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1. 发明授权

US09568537B1 Apparatus and method for measuring and controlling the internal temperature of a semiconductor device 有权
标题翻译：用于测量和控制半导体器件的内部温度的装置和方法
公开(公告)号：US09568537B1
公开(公告)日：2017-02-14
申请号：US14813282
申请日：2015-07-30
申请人： Texas Instruments Incorporated
发明人： Jason Christopher McCullough
IPC分类号： G01R31/10 , G01R31/26
CPC分类号： G01R31/2875
摘要： A method for controlling the temperature of a semiconductor device-under-test (DUT) by forming an apparatus (100) including a feedback loop between a Temperature Forcing Unit (TFU, 110) conductively tied to an Automated Test Equipment (ATE, 120) having a chamber encasing the DUT (122), and the ATE conductively connected to a Control Computer (CC, 130) conductively tied back to the TFU. The CC is calibrated with reference values of temperatures and measured voltages using a diode integral with a diode-isolated circuit protecting a pin of the DUT against electrostatic discharge. The thermal air stream to stabilize the temperature of the ATE chamber loaded with the DUT is reset by the CC until the DUT is stabilized at the goal temperature.
摘要翻译：一种用于通过形成在导体连接到自动测试设备（ATE，120）的温度强制单元（TFU，110）之间的反馈回路的装置（100）来控制半导体器件（DUT）的温度的方法，具有封装DUT（122）的室，以及导电连接到控制计算机（CC，130）的ATE导电地绑在TFU上。使用与二极管隔离电路集成的二极管与温度和测量电压的参考值对CC进行校准，从而保护DUT的引脚免受静电放电。用于稳定装载有DUT的ATE室的温度的热空气流由CC复位，直到DUT稳定在目标温度。

2. 发明授权

US09470720B2 Test system with localized heating and method of manufacture thereof 有权
标题翻译：具有局部加热的测试系统及其制造方法
公开(公告)号：US09470720B2
公开(公告)日：2016-10-18
申请号：US13791797
申请日：2013-03-08
申请人： SMART Storage Systems, Inc.
发明人： David Lee Dean , Robert W. Ellis , Scott Harrow
IPC分类号： G01R31/10 , G01R1/44 , G01R3/00 , G01R31/28 , G01R1/04
CPC分类号： G01R1/44 , G01R1/0458 , G01R3/00 , G01R31/2874 , Y10T29/49117
摘要： A test system, and a method of manufacture thereof, including: a thermal management head including a heat spreader; an electronic device in direct contact with the heat spreader; and an electrical current for transferring energy between the heat spreader and the electronic device.
摘要翻译：一种测试系统及其制造方法，包括：热管理头，包括散热器; 与散热器直接接触的电子设备; 以及用于在散热器和电子设备之间传递能量的电流。

3. 发明授权

US09360514B2 Thermal reliability testing systems with thermal cycling and multidimensional heat transfer 有权
标题翻译：具有热循环和多维热传递的热可靠性测试系统
公开(公告)号：US09360514B2
公开(公告)日：2016-06-07
申请号：US13828870
申请日：2013-03-14
申请人： Huy N. Phan , Dereje Agonafer
发明人： Huy N. Phan , Dereje Agonafer
IPC分类号： G01R31/10 , G01R31/00 , G01R31/28
CPC分类号： G01R31/003 , G01R31/2862 , G01R31/2874
摘要： Devices, methods, and systems for facilitating heat transfer around an electronic component during thermal-cycle testing are presented. A system may include a core, a plurality of solid state heating/cooling devices, and a plurality of heat sinks. The core defines one or more cavities for receiving an electronic component. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures and heat it to above the boiling point of water. A method of thermal-cycle testing may include a core defining a cavity for receiving an electronic component, selectively inducing said heating/cooling devices to operate in a heating mode or a cooling mode, and measuring and recording conditions during the test.
摘要翻译：提出了用于在热循环测试期间促进电子部件周围的热传递的装置，方法和系统。系统可以包括芯，多个固态加热/冷却装置和多个散热器。该芯限定用于接收电子部件的一个或多个空腔。该系统可以包括鼓风机和导管。在操作中，系统可以将电子部件冷却至低于环境温度并将其加热到高于水的沸点。热循环测试的方法可以包括限定用于接收电子部件的空腔的芯，选择性地诱导所述加热/冷却装置在加热模式或冷却模式下操作，以及在测试期间测量和记录条件。

