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1. 发明授权

US10825611B1 Multilayer electronic component and mounting structure thereof 有权
公开(公告)号：US10825611B1
公开(公告)日：2020-11-03
申请号：US16930668
申请日：2020-07-16
申请人： TDK CORPORATION
发明人： Tomohisa Fukuoka , Tetsuhiro Takahashi , Akinori Ohi
IPC分类号： H01G4/00 , H01G4/30 , H01G4/248 , H01G4/012 , H05K1/18 , H05K1/11 , H01G4/12
摘要： To improve a mounting reliability while maintaining a thickness of the external electrode at a side face of a multilayer electronic component thin. The multilayer electronic component includes ceramic body in which ceramic layers and an external electrode formed to an end face of the ceramic body. The upper electrode layer includes an element having higher standard electrode potential than Cu. The external electrode includes an external electrode end part and an external electrode extension part which is integrally formed with the external electrode end part. 1.20≤t2/t1≤4.50 is satisfied in which t1 is a total thickness of a thickness of the intermediate electrode layer thickness and t2 is a length from an end of the base electrode layer to an end of the upper electrode layer along the first axis of the external electrode extension part connected by the conductive adhesive.

2. 发明授权

US10537025B2 Capacitor and method of manufacturing the same 有权
公开(公告)号：US10537025B2
公开(公告)日：2020-01-14
申请号：US15883504
申请日：2018-01-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Su Youn You , Jae Yeol Choi , Hyun Hee Gu , Byoung-Jin Chun
IPC分类号： H01G2/06 , H01G4/00 , H05K1/18 , H01G4/012 , H01G4/232 , H01G4/005 , H01G4/12 , H01G4/248 , H01G4/30 , H05K1/11
摘要： A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.

3. 发明授权

US10513433B2 Laminated ceramic chip component including nano thin film layer, manufacturing method therefor, and atomic layer vapor deposition apparatus therefor 有权
公开(公告)号：US10513433B2
公开(公告)日：2019-12-24
申请号：US15529470
申请日：2014-11-28
申请人： HONGIK UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION , MAX TECH CO., LTD.
发明人： Jin Ha Hwang , Dae Bum Park , Yong Jo Choo , Hyun Suk Kim , Da Hee Park , Myeong Hee Ko , Kyoung Woo Kwon , Hee Su Hwang , Jeong Wan Choi
IPC分类号： H01G4/30 , H01G4/00 , B82B3/00 , H01G13/00 , H01G4/232 , B32B18/00 , C23C16/455 , C23C16/458 , C23C16/46 , H01G4/005 , H01G4/33 , H05K3/34 , C23C16/40 , B32B37/00 , B32B37/24 , H01G4/12
摘要： The present disclosure discloses the laminated ceramic chimp component including an element part having a ceramic main body and an internal electrode placed in the ceramic main body; an external electrode part having a first external electrode and a second external electrode, the first and second external electrodes being provided with side electrodes covering both side surfaces of the ceramic main body, respectively, upper electrodes covering portions of both sides of an upper surface of the ceramic main body, respectively, and lower electrodes covering portions of both sides of a lower surface of the ceramic main body, respectively; and a nano thin film layer formed of electric insulation material and applied to a region including the upper electrodes, the method for manufacturing the same and the atomic layer deposition apparatus for the same.

4. 发明授权

US10079096B2 Ceramic capacitor 有权
公开(公告)号：US10079096B2
公开(公告)日：2018-09-18
申请号：US15607763
申请日：2017-05-30
申请人： Murata Manufacturing Co., Ltd.
发明人： Kazunori Usui
IPC分类号： H01G4/12 , H01G4/30 , H01G4/35 , H01G4/00 , H01G4/005 , C23C14/34
CPC分类号： H01G4/1209 , C23C14/34 , H01G4/005 , H01G4/232 , H01G4/302 , H01G4/306
摘要： In a planar view of a ceramic capacitor that has low ESL and is embeddable into a substrate, lengths of first and second external electrodes are L1, lengths from portions of the first and second external electrodes farthest from a capacitor main body to portions closer to the capacitor main body by about 40% of a thickness of the first or second external electrode in a laminating direction are L2, a ratio L2/L1 is about 80% or more and about 90% or less. In the planar view, a length of a third external electrode is L3, a length from a portion of the third external electrode farthest from the capacitor main body to a portion closer to the capacitor main body by about 40% of a thickness of the third external electrode in the laminating direction is L4, a ratio L4/L3 is about 80% or more.

