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    • 8. 发明申请
    • SYSTEM AND METHOD FOR CLOSED-LOOP MEMORY POWER CAPPING
    • US20220229483A1
    • 2022-07-21
    • US17153583
    • 2021-01-20
    • DELL PRODUCTS, LP
    • Hasnain ShabbirCarlos Henry
    • G06F1/3225G06F1/20G06F11/30
    • An information handling system includes a management controller configured to determine whether to initiate control of power consumption of a memory subsystem of the information handling system. A closed-loop memory thermal controller may receive temperature values to determine a temperature setpoint for the memory subsystem, and calculate an error value that is a difference between the temperature setpoint and a temperature measurement. if the error value is within a temperature margin, then the thermal controller may determine a proportional-integral power signal based on the temperature margin and the temperature measurement; and determine a proportional-integral gain based on a maximum rate of change of the temperature measurement between polling events of the temperature measurement and a polling rate of the temperature measurement. The thermal controller may also determine a modified proportional-integral power signal based on the proportional-integral gain, wherein the modified proportional-integral power signal is used to determine a power adjustment value of the memory subsystem; and in response to an initiation from the management controller to control the power consumption of the memory subsystem, control the power consumption of the memory subsystem based on the power adjustment value.
    • 9. 发明申请
    • PEAK POWER MANAGEMENT SELF-CHECK
    • US20220199192A1
    • 2022-06-23
    • US17249400
    • 2021-03-01
    • Micron Technology, Inc.
    • Jeremy BinfetLiang Yu
    • G11C29/50G06F1/3225
    • A memory device includes a first memory die of a plurality of memory dies, the first memory die comprising a first memory array and a first power management component, wherein the first power management component is configured to send a first test value to one or more other power management components on one or more other memory dies of the plurality of memory dies during a first power management cycle of a first power management token loop. The memory device further includes a second memory die of the plurality of memory dies, the second memory die comprising a second memory array and a second power management component, wherein the second power management component is configured to receive the first test value from the first power management component during the first power management cycle of the first power management token loop and send a second test value to the one or more other power management components on the one or more other memory dies of the plurality of memory dies during a second power management cycle of a second power management token loop. At least one of the first power management component or the second power management component is configured to compare the first test value and the second test value to a set of expected values to determine whether signal connections between the first power management component and the second power management component are functional.