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    • 2. 发明授权
    • Semiconductor chip selectively providing a predetermined potential to a dead pin
    • 半导体芯片选择性地为死针提供预定电位
    • US06819580B2
    • 2004-11-16
    • US10356537
    • 2003-02-03
    • Masayuki KonishiTakehiko Shimomura
    • Masayuki KonishiTakehiko Shimomura
    • G11C506
    • G11C5/14G11C5/066G11C7/1051G11C7/1057G11C7/1078G11C7/1084G11C2207/105
    • A semiconductor chip is provided, with which presence of dead pins can be easily noticed and a process for controlling the potential at dead pins can be performed easily. An input/output controller (IOC) for coordinating the input/output of signals through individual pins (PN1 to PN8) includes an input/output buffer (BFa) and the input/output buffer (BFa) includes a switch (SW4a) and a switch (SW4b). A setting memory (STMa) for storing settings for control of the input/output of signals in the input/output buffer (BFa) contains a memory table and the memory table contains an item about the dead pin potential control process so that a power-supply potential (Vdd) or a ground potential (GND) can be applied to the dead pins, i.e. the fourth pin (PN4) and the fifth pin (PN4).
    • 提供了一种半导体芯片,可以容易地看到死针的存在,并且可以容易地执行用于控制死针的电位的处理。 用于通过各个引脚(PN1至PN8)协调信号的输入/输出的输入/输出控制器(IOC)包括输入/​​输出缓冲器(BFa),输入/输出缓冲器(BFa)包括开关(SW4a)和 开关(SW4b)。 用于存储用于控制输入/输出缓冲器(BFa)中的信号的输入/输出的设置的设置存储器(STMa)包含存储表,并且存储表包含关于死端电位控制处理的项目, 供电电位(Vdd)或接地电位(GND)可以施加到死针,即第四针(PN4)和第五针(PN4)。
    • 5. 发明授权
    • Semiconductor storage method and device supporting multi-interface
    • 半导体存储方法和器件支持多接口
    • US06795327B2
    • 2004-09-21
    • US10261001
    • 2002-09-30
    • Guoshun DengXiaohua ChengFeng Xiang
    • Guoshun DengXiaohua ChengFeng Xiang
    • G11C506
    • G06F3/0607G06F3/0661G06F3/0679G11C7/1006
    • A semiconductor storage method and device supporting multi-interface includes the acts of setting up a semiconductor storage device in which is installed a semiconductor storage medium module, a controller module, and an interface module which supports at least two interfaces of different standards, wherein the interfaces include serial or parallel or wireless communication interfaces; connecting the storage device, through the interfaces of different standards, to at least one data processing system which has the corresponding standard interface; establishing information exchange channel between the storage device and the data processing system based upon the serial or parallel or wireless communication interfaces; the storage device exchanges data with the data processing system through the information exchange channel. The method is to provide convenient mobile storage devices for data processing systems that have different interfaces, and to make data and files exchange easily and conveniently among different data processing systems.
    • 一种半导体存储方法和支持多接口的装置包括设置半导体存储装置的动作,其中安装有半导体存储介质模块,控制器模块和支持至少两个不同标准接口的接口模块,其中, 接口包括串行或并行或无线通信接口; 通过不同标准的接口将存储设备连接到具有相应标准接口的至少一个数据处理系统; 基于串行或并行或无线通信接口在存储设备和数据处理系统之间建立信息交换通道; 存储装置通过信息交换通道与数据处理系统交换数据。 该方法是为具有不同接口的数据处理系统提供方便的移动存储设备,并且在不同的数据处理系统之间方便地进行数据和文件的交换。
    • 6. 发明授权
    • Method and apparatus for data transfer
    • 用于数据传输的方法和装置
    • US06771526B2
    • 2004-08-03
    • US10073475
    • 2002-02-11
    • Paul A. LaBerge
    • Paul A. LaBerge
    • G11C506
    • G06F13/4234
    • An electronic system includes a memory module configured to operate in multiple modes. The memory module includes at least one connection configured to perform different functions when the memory module is operating in different modes. In one embodiment, the memory operates in a normal mode and an SPD mode. While in SPD mode, the connection performs one or more SPD functions, such as operating as an SMBus interface connection. In normal mode, the connection serves a function associated with normal operation of the module, such as addressing functions.