4. 发明授权

US09354272B2 Automated loading/unloading of devices for burn-in testing 有权
公开(公告)号：US09354272B2
公开(公告)日：2016-05-31
申请号：US13538646
申请日：2012-06-29
申请人： Wan Yen Teoh , Paiboon Subpanyadee , Kurt Joseph Perez , Chai Soon Teo , Swee Hin Ong
发明人： Wan Yen Teoh , Paiboon Subpanyadee , Kurt Joseph Perez , Chai Soon Teo , Swee Hin Ong
IPC分类号： G01R31/10 , G01R31/28
CPC分类号： G01R31/2867
摘要： The automatic loading and unloading of devices for burn-in testing is facilitated by loading burn-in boards in a magazine with the stacked boards in the magazine moved into and out of a burn-in oven by means of a trolley. The trolley can include an elevator whereby a plurality of magazines can be stacked in the oven for the simultaneous burn-in testing of devices mounted on the burn-in boards. Each board has rollers on one end which are engagable by pneumatically actuated cam mechanisms for inserting the board into an electrical contact in the oven for burn-in tests. Preferably, the cam mechanisms allow for extraction of a single board for inspection.

5. 发明授权

US09140748B2 Burn in board, system, and method 有权
标题翻译：刻录在板上，系统和方法
公开(公告)号：US09140748B2
公开(公告)日：2015-09-22
申请号：US13470789
申请日：2012-05-14
申请人： Kin Sun Wong , Che Chin Wu
发明人： Kin Sun Wong , Che Chin Wu
IPC分类号： G01R31/10 , G01R31/28
CPC分类号： G01R31/2863
摘要： Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated circuits connected to the burn in board. Each integrated circuit may be configured to at least connect to a plurality of components to be subjected to a burn in process at room temperature; receive at least one signal for testing the plurality of components during the burn in process; and transmit the at least one signal to each of the plurality of components. Corresponding systems and methods are also provided.
摘要翻译：提供了系统，方法和装置，以便于在包括集成电路的板中使用燃烧。装置可以包括板上的烧伤和连接到板上的烧伤的多个集成电路。每个集成电路可以被配置为至少连接到在室温下进行烧制的多个部件; 在处理过程中接收至少一个用于测试多个部件的信号; 并将所述至少一个信号发送到所述多个组件中的每一个。还提供了相应的系统和方法。

6. 发明授权

US09081048B2 Method and device for the quality control of superconducting bands 有权
标题翻译：超导带质量控制方法和装置
公开(公告)号：US09081048B2
公开(公告)日：2015-07-14
申请号：US13395138
申请日：2010-08-02
申请人： Michael Bäcker , Jan Wiezoreck
发明人： Michael Bäcker , Jan Wiezoreck
IPC分类号： G01R31/10 , G01R33/12
CPC分类号： G01R33/1238 , G01R33/1246
摘要： A method and device for quality control of superconducting bands includes: cooling a section of the superconducting band to a temperature at which said band section becomes superconducting, generating an electrical transport current in the superconducting band section in the longitudinal direction of the band by contacting with a contact assembly, contacting the cooled band section with electrical contacts of the contact assembly, which are spaced apart in the longitudinal direction of the band, in order to form a measurement section over a partial length of the band section, continuously moving at least one part of the band through the contact section and/or measurement section to generate the transport current, detecting a physical measured variable using measurement contacts, wherein the physical measured variable is a measure of the superconducting electrical transport properties of the band section or a part of the band.
摘要翻译：一种用于超导带的质量控制的方法和装置包括：将超导带的一部分冷却到所述带段变为超导的温度，通过与超导带的纵向方向接触，在超导带段中产生电传输电流接触组件，使冷却的带部分与接触组件的沿电缆的纵向间隔开的电触点接触，以便在带部分的一部分长度上形成测量部分，连续移动至少一个通过接触部分和/或测量部分的带的一部分，以产生传输电流，使用测量接触检测物理测量变量，其中物理测量变量是频带部分的超导电输送特性或部分乐队。

7. 发明授权

US09076751B2 Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods 有权
标题翻译：具有自热结构的半导体器件，其制造方法和测试方法
公开(公告)号：US09076751B2
公开(公告)日：2015-07-07
申请号：US13221594
申请日：2011-08-30
申请人： Jia Yang Ko , Ying-Han Chiou , Ling-Sung Wang
发明人： Jia Yang Ko , Ying-Han Chiou , Ling-Sung Wang
IPC分类号： G01R31/10 , H01L23/34 , G01R31/28 , H01L21/66
CPC分类号： H01L23/345 , G01R31/2875 , G01R31/2884 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor devices with self-heating structures, methods of manufacture thereof, and testing methods are disclosed. In one embodiment, a semiconductor device includes a workpiece, an active electrical structure disposed over the workpiece, and at least one self-heating structure disposed proximate the active electrical structure. The active electrical structure may include a capacitor, a resistor, a conductive line, a segment of a conductive line, a transistor, or a combination thereof.
摘要翻译：公开了具有自热结构的半导体器件，其制造方法和测试方法。在一个实施例中，半导体器件包括工件，设置在工件上方的有源电气结构以及靠近有源电气结构设置的至少一个自热结构。有源电结构可以包括电容器，电阻器，导电线，导电线段，晶体管或其组合。

