专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20220404700A1 RESIST COMPOUND, METHOD FOR FORMING PATTERN USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME 有权
公开(公告)号：US20220404700A1
公开(公告)日：2022-12-22
申请号：US17890409
申请日：2022-08-18
申请人： Samsung Electronics Co., Ltd.
发明人： Jin Kyun LEE , Hyun Taek OH
IPC分类号： G03F7/038 , C08F230/04 , C08F222/40 , H01L21/027 , H01L21/3213
摘要： Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:

2. 发明申请

US20210395420A1 RESIN COMPOSITION 有权
公开(公告)号：US20210395420A1
公开(公告)日：2021-12-23
申请号：US17280060
申请日：2019-10-01
申请人： CUBICURE GMBH
发明人： Christian FRANK , Christian GORSCHE , Robert GMEINER
IPC分类号： C08F222/40 , C08F222/10 , C08F2/48 , C08J3/24 , B29C64/124
摘要： A resin composition for three dimensional printing at elevated temperatures forming high temperature-resistant materials, the resin composition comprising a heat curable component A having one or more chemical species chosen from the group comprised of monomers and/or oligomers and/or prepolymers of maleimide derivatives according to formula and a light-curable component B having one or more chemical species chosen from the group comprised of (meth)acrylate, (meth)acrylamide, vinyl esters, vinyl ether, vinyl, allyl, alkinyl or styrenic compounds as well as derivatives thereof substituted with at least one molecule from the group from which component A is chosen, wherein the amount of component A ranges from 30 wt % to 95 wt % based on the total weight of components A and B and the amount of the light-curable component B ranges from 5 to 70 wt %, based on the total weight of components A and B.

3. 发明申请

US20210284782A1 COMPOSITION FOR FORMING BLOCK COPOLYMER LAYER FOR FORMATION OF MICROPHASE-SEPARATED PATTERN 有权
公开(公告)号：US20210284782A1
公开(公告)日：2021-09-16
申请号：US17258227
申请日：2019-07-16
申请人： NISSAN CHEMICAL CORPORATION
发明人： Ryuta MIZUOCHI , Yasunobu SOMEYA , Hiroyuki WAKAYAMA , Masami KOZAWA , Shinsuke TADOKORO
IPC分类号： C08F299/02 , C08J5/18 , C08F212/14 , C08F230/08 , C08F220/18 , C08F222/40 , C08F212/08 , H01L21/3065 , B29C71/02
摘要： A self-assembled film forming composition for forming a phase-separated structure of a block copolymer layer on a substrate, containing a block copolymer and a solvent, and is configured such that: the block copolymer is obtained by bonding a silicon-free polymer to a silicon-containing polymer that contains, as a constituent unit, styrene that is substituted by a silicon-containing group; the silicon-free polymer contains a structure derived from formula [1-1] or formula [1-2]; and the silicon-containing group contains one silicon atom. [In formula [1-1] or formula [1-2], each of R1 and R2 independently represents a hydrogen atom, a halogen atom or an alkyl group having 1-10 carbon atoms; and each of R3-R5 independently represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group having 1-10 carbon atoms, an alkoxy group having 1-10 carbon atoms, a cyano group, an amino group, an amide group or a carbonyl group.]

4. 发明授权

US11104788B2 Composition, cured product and laminate 有权
公开(公告)号：US11104788B2
公开(公告)日：2021-08-31
申请号：US16470420
申请日：2017-12-14
申请人： DIC Corporation
发明人： Masato Otsu , Kazuo Arita , Etsuko Suzuki , Junji Yamaguchi , Tomohiro Shimono
IPC分类号： C08L35/00 , C08F222/40 , C08J5/24 , H01L23/29 , H05K1/03
摘要： An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.

5. 发明申请

US20210047519A1 COATING AND PRIMER 有权
公开(公告)号：US20210047519A1
公开(公告)日：2021-02-18
申请号：US17041135
申请日：2019-03-04
申请人： Mercene Coatings AB
发明人： Tommy HARALDSSON , Henrik MIKAELSSON , Carl Fredrik CARLBORG , Jowan ROSTAMI
IPC分类号： C09D4/00 , C09D5/00 , C08F222/06 , C08F222/40 , C08F222/14 , C08F220/18 , C08F2/50 , C08K5/17
摘要： There is provided a method of coating a substrate comprising at least one secondary amine, by contacting the substrate surface with a compound comprising at least one carbon-carbon double bond, wherein an electron withdrawing group is on at least one side of the carbon-carbon double bond, so that a complex is formed between nitrogen in the secondary amine and the carbon-carbon double bond. Then a reaction is initiated to form a covalent bond by reaction of nitrogen in the secondary amine and the carbon-carbon double bond, by subjecting at least a part of the formed complexes to actinic radiation, wherein the wavelength of the actinic radiation is adapted to be absorbed by the complex. When a further top-coat is added, the resulting surface has a high hardness, and the scratch resistance is improved.

