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    • 6. 发明授权
    • Method for contactless capacitive thickness measurements
    • 非接触电容厚度测量方法
    • US08315833B2
    • 2012-11-20
    • US12664975
    • 2008-08-19
    • Stefan KonermannMarkus Stein
    • Stefan KonermannMarkus Stein
    • G01B7/02G01B11/02G01B13/02
    • G01B7/087
    • A method for contactless capacitive thickness measurement of a flat material (10) that is placed in the fringe field (32) of a capacitor (C1,C2), with simultaneous measurement of the width L of an air gap (16) between the flat material and the capacitor plates, in which the capacities gL, kL of two capacitors (C1, C2) are measured whose fringe fields (32) decay at different rates towards the flat material (10), and in that both, the thickness D of the flat material (10) and the width L of the air gap (16) are determined on the basis of the condition that, for each capacitor (C1, C2), the measured capacity gL, kL is equal to the integral of the capacity gradient g′, k′ over the thickness of the flat material (10).
    • 一种放置在电容器(C1,C2)的边缘区域(32)中的扁平材料(10)的非接触电容厚度测量方法,同时测量平坦的空气间隙(16)的宽度L 材料和电容器板,其中测量两个电容器(C1,C2)的电容gL,kL,其边缘场(32)以不同的速率朝向扁平材料(10)衰减,并且在两者中,厚度D 基于对于每个电容器(C1,C2),测量容量gL,kL等于容量的积分的条件来确定气隙(16)的扁平材料(10)和气隙(16)的宽度L 梯度g',k'超过扁平材料(10)的厚度。
    • 7. 发明申请
    • PHYSICAL SENSOR FOR AUTOFOCUS SYSTEM
    • AUTOFOCUS系统的物理传感器
    • US20110069291A1
    • 2011-03-24
    • US12879113
    • 2010-09-10
    • Michael R. Sogard
    • Michael R. Sogard
    • G01B13/02G03B27/52
    • G01B13/065G03B27/52
    • Methods and apparatus for compensating for forces applied by a system which measures a height of a photoresist-coated surface of a wafer are disclosed. According to one aspect, a method for measuring a height associated with a wafer includes utilizing a measurement of an air flow through an air gauge or air bearing to estimate the height, determining a first magnitude of a bearing load exerted on the wafer from the air flow measurement, and compensating for the bearing load. The bearing load is exerted by an arrangement configured to determine the height associated with the wafer a first direction. Compensating for the bearing load includes applying an opposing force to the wafer that includes at least a vacuum preload force. The vacuum preload force is applied in a second direction that is opposite from the first direction. The opposing force is calculated to have a second magnitude that is approximately equal to the first magnitude.
    • 公开了用于补偿由测量晶片的光致抗蚀剂涂覆表面的高度的系统施加的力的方法和装置。 根据一个方面,一种用于测量与晶片相关联的高度的方法包括利用通过空气表或空气轴承的空气流的测量来估计高度,从空气中确定施加在晶片上的轴承负载的第一幅度 流量测量和补偿轴承负载。 轴承负载由配置成确定与第一方向相关联的高度的高度的配置来施加。 补偿轴承负载包括向晶片施加相反的力,其包括至少真空预载力。 真空预压力沿与第一方向相反的第二方向施加。 相反的力被计算为具有近似等于第一幅度的第二幅度。
    • 8. 发明授权
    • Spectra based endpointing for chemical mechanical polishing
    • 基于光谱的化学机械抛光终点
    • US07406394B2
    • 2008-07-29
    • US11261742
    • 2005-10-28
    • Boguslaw A. SwedekDominic J. BenvegnuJeffrey Drue David
    • Boguslaw A. SwedekDominic J. BenvegnuJeffrey Drue David
    • G01B5/02G01B7/02G01B11/02G01B13/02
    • B24B49/12B24B37/013B24B37/205B24B49/08B24D7/14G05B15/02H01L21/31053H01L21/3212H01L22/26
    • Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
    • 用于基于频谱的终点的方法和装置。 一种终点方法包括选择两个或更多个参考光谱。 每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱,并且具有大于目标厚度的厚度。 为特定的基于光谱的端点确定逻辑选择参考光谱,以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。 该方法包括获得两个或更多个当前光谱。 每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时,在第二衬底上从感兴趣的膜反射的白光的光谱。 该方法包括为第二基底确定何时已经实现了抛光步骤的终点。
    • 10. 发明申请
    • Weaponry camera sight
    • 武器相机视线
    • US20050246910A1
    • 2005-11-10
    • US10840400
    • 2004-05-07
    • Michael Mowers
    • Michael Mowers
    • F41G1/00F41G1/467G01B13/02G01C3/00G01C3/22
    • G01C3/22F41B5/1492F41G1/467F41J5/10
    • The weaponry camera sight has a digital electronic display of the sight picture for the shooter. The display may be magnified as desired, thereby eliminating need for a scope sight. The device may also include a range finding device, with range information being provided on screen. The camera may also be used to record the image viewed on screen, if so desired. Remotely situated controls may be provided for operating the zoom magnification and recording feature, thereby allowing the shooter to operate the present camera sight without need to move his or her hands on the weapon. The present camera sight is particularly well suited for use with an archery bow, but may be used with a firearm if so desired.
    • 武器相机瞄准具有用于射手的视线图的数字电子显示器。 显示器可以根据需要被放大,从而消除对瞄准镜的需要。 该装置还可以包括范围查找装置,其范围信息在屏幕上提供。 如果需要,相机也可以用于记录在屏幕上观看的图像。 可以提供遥控位置的控制以操作变焦倍率和记录特征,从而允许射手操作本照相机瞄准镜,而不需要将他或她的手移到武器上。 本相机视野特别适合用于射箭弓,但如果需要,也可与枪支配合使用。