    • 电子系统包括被配置为以多种模式操作的存储器模块。 存储器模块包括至少一个被配置为当存储器模块以不同模式操作时执行不同功能的连接。 在一个实施例中,存储器以正常模式和SPD模式运行。 在SPD模式下,连接执行一个或多个SPD功能,例如作为SMBus接口连接操作。 在正常模式下,连接起到与模块正常运行相关的功能,如寻址功能。
    • 7. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US06765814B2
    • 2004-07-20
    • US10315042
    • 2002-12-10
    • Ryuji NishiharaHiroyuki Sadakata
    • Ryuji NishiharaHiroyuki Sadakata
    • G11C506
    • G11C5/063G11C8/14
    • Strap lines are provided in a layer above word lines so that the word lines and the strap lines are connected to each other in strapping regions separately provided at the ends of memory cell array portions in a conventional semiconductor memory device having a problem wherein the area of the memory cell array portions is increased. Each memory cell is formed of a MOS transistor and a MOS capacitor in a layout of a memory cell array portion according to a standard CMOS process. Memory cells of this structure have a sufficiently large pitch between bit lines and, therefore, contacts for connecting word lines to strap lines in an upper layer are provided between the bit lines, as low resistance metal wires, in the same layer as the bit lines. Thereby, it becomes unnecessary to separately provide strapping regions at the ends of memory cell array portions and it becomes unnecessary to increase the intervals between the memory cells by increasing the size of the memory cell in the layout according to the standard CMOS process and, therefore, contacts for strapping word lines can be provided for each memory cell, without increasing the area of memory cell array portions or the chip area, so that the propagation delay of drive signals in word lines can be reduced and high speed memory operation can be implemented.
    • 带状线设置在字线上方的层中,使得字线和带线彼此连接在具有问题的常规半导体存储器件中的分开设置在存储单元阵列部分的端部处的带状区域中,其中, 存储单元阵列部分增加。 根据标准CMOS工艺,每个存储单元由存储单元阵列部分的布局中的MOS晶体管和MOS电容器形成。 这种结构的存储单元在位线之间具有足够大的间距,因此,用于将字线连接到上层中的带线的触点设置在与位线相同的层中作为低电阻金属线的位线 。 因此,不需要在存储单元阵列部分的端部分开提供带状区域,并且不需要通过根据标准CMOS工艺增加布局中的存储单元的尺寸来增加存储单元之间的间隔,因此 可以为每个存储单元提供用于捆扎字线的触点,而不增加存储单元阵列部分或芯片面积的面积,从而可以减少字线中的驱动信号的传播延迟并且可以实现高速存储器操作 。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06717833B2
    • 2004-04-06
    • US09750625
    • 2000-12-12
    • Goro KitsukawaYoji IdeiKanji OishiAkira Ide
    • Goro KitsukawaYoji IdeiKanji OishiAkira Ide
    • G11C506
    • G11C7/10
    • A 64Mb DRAM includes memory cell array areas 15, sense amplifier areas 16, subword driver areas 17, and cross areas 18. For each horizontal input/output line IOH paraleel to the word line W, throuh holes on the sense amplifiers provide connections between the second metal line hierarchy M2 and the third metal line hierarchy M3. The vertical input/output line IOV parallel to the bit line BL runs through a plurality of memory cell array areas 15 in a direction parallel to the column selection signal line YS and connects to the main amplifier MA outside the memory cell array areas 15. In this input/output line configuration, the greater the number of word lines W that are selected, the greater the number of bits that can be output.
    • 64Mb DRAM包括存储单元阵列区域15,读出放大器区域16,子字驱动器区域17和交叉区域18.对于到字线W的每个水平输入/输出线路IOH路由器,传感放大器上的孔洞提供 第二金属线层级M2和第三金属线层级M3。 与位线BL并联的垂直输入/输出线IOV沿与列选择信号线YS平行的方向延伸穿过多个存储单元阵列区域15,并连接到存储单元阵列区域15外的主放大器MA。 该输入/输出线配置,所选择的字线W的数量越大,可以输出的位数越大。