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1. 发明授权

US11907791B2 Smart cards with metal layer(s) and methods of manufacture 有权
公开(公告)号：US11907791B2
公开(公告)日：2024-02-20
申请号：US17867823
申请日：2022-07-19
申请人： AmaTech Group Limited
发明人： Mustafa Lotya , David Finn , Darren Molloy
IPC分类号： G06K19/077 , H01Q1/22 , H01Q21/29 , H01Q7/00 , H05K1/16 , H01F27/28 , H05K3/10 , H01F38/14
CPC分类号： G06K19/07794 , G06K19/07769 , G06K19/07783 , H01Q1/2216 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01Q21/29 , H05K1/165 , H01F27/2804 , H01F38/14 , H05K3/103 , H05K2201/10098 , Y10T29/49018 , Y10T29/49162
摘要： Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.

2. 发明授权

US09648757B2 Method for manufacturing space transformer by using carrier substrate made for chip package and provided with elongated contacts 有权
公开(公告)号：US09648757B2
公开(公告)日：2017-05-09
申请号：US14520772
申请日：2014-10-22
申请人： MPI CORPORATION
发明人： Chung-Tse Lee , Chien-Chou Wu , Tsung-Yi Chen
IPC分类号： H05K3/40 , G01R3/00 , H05K3/14 , H05K3/10 , H05K3/32 , G01R1/067 , G01R1/20 , H01R43/20 , G01R1/073
CPC分类号： H05K3/4007 , G01R1/067 , G01R1/07378 , G01R1/20 , G01R3/00 , H01R43/20 , H05K3/10 , H05K3/143 , H05K3/32 , H05K3/403 , H05K3/4038 , H05K2201/09409 , H05K2203/0574 , H05K2203/1476 , Y10T29/49147 , Y10T29/49162 , Y10T29/49165
摘要： A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.

3. 发明授权

US09572238B2 Touch panel, touch display device and method for manufacturing the touch panel 有权
标题翻译：触控面板，触控显示装置及触控面板制造方法
公开(公告)号：US09572238B2
公开(公告)日：2017-02-14
申请号：US13975796
申请日：2013-08-26
申请人： BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人： Shengji Yang
IPC分类号： G06F3/041 , H05F3/04 , H05K3/10 , H05K1/02 , G06F3/044 , H05K1/11
CPC分类号： H05F3/04 , G06F3/044 , G06F2203/04103 , G06F2203/04111 , H05K1/0259 , H05K1/0289 , H05K1/116 , H05K3/10 , H05K2201/09227 , H05K2201/09272 , Y10T29/49162
摘要： The embodiments of the present invention disclose a touch panel, a touch display device and method for manufacturing the touch panel. The touch panel comprises a first electrode wire, a second electrode wire being intersected with the first electrode wire, wherein, the first electrode wire comprises first electrodes and a metal bridge for lapping adjacent first electrodes through a first through hole on the insulating layer, and the hole wall of the first through hole is provided with a first sharp corner; the second electrode wire comprises second electrodes, a connecting portion, a metal wire, and a conductive covering portion, one end of the metal wire is connected with the conductive covering portion through a second through hole on the insulating layer, and the hole wall of the second through hole is provided with a second sharp corner which is arranged to face the first sharp corner.
摘要翻译：本发明的实施例公开了触摸面板，触摸显示装置和触摸面板的制造方法。触摸面板包括第一电极线，与第一电极线相交的第二电极线，其中，第一电极线包括第一电极和用于通过绝缘层上的第一通孔研磨邻近的第一电极的金属桥，以及第一通孔的孔壁设置有第一尖角; 第二电极线包括第二电极，连接部分，金属线和导电覆盖部分，金属线的一端通过绝缘层上的第二通孔与导电覆盖部分连接，孔的壁所述第二贯通孔设置有与所述第一锋利拐角相对的第二尖角。