5. 发明授权

US09847171B2 Flexible cable and electronic device 有权
公开(公告)号：US09847171B2
公开(公告)日：2017-12-19
申请号：US14926444
申请日：2015-10-29
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru Kato
IPC分类号： H01G4/228 , H01G4/005 , H01G4/00 , H01G4/30 , H01G4/002 , H01G4/33 , H01G4/14 , H05K1/18 , H01G4/26 , H05K1/16
CPC分类号： H01G4/002 , H01G4/14 , H01G4/228 , H01G4/26 , H01G4/33 , H05K1/162 , H05K1/189 , H05K2201/055 , H05K2201/09309 , H05K2201/10189
摘要： A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate.

6. 发明授权

US09796636B2 Ceramic lamellar composites 有权
公开(公告)号：US09796636B2
公开(公告)日：2017-10-24
申请号：US15150612
申请日：2016-05-10
申请人： The United States of America, as represented by the Secretary of the Navy
发明人： Edward P. Gorzkowski, III , Ming-Jen Pan
IPC分类号： H01G4/00 , C04B35/00 , C04B38/06 , B28B1/00 , C04B35/468 , C04B35/626 , C04B38/00 , C04B41/00 , C04B41/48 , C04B41/49 , C04B41/83 , C04B41/84 , H01G4/12 , H01G4/20 , H01B3/30 , H01B3/40 , H01B3/46 , C04B111/00
CPC分类号： C04B38/0605 , B28B1/007 , B28B1/008 , C04B35/4682 , C04B35/6261 , C04B35/62655 , C04B38/00 , C04B41/009 , C04B41/4853 , C04B41/4884 , C04B41/4961 , C04B41/83 , C04B41/84 , C04B2111/00844 , C04B2235/6562 , C04B2235/6565 , C04B2235/787 , H01B3/302 , H01B3/40 , H01B3/46 , H01G4/1227 , H01G4/206 , C04B35/468
摘要： Disclosed herein is a method of: placing between a cooling element and an opposing surface a slurry of: a dielectric powder containing barium titanate, a dispersant, a binder, and water; maintaining the cooling element at a temperature below the opposing surface to cause the formation of ice platelets perpendicular to the surface of the cooling element and having the powder between the platelets; subliming the ice platelets to create voids; sintering the powder to form the dielectric material; and filling the voids with the polymeric material. The process can produce a composite having: a sintered dielectric material of barium titanate and platelets of a polymeric material embedded in the dielectric material. Each of the platelets is perpendicular to a surface of the composite.

7. 发明授权

US09607764B2 Method of fabricating high energy density and low leakage electronic devices 有权
公开(公告)号：US09607764B2
公开(公告)日：2017-03-28
申请号：US14845463
申请日：2015-09-04
申请人： Chun-Yen Chang
发明人： Chun-Yen Chang
IPC分类号： B05D5/12 , H01G4/00 , H01G4/06 , H01G4/30 , H01G4/002 , H01G4/255
CPC分类号： H01G4/06 , H01G4/002 , H01G4/008 , H01G4/255 , H01G4/30
摘要： A method for fabricating a magnetic capacitor is provided. A first conducting material is deposited to form a first electrode layer. One or more first ferro-magnetic elements are deposited to form magnetic layer and are aligned and magnetized to produce a magnetic field. An insulating material is deposited to form an insulating layer. A second conducting material is deposited to form a second electrode layer. The one or more ferro-magnetic elements are aligned and magnetized to apply the magnetic field to the insulator layer so that the magnetic field is perpendicular to the first electrode layer and the second electrode layer, and so that the magnetic field is periodic along the length of the insulator layer and results in electric dipoles being formed in the insulator layer when a voltage is applied between the first electrode layer and the second electrode layer.