8. 发明授权

US08854069B2 Production integrated circuit test handler using microcontroller reading a thermal diode of a device under test for temperature control 有权
标题翻译：生产集成电路测试处理器使用微控制器读取被测器件的热二极管进行温度控制
公开(公告)号：US08854069B2
公开(公告)日：2014-10-07
申请号：US13343866
申请日：2012-01-05
申请人： Joseph Shelton Mayfield , Nolan Riley , Chad Turner , Angelo Sanchez
发明人： Joseph Shelton Mayfield , Nolan Riley , Chad Turner , Angelo Sanchez
IPC分类号： G01R31/10 , G01R31/28
CPC分类号： G01R31/2867 , G01R31/2877
摘要： Production test of integrated circuit face thermal management challenges with higher power devices. Current production handlers do not have adequate thermal management characteristics. This invention employs thermal diodes on each device under test and a closed loop microprocessor controlled feedback system for thermal control during production test. The feedback system controls the open/close state of a valve supplying cooling fluid to bathe the integrated circuit based upon the difference between a temperature indicated by at least one thermal diode and a set point temperature.
摘要翻译：集成电路生产测试面对热管理挑战与高功率器件。当前的生产处理者没有足够的热管理特性。本发明在被测试的每个器件上采用热二极管，并在生产测试期间采用闭环微处理器控制的反馈系统进行热控制。反馈系统基于由至少一个热二极管指示的温度和设定点温度之间的差异来控制供应冷却流体的阀的打开/关闭状态以洗涤集成电路。

9. 发明授权

US08717049B2 System and method for testing computer under varying environmental conditions 失效
标题翻译：在不同环境条件下测试计算机的系统和方法
公开(公告)号：US08717049B2
公开(公告)日：2014-05-06
申请号：US13193623
申请日：2011-07-29
申请人： Ling-Yu Xie , Xing-Ping Xie
发明人： Ling-Yu Xie , Xing-Ping Xie
IPC分类号： G01R31/10 , G01K7/00
CPC分类号： G06F11/24
摘要： A system for testing a computer includes a single chip microcontroller (SCM), an environmental test chamber, and a control device connected to the SCM and the environmental test chamber. The SCM repeatedly switches the computer on and off and monitors the computer's response. The environmental test chamber accommodates the computer. The control device receives monitored data from the SCM and controls temperature and humidity in the environmental test chamber.
摘要翻译：用于测试计算机的系统包括单片微控制器（SCM），环境测试室和连接到SCM和环境测试室的控制装置。 SCM反复打开和关闭计算机，并监视计算机的响应。环境试验室容纳电脑。控制装置接收来自SCM的监测数据，并控制环境试验箱内的温度和湿度。

10. 发明申请

US20130300444A1 BURN IN BOARD, SYSTEM, AND METHOD 有权
标题翻译：焚烧板，系统和方法
公开(公告)号：US20130300444A1
公开(公告)日：2013-11-14
申请号：US13470789
申请日：2012-05-14
申请人： Kin Sun Wong , Che Chin Wu
发明人： Kin Sun Wong , Che Chin Wu
IPC分类号： G01R31/10
CPC分类号： G01R31/2863
摘要： Systems, methods, and apparatuses are provided for facilitating the use of a burn in board comprising integrated circuits. An apparatus may comprise a burn in board and a plurality of integrated circuits connected to the burn in board. Each integrated circuit may be configured to at least connect to a plurality of components to be subjected to a burn in process at room temperature; receive at least one signal for testing the plurality of components during the burn in process; and transmit the at least one signal to each of the plurality of components. Corresponding systems and methods are also provided.
摘要翻译：提供了系统，方法和装置，以便于在包括集成电路的板中使用燃烧。装置可以包括板上的烧伤和连接到板上的烧伤的多个集成电路。每个集成电路可以被配置为至少连接到在室温下进行烧制的多个部件; 在处理过程中接收至少一个用于测试多个部件的信号; 并将所述至少一个信号发送到所述多个组件中的每一个。还提供了相应的系统和方法。

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