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    • 5. 发明授权
    • Microwave or UHF plasma improved apparatus
    • 微波或UHF等离子体改进装置
    • US4630566A
    • 1986-12-23
    • US798309
    • 1985-11-15
    • Jes AsmussenDonnie K. Reinhard
    • Jes AsmussenDonnie K. Reinhard
    • H01J27/16H01J37/32C23C13/08H01J7/46
    • H01J37/32256H01J27/16H01J37/32192H01J37/32284H01J37/32678
    • A method for etching or chemically treating a surface of an article utilizing a radio frequency wave ion generating apparatus which provides a thin disk shaped plasma is described. The plasma disks can have a relatively large diameter (on the order of magnitude 50 centimeters). The plasma disks can be created without using a static magnetic field. The radio frequency waves are preferably microwaves or UHF. The method is particularly useful for ion or free radical irradiation of the surface provided in the plasma or for irradiation of the surface by ions accelerated outside a cavity containing the plasma. Disk plasmas are created over a wide pressure range (10.sup.-4 Torr to 1 atmosphere) and are highly ionized at low pressures. An apparatus adapted for treating a surface of an article with ions from a plasma is also described. The method and apparatus are preferably used for treating a surface forming part of an integrated circuit.
    • 描述了利用提供薄盘形等离子体的射频波离子产生装置对制品的表面进行蚀刻或化学处理的方法。 等离子盘可以具有相对大的直径(大约50厘米数量级)。 可以在不使用静态磁场的情况下创建等离子体盘。 射频最好是微波或UHF。 该方法对于提供在等离子体中的表面的离子或自由基照射或通过在包含等离子体的空腔外加速的离子照射表面特别有用。 在宽压力范围(10-4乇至1个大气压)下产生盘等离子体,并在低压下高度电离。 还描述了适于用来自等离子体的离子处理制品的表面的装置。 该方法和装置优选用于处理形成集成电路部分的表面。
    • 7. 发明授权
    • Heater assembly and a heat-treatment method of semiconductor wafer using
the same
    • 加热器组件和使用其的半导体晶片的热处理方法
    • US4535228A
    • 1985-08-13
    • US539413
    • 1983-10-06
    • Yoshiki MimuraTetsuji AraiHiroshi ShimizuSatoru Fukuda
    • Yoshiki MimuraTetsuji AraiHiroshi ShimizuSatoru Fukuda
    • C23C14/54C23C16/46C30B31/12C30B31/22H05B3/00F27D11/00C23C13/08H05B1/00
    • C30B31/22C23C14/541C23C16/46C30B31/12H05B3/0047
    • Disclosed herein are a heater assembly and a method for heat-treating a semiconductor wafer using the same. The heater assembly is formed of a heating device having a ring-shaped portion and a holder combined with the heating device detachably each other. A wafer material such as a semiconductor wafer is held on the holder of the heater assembly. A heat-treatment is effected by heating the wafer material by means of application of light radiated from a light source, which is formed of one or more lamps, while heating or after having heated the circumferential portion of the wafer by the heating device of the heater assembly. Owing to the subsidiary heating of the circumferential portion, the wafer may be heat-treated at substantially the same temperature in its entirety. Thus, the heat-treatment does not develop such large "warping" impairing subsequent treatment and/or treatment of the wafer or "slip lines". The heater assembly may be used successfully and conveniently in effecting uniform heating. The detachable structural feature of the holder facilitates its cleaning and this is effective in keeping the atmosphere of the irradiation space always clean.
    • 本文公开了一种加热器组件和使用其的半导体晶片的热处理方法。 加热器组件由具有环形部分的加热装置和与加热装置组合的保持器彼此可拆卸地形成。 诸如半导体晶片的晶片材料被保持在加热器组件的保持器上。 通过施加从一个或多个灯形成的光源辐射的光来加热晶片材料,同时加热或者在通过加热装置加热晶圆的圆周部分之后加热晶片材料,进行热处理 加热器总成。 由于周向部分的辅助加热,晶片可以在基本上相同的温度下进行热处理。 因此,热处理不会产生妨碍后续处理和/或处理晶片或“滑移线”的这种大的“翘曲”。 加热器组件可以成功地且方便地用于均匀加热。 保持架的可拆卸结构特征有助于其清洁,并且这对于保持照射空间的气氛始终清洁是有效的。
    • 8. 发明授权
    • Vacuum evaporation apparatus
    • 真空蒸发装置
    • US4534312A
    • 1985-08-13
    • US527662
    • 1983-08-30
    • Ryohei ShinyaShin'ichi MiuraRikio Aozuka
    • Ryohei ShinyaShin'ichi MiuraRikio Aozuka
    • C23C14/54C23C13/08
    • C23C14/541
    • A vacuum evaporation apparatus for depositing an evaporant as a thin film on a substrate comprises a sealed container including a substrate support for mounting thereon the substrate. A heat medium such as of diphenyl, for example, is filled in the substrate support. The heat medium in the substrate support is supplied with heat by a heater. When heated, the heat medium is vaporized and the vapor gas having absorbed heat of evaporation is moved quickly from a high-temperature region to a low-temperature region. The vapor gas in the low-temperature region is supersaturated and turned into the heat medium liquid. The heat energy born as latent heat by the vapor gas is given off to heat the substrate support uniformly. With this thermosiphon action, the substrate can be heated through the substrate support so as to have a uniform overall temperature distribution for forming a uniformly deposited thin film on the substrate surface.
    • 用于在基板上沉积作为薄膜的蒸发剂的真空蒸发装置包括密封容器,其包括用于在其上安装基板的基板支撑件。 诸如二苯的热介质例如填充在基板支撑件中。 衬底支架中的热介质由加热器供热。 当加热时,热介质被蒸发,并且吸收了蒸发热的蒸汽气体从高温区域迅速移动到低温区域。 低温区域的蒸汽气体过饱和并变成热介质液体。 放出作为蒸汽气体潜热的热能被均匀地加热衬底支架。 利用这种热虹吸作用,可以通过衬底支撑件加热衬底,以便具有均匀的总体温度分布,以在衬底表面上形成均匀沉积的薄膜。