专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06888223B2 Use of photoresist in substrate vias during backside grind 失效
标题翻译：在背面研磨过程中在基板通孔中使用光致抗蚀剂
公开(公告)号：US06888223B2
公开(公告)日：2005-05-03
申请号：US10405763
申请日：2003-04-01
申请人： Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Amye L. Wells
发明人： Donald W. Brouillette , Joseph D. Danaher , Timothy C. Krywanczyk , Amye L. Wells
IPC分类号： H01L21/768 , H01L23/048
CPC分类号： H01L21/76898
摘要： A structure and method of formation. The substrate has front and back surfaces on opposite sides of the substrate. The substrate has a backside portion extending from the back surface to a second depth into the substrate as measured from the front surface. At least one via is formed in the substrate and extends from the front surface to a via depth into the substrate. The via depth is specific to each via. The via depth of each via is less than an initial thickness of the substrate. The second depth does not exceed the minimum via depth of the via depths. Organic material (e.g., photoresist) is inserted into each via. The organic material is subsequently covered with a tape, followed by removal of the backside portion of the substrate. The tape is subsequently removed from the organic material, followed by removal of the organic material from each via.
摘要翻译：一种结构和形成方法。衬底在衬底的相对侧上具有前表面和后表面。衬底具有从前表面测量的从后表面延伸到衬底的第二深度的背侧部分。在衬底中形成至少一个通孔，并从前表面延伸到通孔深度进入衬底。通孔深度特定于每个通孔。每个通孔的通孔深度小于衬底的初始厚度。第二深度不超过通孔深度的最小值。将有机材料（例如光致抗蚀剂）插入每个通孔中。随后用带覆盖有机材料，随后除去基材的背面部分。随后从有机材料中取出胶带，然后从每个通孔中除去有机材料。

2. 发明授权

US08164187B2 Flip chip device and manufacturing method thereof 有权
标题翻译：倒装芯片器件及其制造方法
公开(公告)号：US08164187B2
公开(公告)日：2012-04-24
申请号：US12429237
申请日：2009-04-24
申请人： Wen-Chih Chen , Sheng-Shu Yang
发明人： Wen-Chih Chen , Sheng-Shu Yang
IPC分类号： H01L23/048
CPC分类号： H01L24/13 , H01L23/3121 , H01L24/17 , H01L24/28 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/13099 , H01L2224/1319 , H01L2224/13644 , H01L2224/16 , H01L2224/83136 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01022 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/3511 , H01L2924/01031 , H01L2924/00014 , H01L2924/00
摘要： A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.
摘要翻译：一种使用LCD-COG（玻璃液晶显示芯片）技术制造的倒装芯片器件。所述倒装芯片器件包括衬底，至少一个具有有多个柔性凸起的有源区的芯片。顺应性凸块居中设置在芯片的中心，用于电连接芯片和基板。将粘合剂涂覆在基底的接合区域和用于连接基底和芯片的芯片上。通过限制顺应性凸块的位置使得它们居中地设置在芯片上，减小了基板的热翘曲。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式