6. 发明授权

US10822527B2 Thermosetting adhesive composition, thermosetting adhesive film, and composite film 有权
公开(公告)号：US10822527B2
公开(公告)日：2020-11-03
申请号：US15542115
申请日：2016-01-19
申请人： Tomoegawa Co., Ltd.
发明人： Jun Tochihira , Ryu Harada
IPC分类号： C09J7/35 , B32B27/00 , C09J7/20 , C09J4/06 , C08F290/06 , C08F257/02 , C09J7/25 , C09J7/22 , B32B15/082 , B32B15/085 , B32B27/20 , B32B27/28 , B32B27/30 , C08F222/40 , C08F212/34
摘要： This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

7. 发明申请

US20200263046A1 SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MODELING 审中-公开
公开(公告)号：US20200263046A1
公开(公告)日：2020-08-20
申请号：US16651523
申请日：2018-09-27
申请人： KAO CORPORATION
发明人： Tadanori YOSHIMURA
IPC分类号： C09D11/107 , C08F220/14 , C08F212/08 , C08F222/40 , C08F220/46 , C08F220/18 , B29C64/40 , B33Y70/00
摘要： A soluble material for three-dimensional modeling according to the present invention is a soluble material for three-dimensional modeling that is used as a material of a support material for supporting a three-dimensional object when the three-dimensional object is manufactured by a 3D printer of an FDM system, in which the soluble material for three-dimensional modeling contains a copolymer α having a vinyl monomer unit A that has a hydrophilic group, and having a vinyl monomer unit B that has a group interacting with the hydrophilic group and is other than the vinyl monomer unit A. The soluble material for three-dimensional modeling according to the present invention is capable of providing a method for manufacturing a three-dimensional object. The method restrains a support material from being foamed and is thus capable of restraining a three-dimensional object from being lowered in modeling accuracy, even when the support material is exposed to a high humidity and then used for manufacturing of the three-dimensional object with an FDM system of using a high heat resistance material as a modeling material, and that is, because of the support material's large dissolution speed into neutral water, capable of removing the support material, quickly from a precursor of the three-dimensional object without using a strong alkaline aqueous solution.

8. 发明授权

US10747109B2 Colored photosensitive resin composition and light shielding spacer prepared therefrom 有权
公开(公告)号：US10747109B2
公开(公告)日：2020-08-18
申请号：US15993678
申请日：2018-05-31
申请人： Rohm and Haas Electronic Materials Korea Ltd.
发明人： Hyung-Tak Jeon , Ji Ung Kim , Kyung-Jae Park , Jong-Ho Na , Hyung Gu Kim
IPC分类号： G03F7/038 , G02F1/1339 , G03F7/00 , G03F7/031 , H01L51/00 , C08F283/10 , G03F7/105 , G03F7/027 , C08F222/40 , C08F265/06 , C08F2/48 , G03F7/033 , H01L51/52 , H01L27/32 , C08F222/10
摘要： The present invention relates to a colored photosensitive resin composition capable of forming a cured film that does not generate uneven wrinkles on its surface, to thereby minimize spots on the display screen that may be generated by a defect in the gap between the upper and lower plates during their assembly, with the formation of an excellent step difference and a pattern in a high resolution; and to a light shielding spacer produced therefrom and used for a liquid crystal display, an organic EL display, or the like.

9. 发明授权

US10738144B2 Flame-retardant bismaleimide resin and preparation method thereof 有权
公开(公告)号：US10738144B2
公开(公告)日：2020-08-11
申请号：US16314907
申请日：2016-12-03
申请人： SOOCHOW UNIVERSITY
发明人： Aijuan Gu , Jiatao Miao , Guozheng Liang , Li Yuan
IPC分类号： C08F222/40 , C09K21/14 , C08G73/10
摘要： Disclosed are a flame-retardant bismaleimide resin and a preparation method thereof comprising: forming an eugenol salt suspensoid from a whole biomass eugenol in the present of a strong alkali metal base, adding dropwisely a solution of phosphorus oxychloride in methyl chloride to react to obtain a biomass-based phosphate flame-retardant; mixing bismaleimide, 2,2′-diallylbisphenol with the obtained phosphate, curing and posttreating to obtain the flame-retardant bismaleimide resin. Compared with petroleum-based bismaleimide resin, the flame-retardant bismaleimide resin prepared by the present invention is obtained from eugenol derived from biomass, and the raw material is green and renewable. It maintains mechanical properties and processing properties of the petroleum-based bismaleimide resin and has an excellent flame-retardant property. The preparation method provided by the invention has the advantages of low cost and simple production process, and has wide application prospect in the fields of aerospace, electronic information, electrical insulation and the like.

10. 发明授权

US10703845B2 Preparation of maleate and maleimide monomers and polymeric materials from triglycerides 有权
公开(公告)号：US10703845B2
公开(公告)日：2020-07-07
申请号：US15812157
申请日：2017-11-14
申请人： University of South Carolina
发明人： Chuanbing Tang , Liang Yuan , Meghan Lamm
IPC分类号： C08F222/40 , C07D207/452 , C07C233/20 , C07C29/136 , C07C231/02 , C08F222/22
摘要： Monomer compounds and methods of synthesizing monomer compounds are disclosed. The monomer compounds can include maleate and maleimide monomers having fatty acid moieties. The monomer compounds can be derived from renewable sources such as corn, soybean, and sunflower oils. The monomer compounds can be formed into homopolymers as well as copolymers. The copolymers can include petroleum-derived monomers such as styrene, ethylene, and propylene.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式