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    • 3. 发明申请
    • Transmission line orientation transition
    • 传输线方向转换
    • US20050030120A1
    • 2005-02-10
    • US10883401
    • 2004-06-30
    • Douglas OkamotoAnthony SweeneyThomas Gaudette
    • Douglas OkamotoAnthony SweeneyThomas Gaudette
    • H01P3/08H01P5/02H01P5/08H01P5/10H03H5/02
    • H01P5/02H01P5/10
    • A circuit structure may include first and second transmission lines, each with a center conductor extending along or between one or more spaced-apart conducting surfaces. A conducting surface, such as a ground, reference, or signal-return plane, of the first transmission line may have an orientation that is transverse to the orientation of a conducting surface of the second transmission line. Each of the conducting surfaces of the first transmission line may contact one or more of the conducting surfaces of the second transmission line. In some examples, one or both of the transmission lines are slablines, and in some examples, the contacting edges or edges adjacent the contacting edges of the respective conductive surfaces are curved.
    • 电路结构可以包括第一和第二传输线,每个传输线具有沿一个或多个间隔开的导电表面之间或之间延伸的中心导体。 第一传输线的导电表面,例如接地,参考或信号返回平面可以具有横向于第二传输线的导电表面的取向的取向。 第一传输线的每个导电表面可接触第二传输线的一个或多个导电表面。 在一些示例中,传输线中的一个或两个是板条线,并且在一些示例中,与相应导电表面的接触边缘相邻的接触边缘或边缘是弯曲的。
    • 5. 发明授权
    • Multilayer microelectronic circuit
    • 多层微电子电路
    • US6046409A
    • 2000-04-04
    • US31074
    • 1998-02-26
    • Tetsuya IshiiHiroshi KatagiriTadashi ShingakiTatsuya Takemura
    • Tetsuya IshiiHiroshi KatagiriTadashi ShingakiTatsuya Takemura
    • H01G4/40H01L27/01H01P7/00H01P7/08H03H5/02H03H7/01H03H7/09H05K1/02H05K1/18H05K3/34H05K1/11H03H3/02
    • H01P7/084H05K1/0243H05K2201/09181H05K2201/10068H05K3/3442
    • A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.
    • 一种多层微电子电路,其直接安装在基板上并用作例如谐振器。 多层微电子电路包括多个介质层和图案化电极,它们彼此层叠以形成层压结构,电介质层和图案化电极形成电路。 层叠结构具有沿着电介质层和图案化电极层叠的方向延伸的侧面。 输入线形成在一个侧面并与电路的输入部分连接。 输出线形成在一个侧表面并与电路的输出部分相连接。 在一个侧面形成接地线,并与电路的接地部连接。 另外,形成在一个侧表面上用于连接电路的部分的信号线。 信号线具有位于多个微电子电路直接安装在基板上的安装表面附近的端部,其中信号线的端部与安装表面分离,从而与基板电绝缘。
    • 6. 发明授权
    • Method of producing electrical resonant circuits, specifically resonance
labels
    • 生产电路谐振电路的方法,特殊谐振标签
    • US5170544A
    • 1992-12-15
    • US688273
    • 1991-04-22
    • Fritz Pichl
    • Fritz Pichl
    • H01F27/00G01V15/00G08B13/24H01G4/40H03H5/02H05K1/16
    • G08B13/242G01V15/00G08B13/2437G08B13/244G08B13/2442H05K1/162H05K1/165Y10T29/435Y10T29/4902
    • In order to produce resonance labels a coil having the shape of a spiral and a first capacitor surface located adjacent the innermost winding of the spiral and, furthermore, a supplementary surface adjacent the outer end of the spiral are produced at one side only of a supporting foil by an etching method from an aluminum foil arranged on the supporting foil. An aluminum foil strip is sealed onto the other side of the supporting foil at a superimposed position relative to the first capacitor surface, a few windings of the spiral and the supplementary surface to form the second capacitor surface. After establishing an electrical connection between this strip and the supplementary surface at the other side an electrical resonant circuit is produced. Due to the sealed on aluminum foil strip the etching procedure is reduced to only one side with the advantage that considerably less poisonous etching sludge is thus produced.
    • 为了产生共振标签,具有螺旋形状的线圈和邻近螺旋的最内侧绕组的第一电容器表面,此外,邻近螺旋外端的附加表面仅在支撑 通过蚀刻方法从布置在支撑箔上的铝箔制成箔。 铝箔条在相对于第一电容器表面的叠加位置,螺旋的几个绕组和辅助表面上被密封在支撑箔的另一侧上,以形成第二电容器表面。 在该条与另一侧的辅助表面之间建立电连接之后,产生电谐振电路。 由于密封在铝箔条上,蚀刻过程仅减少到一侧,其优点是因此产生相当少的有害蚀刻污泥。
    • 8. 发明授权
    • Resonator structure
    • 谐振器结构
    • US4977383A
    • 1990-12-11
    • US421360
    • 1989-10-13
    • Erkki O. Niiranen
    • Erkki O. Niiranen
    • H01P1/20H01P7/00H03H5/02H05K1/18
    • H01P7/005H05K1/181H05K1/182
    • The invention relates to a resonator structure comprising a printed board of an insulating material; a helix resonator mounted on the printed board, the helix resonator being formed by a wire wound into a cylindrical coil with a number of turns, one of the turns comprising a straight portion bent in parallel with the surface of the printed board; and a casing surrounding the helix resonator and having at least an inner and outer surface made of an electrically conductive material. In order to improve the reproduction fidelity of the matching of the helix resonator in series production, the resonator structure according to the invention is characterized in that a micro strip conductor is provided on the surface of the printed board, the microstrip being electrically connected to a predetermined position on said straight portion.
    • 本发明涉及一种包括绝缘材料的印刷电路板的谐振器结构; 安装在印刷电路板上的螺旋谐振器,所述螺旋谐振器由缠绕成多圈的圆柱形线圈的线形成,其中一个匝包括与所述印刷电路板的表面平行弯曲的直线部分; 以及围绕所述螺旋谐振器并具有由导电材料制成的至少内表面和外表面的壳体。 为了提高串联生产中的螺旋谐振器的匹配的再现保真度,根据本发明的谐振器结构的特征在于,在印刷电路板的表面上设置微带导体,微带电连接到 在所述直线部分上的预定位置。