8. 发明授权

US09536667B2 Ceramic powder and multi-layer ceramic capacitor 有权
标题翻译：陶瓷粉末和多层陶瓷电容器
公开(公告)号：US09536667B2
公开(公告)日：2017-01-03
申请号：US14714107
申请日：2015-05-15
申请人： TAIYO YUDEN CO., LTD.
发明人： Youichi Mizuno
IPC分类号： H01G4/00 , H01G4/12 , H01G4/30 , C04B35/468 , B32B18/00 , C01G23/00 , B82Y30/00
CPC分类号： H01G4/1227 , B32B18/00 , B82Y30/00 , C01G23/006 , C01P2002/01 , C01P2002/34 , C01P2002/72 , C01P2004/03 , C01P2004/62 , C01P2004/64 , C04B35/4682 , C04B2235/3236 , C04B2235/5445 , C04B2235/5454 , C04B2235/761 , C04B2237/346 , H01G4/30 , Y10T428/2982
摘要： A multi-layer ceramic capacitor is made by alternately layering a dielectric layer constituted by a sintered body of a ceramic powder, and an internal electrode layer. The ceramic powder contains, as a main composition, barium titanate powder having a perovskite structure with a median size of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate particle having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more.
摘要翻译：通过交替层叠由陶瓷粉末的烧结体构成的电介质层和内部电极层来制造多层陶瓷电容器。作为主要成分，陶瓷粉末含有通过SEM观察测定的中值粒径为200nm以下的钙钛矿结构的钛酸钡粉末，其中钛酸钡粉末使得具有双重缺陷的钛酸钡颗粒的百分比通过TEM观察测定，钛酸钡粉末小于10％，晶格c / a为1.0075以上。

9. 发明授权

US09251957B2 Multilayer ceramic condenser and method of manufacturing the same 有权
标题翻译：多层陶瓷电容器及其制造方法
公开(公告)号：US09251957B2
公开(公告)日：2016-02-02
申请号：US13194366
申请日：2011-07-29
申请人： Hyung Joon Kim
发明人： Hyung Joon Kim
IPC分类号： H01G4/06 , H01G4/00 , H01G4/30 , H01G4/12 , H01G4/012 , H01G4/248
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/1209 , H01G4/248 , Y10T29/43
摘要： A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.
摘要翻译：多层陶瓷电容器包括多层主体，第一外电极，第二外电极，第一侧部和第二侧部。多层主体具有第一面，第二面，第三面和第四面。多层主体包括多个内部电极和内部电极之间的电介质层。电介质层由第一陶瓷电介质粉末形成。第一侧部分和第二侧部分形成在多层主体的第二侧面和第四侧上，并且由比第一陶瓷电介质粉末更小的第二陶瓷电介质粉末形成。第一侧部或第二侧部的平均粒径与多层主体的电介质层的平均粒径相同或以下。

10. 发明申请

US20150195905A1 PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME 审中-公开
标题翻译：包装板及其制造方法和使用其的半导体封装
公开(公告)号：US20150195905A1
公开(公告)日：2015-07-09
申请号：US14457109
申请日：2014-08-11
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Myung Sam KANG , Seung Eun LEE , Seung Yeop KOOK , Ki Jung SUNG , Ju Hee PARK , Je Gwang YOO , Jin Seon PARK
IPC分类号： H05K1/02 , H05K1/16 , H01G4/00 , H05K1/03 , H05K3/02 , H05K3/46 , H05K1/18 , H05K1/11
CPC分类号： H05K3/4644 , H01G4/33 , H01L21/6835 , H01L23/145 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/642 , H01L2221/68345 , H01L2224/32112 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L2924/15313 , H01L2924/181 , H05K1/115 , H05K1/162 , H05K3/284 , H05K2201/10159 , H05K2203/1453 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode.
摘要翻译：提供了一种封装板，其制造方法和使用该封装板的半导体封装。根据本公开的示例性实施例，封装基板可以包括：绝缘层; 在绝缘层上形成的电路层; 形成在所述绝缘层中并且包括形成在所述上电极和所述下电极之间的上电极，下电极和电介质层的电容器; 以及将电路层连接到上电极和下电极的通孔。

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