4. 发明授权

US09544996B2 Capacitance touch panel module and fabrication method thereof 有权
标题翻译：电容式触摸屏模块及其制造方法
公开(公告)号：US09544996B2
公开(公告)日：2017-01-10
申请号：US14300726
申请日：2014-06-10
申请人： INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD. , INNOLUX CORPORATION
发明人： Kai Meng , Lien-Hsin Lee
IPC分类号： G06F3/044 , H05K1/02 , H05K1/03 , H05K3/10 , H05K3/12 , H03K17/96
CPC分类号： H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
摘要： A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
摘要翻译：一种制造电容触摸面板模块的方法包括：在包括沿着第一取向的触摸区域和外围区域的基板上形成多个第一导电图案，沿着第二取向的多个第二导电图案以及多个连接部分在感人的地区; 形成多个绝缘突起，其中每个绝缘突起覆盖一个连接部分，并在周边区域上形成绝缘框架; 以及在每个绝缘突起上形成桥接构件。

5. 发明授权

US09533742B2 Marine navigation light apparatuses and methods of making the same 有权
标题翻译：船用导航灯具及其制作方法
公开(公告)号：US09533742B2
公开(公告)日：2017-01-03
申请号：US14640622
申请日：2015-03-06
申请人： Randal A. Deven , Justin E. Schweiss
发明人： Randal A. Deven , Justin E. Schweiss
IPC分类号： B60Q1/00 , F21V1/00 , B63B45/04 , F21V31/00
CPC分类号： B63B45/04 , F21V31/005 , Y10T29/49162
摘要： A maritime navigation light apparatus comprising a pole element, a base, and a light assembly with one or more light emitting elements is presented. The pole element may comprise a hollow core and may be permanently or temporarily coupled to the base and/or to the light assembly. The light emitting elements may be housed on a circuit board and encased in an impact resistant encasement and electrically connected to electrical wires. The electrical wires may be inserted through the hollow core or the pole element and may also comprise electrical plug members which may terminate on the exterior or interior of the apparatus.
摘要翻译：提出了一种包括极元件，基座和具有一个或多个发光元件的灯组件的海上导航灯装置。极元件可以包括中空芯，并且可以永久地或临时地耦接到基座和/或光组件。发光元件可以容纳在电路板上并被封装在抗冲击外壳中并且电连接到电线。电线可以插入中空芯或极元件中，并且还可以包括可插塞在设备的外部或内部的电插头构件。

6. 发明授权

US09502390B2 BVA interposer 有权
标题翻译： BVA插值器
公开(公告)号：US09502390B2
公开(公告)日：2016-11-22
申请号：US13795756
申请日：2013-03-12
申请人： Invensas Corporation
发明人： Terrence Caskey , Ilyas Mohammed , Cyprian Emeka Uzoh , Charles G. Woychik , Michael Newman , Pezhman Monadgemi , Reynaldo Co , Ellis Chau , Belgacem Haba
IPC分类号： H05K1/02 , H01L25/10 , H05K3/46 , H01L21/48 , H01L23/31 , H01L23/00 , H01L23/498
CPC分类号： H01L25/105 , H01L21/486 , H01L23/3114 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/05 , H01L24/45 , H01L24/48 , H01L25/0655 , H01L2224/02379 , H01L2224/04042 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45664 , H01L2224/48091 , H01L2224/48108 , H01L2224/48227 , H01L2224/73207 , H01L2224/73257 , H01L2225/1023 , H01L2225/1052 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/381 , H05K1/0298 , H05K3/46 , Y10T29/49126 , Y10T29/49162 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.
摘要翻译：制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触，分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

7. 发明授权

US09445495B2 Capacitance touch panel module and fabrication method thereof 有权
公开(公告)号：US09445495B2
公开(公告)日：2016-09-13
申请号：US14560528
申请日：2014-12-04
申请人： INNOLUX CORPORATION
发明人： Kai Meng , Lien-Hsin Lee
IPC分类号： G06F3/041 , H05K1/02 , G06F3/044 , H05K1/03 , H05K3/10 , H05K3/12 , H03K17/96
CPC分类号： H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
摘要： A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

