and periodically do not extend across the centerline of the conveyance pathway at a non-separation time.
摘要翻译：公开了用于分离脆性材料片的方法和装置。根据一个实施例，用于分离脆性材料片的分离装置包括邻近片材传送路径定位的第一分离凸轮和与第一分离凸轮相对和下游定位的第二分离凸轮。第一和第二分离凸轮可以旋转，使得分离凸轮的接触面周期性地延伸越过输送路径的中心线。第一和第二分离凸轮的旋转可以是同步的，使得第一分离凸轮的接触面的至少部分和第二分离凸轮的接触面的至少部分周期性延伸穿过输送路径的中心线分离时间并且在非分离时间周期性地不延伸穿过输送路径的中心线。

10. 发明授权

US09159596B2 Clamping apparatus for cleaving a bonded wafer structure 有权
标题翻译：用于切割接合晶片结构的夹持装置
公开(公告)号：US09159596B2
公开(公告)日：2015-10-13
申请号：US13663073
申请日：2012-10-29
申请人： SunEdison Semiconductor Limited
发明人： Gregory A. Young , Jeffrey L. Libbert
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00
CPC分类号： B32B43/006 , B32B38/10 , C09J2205/302 , H01L21/67092 , H01L2221/68386 , H01L2221/6839 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1184 , Y10T156/1961 , Y10T156/1978 , Y10T225/10 , Y10T225/12 , Y10T225/357 , Y10T225/393
摘要： Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
摘要翻译：公开了用于机械地切割接合晶片结构的装置和方法。该装置和方法涉及夹持键合晶片结构并被致动以使接合结构断裂的夹具。

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