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1. 发明授权

US11638973B2 Silver brazing material and joining method using the silver brazing material 有权
公开(公告)号：US11638973B2
公开(公告)日：2023-05-02
申请号：US17048086
申请日：2018-10-24
申请人： TANAKA KIKINZOKU KOGYO K.K. , TOKYO BRAZE CO., LTD.
发明人： Takaomi Kishimoto , Masahiro Takahashi , Takashi Terui , Kotaro Matsu
IPC分类号： B23K35/30 , B23K1/00 , B23K1/19 , B23K101/20 , B23K103/12 , B23K1/008 , B23K31/02
摘要： A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

2. 发明授权

US11628519B2 Solder joint 有权
公开(公告)号：US11628519B2
公开(公告)日：2023-04-18
申请号：US17357443
申请日：2021-06-24
申请人： Lenovo (Singapore) Pte. Ltd.
发明人： Ko Inaba , Tetsu Takemasa , Tadashi Kosuga
IPC分类号： B23K35/26 , C22C12/00 , B23K1/00 , H05K3/34 , H01L25/07 , H01L25/18 , C22C13/02 , B23K1/20 , B23K1/008 , C22C13/00 , B23K101/42
摘要： A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μm2 and less than or equal to 5 μm2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

3. 发明申请

US20230060603A1 METHOD OF USING PROCESSING OVEN 有权
公开(公告)号：US20230060603A1
公开(公告)日：2023-03-02
申请号：US17872320
申请日：2022-07-25
申请人： Yield Engineering Systems, Inc.
发明人： Lei Jing , M Ziaul Karim , Kenneth Sautter , Kang Song
IPC分类号： B23K1/015 , H01L23/00 , B23K1/008 , B23K3/08
摘要： A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

4. 发明授权

US11589488B1 Warpage suppressing reflow oven 有权
公开(公告)号：US11589488B1
公开(公告)日：2023-02-21
申请号：US17547326
申请日：2021-12-10
申请人： ABLEPRINT TECHNOLOGY CO., LTD.
发明人： Chih-Horng Horng , Hsu-Wen Wu , Chi-Chieh Lai
IPC分类号： B23K1/00 , H05K13/00 , H05K13/04 , B23K3/08 , B23K37/04 , B23K1/008 , B23K101/42
摘要： Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

5. 发明授权

US11555227B2 Ni—Cr based alloy brazing material containing trace amount of V 有权
公开(公告)号：US11555227B2
公开(公告)日：2023-01-17
申请号：US16606926
申请日：2018-04-18
申请人： Sanyo Special Steel Co., Ltd.
发明人： Toshiyuki Sawada , Shingo Fukumoto
IPC分类号： C22C19/05 , B23K1/00 , B23K35/30 , B23K1/008 , B23K1/19 , B23K1/002 , B23K101/00 , B23K101/14 , B23K103/04
摘要： Disclosed is a Ni—Cr-based brazing alloy including, on the basis of mass %: 15%

6. 发明申请

US20220346759A1 METHOD FOR MANUFACTURING A BIOLOGICAL FLUID SENSOR 有权
公开(公告)号：US20220346759A1
公开(公告)日：2022-11-03
申请号：US17864051
申请日：2022-07-13
申请人： CoreSyte, Inc.
发明人： Adam Pizer , Dalton Pont , John V. Chiochetti
IPC分类号： A61B10/00 , B23K1/00 , B29C69/00 , A61B5/145 , A61B5/1477 , A61B5/00 , B23K26/402 , B23K26/384 , G01N33/487 , B23K1/008 , B23K26/382 , B23K26/38
摘要： The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

7. 发明授权

US11465225B1 Method of using processing oven 有权
公开(公告)号：US11465225B1
公开(公告)日：2022-10-11
申请号：US17692760
申请日：2022-03-11
申请人： Yield Engineering Systems, Inc.
发明人： Lei Jing , M Ziaul Karim , Kenneth Sautter , Kang Song
IPC分类号： B23K1/015 , B23K1/008 , B23K3/08 , H01L23/00 , B23K101/42 , B23K101/40 , B23K1/012 , H01L21/60 , B23K1/00
摘要： A method of using a solder reflow oven can include disposing at least one substrate including solder in a chamber of the oven. The method can include decreasing a pressure of the chamber to a first pressure between about 0.1-50 Torr. After decreasing the pressure of the chamber, the temperature of the at least one substrate can be increased to a first temperature. Formic acid vapor can be admitted into the chamber above the at least one substrate while nitrogen is discharged into the chamber below the at least one substrate. The method can also include removing at least a portion of the formic acid vapor from the enclosure. After the removing step, the temperature of the at least one substrate can be further increased to a second temperature higher than the first temperature. The at least one substrate can be maintained at the second temperature for a first time. And then, the at least one substrate can be cooled.

8. 发明授权

US11456274B1 Method of using a processing oven 有权
公开(公告)号：US11456274B1
公开(公告)日：2022-09-27
申请号：US17686514
申请日：2022-03-04
申请人： Yield Engineering Systems, Inc.
发明人： M Ziaul Karim , Lei Jing , Kenneth Sautter
IPC分类号： H01L23/00 , B23K1/008 , B23K37/04 , B23K101/40 , B23K101/42 , B23K1/015 , B23K1/012 , B23K1/00
摘要： A method of using an oven includes supporting a substrate on a rotatable spindle in a processing chamber of the oven and rotating the substrate. The method may also include raising the spindle with the substrate to a heating zone and activating a lamp assembly to heat a top surface of the substrate. The substrate may then be lowered to a dosing zone and a chemical vapor directed into the processing chamber above the substrate. The substrate may then be further heated using the lamp assembly and cooled.

9. 发明授权

US11440116B2 Reflow oven with a zeolite box, and a method for recovering gas with such zeolite box 有权
公开(公告)号：US11440116B2
公开(公告)日：2022-09-13
申请号：US16640153
申请日：2018-08-09
申请人： Illinois Tool Works Inc.
发明人： Chuanbo Wang
IPC分类号： B23K3/08 , B23K1/008 , B23K101/42 , B23K1/00 , B23K1/20
摘要： The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107). After most of the flux is removed from the gases in the separator (105), the flux is further removed in the zeolite box (107). In addition, polygonal zeolites have certain volumes and are supported in the zeolite box (107) to form clearances, and thus almost no resistance is brought about to the flow of the gases in the zeolite box (107).

10. 发明申请

US20210394292A1 OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODS 有权
公开(公告)号：US20210394292A1
公开(公告)日：2021-12-23
申请号：US17349805
申请日：2021-06-16
申请人： Kulicke and Soffa Industries, Inc.
发明人： Christoph Benno Luechinger
IPC分类号： B23K1/008 , B23K1/00 , B23K3/08 , H05K3/34
摘要： An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.

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