8. 发明授权

US09440589B2 Electro-optic rearview mirror assembly for vehicle 有权
标题翻译：电动车后视镜组件
公开(公告)号：US09440589B2
公开(公告)日：2016-09-13
申请号：US14791948
申请日：2015-07-06
申请人： MAGNA MIRRORS OF AMERICA, INC.
发明人： John T. Uken , Michael J. Baur , Ian A. McCabe , Hamid Habibi
IPC分类号： G02F1/153 , B60R1/08 , G02F1/157 , G02F1/1335
CPC分类号： B60R16/0215 , B60R1/04 , B60R1/088 , G02F1/133553 , G02F1/153 , G02F1/157 , Y10T29/49162 , Y10T29/49169
摘要： A reflective element assembly for a vehicular rearview mirror assembly includes front and rear substrates with an electro-optic medium disposed therebetween. An electrical connector has an attachment portion and a wire receiving portion for receiving an electrical wire therein. A flange of the attachment portion is configured to be disposed at a fourth surface of the rear substrate and a tab is configured to extend at least partially across a perimeter edge of the rear substrate. An electrically conductive material is disposed in an uncured state and uncured electrically conductive material flows at least partially through the aperture and is cured to secure the electrical connector at the rear substrate. The wire receiving portion of the electrical connector is configured to receive the electrical wire therein and includes at least one tang that engages the electrical wire when the electrical wire is inserted into the wire receiving portion.
摘要翻译：用于车辆后视镜组件的反射元件组件包括其间设置有电光介质的前基板和后基板。电连接器具有用于在其中接收电线的附接部分和电线接收部分。附接部分的凸缘被配置为设置在后基板的第四表面处，并且突片被构造成至少部分地延伸穿过后基板的周边边缘。导电材料设置在未固化状态，未固化的导电材料至少部分地流过孔，并被固化以将电连接器固定在后基板上。电连接器的电线接收部分被配置为在其中接收电线，并且当电线插入电线接收部分时包括至少一个与电线接合的电极。

9. 发明授权

US09204540B2 Capacitance touch panel module and fabrication method thereof 有权
标题翻译：电容式触摸屏模块及其制造方法
公开(公告)号：US09204540B2
公开(公告)日：2015-12-01
申请号：US14560592
申请日：2014-12-04
申请人： INNOLUX CORPORATION
发明人： Kai Meng , Lien-Hsin Lee
IPC分类号： G06F3/044 , H05K1/02 , H05K1/03 , H05K3/10 , H05K3/12 , H03K17/96
CPC分类号： H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
摘要： A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
摘要翻译：一种制造电容触摸面板模块的方法包括：在包括沿着第一取向的触摸区域和外围区域的基板上形成多个第一导电图案，沿着第二取向的多个第二导电图案以及多个连接部分在感人的地区; 形成多个绝缘突起，其中每个绝缘突起覆盖一个连接部分，并在周边区域上形成绝缘框架; 以及在每个绝缘突起上形成桥接构件。

10. 发明申请

US20150279777A1 PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF 有权
标题翻译：包装设备及其制造方法
公开(公告)号：US20150279777A1
公开(公告)日：2015-10-01
申请号：US14458751
申请日：2014-08-13
申请人： PHOENIX PIONEER TECHNOLOGY CO., LTD.
发明人： SHIH-PING HSU
IPC分类号： H01L23/498 , H01L21/56 , H05K1/02 , H05K3/32 , H05K1/18 , H05K3/28 , H05K3/10 , H01L23/00 , H05K1/11
CPC分类号： H05K3/32 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/562 , H01L24/81 , H01L2224/18 , H01L2924/00 , H01L2924/12042 , H01L2924/181 , H05K3/4682 , Y10T29/4913 , Y10T29/49162
摘要： A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric material layer is disposed within partial zone of the first wiring layer. The first conductive pillar layer is disposed on the second surface of the first wiring layer. The first buffer layer is disposed within partial zone of the first conductive pillar layer. The second wiring layer is disposed on the first buffer layer and one end of the first conductive pillar layer. The protection layer is disposed on the first buffer layer and the second wiring layer.
摘要翻译：封装装置包括第一布线层，第一介电材料层，第一导电柱层，第一缓冲层，第二布线层和保护层。第一布线层具有与第一表面相对的第一表面和第二表面。第一介电材料层设置在第一布线层的局部区域内。第一导电柱层设置在第一布线层的第二表面上。第一缓冲层设置在第一导电柱层的局部区域内。第二布线层设置在第一缓冲层和第一导电柱层的一端。保护层设置在第一缓冲层和第二布线层上。

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