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1. 发明公开

US20240261883A1 BRAZING METHOD AND BRAZING APPARATUS FOR BRAZING METAL PLATES 审中-公开
公开(公告)号：US20240261883A1
公开(公告)日：2024-08-08
申请号：US18432910
申请日：2024-02-05
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Akihisa NISHIMURA , Toru SUGIYAMA , Koji KASAHARA
IPC分类号： B23K3/04 , B23K3/08
CPC分类号： B23K3/04 , B23K3/085
摘要： A brazing method for brazing metal pieces together via a brazing material includes the step of, in a heating chamber controlled to a preset oxygen concentration or less, sandwiching a workpiece of which the metal plates are stacked via the brazing material between a first heating plate and a second heating plate in such a manner that the first heating plate and the second heating plate cover the workpiece entirely as viewed in a thickness direction of the workpiece, and heating the workpiece to braze the metal plates together via the brazing material.

2. 发明公开

US20240246162A1 RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE 审中-公开
公开(公告)号：US20240246162A1
公开(公告)日：2024-07-25
申请号：US18157443
申请日：2023-01-20
申请人： Illinois Tool Works Inc.
发明人： Jonathan M. Dautenhahn
IPC分类号： B23K1/005 , B23K1/008 , B23K3/06 , B23K3/08
CPC分类号： B23K1/005 , B23K1/008 , B23K3/0653 , B23K3/08 , B23K2101/42
摘要： A wave soldering machine includes a housing, a conveyor that is movable with respect to the housing, a preheat module positioned along the conveyor, and a curtain module positioned at an entrance of the housing, the curtain module including at least one curtain and a heating element. A curtain module for a wave soldering machine or a reflow oven includes at least one curtain and a heating element. A method of containing an inert gas around a conveyor in a tunnel of a wave soldering machine or a reflow oven. In some embodiments, the method includes providing a curtain module at an end of the tunnel, the curtain module including at least one curtain and at least one heating element; and controlling a temperature of the heating element.

3. 发明授权

US12017341B2 Robot apparatus for soldering 有权
公开(公告)号：US12017341B2
公开(公告)日：2024-06-25
申请号：US16795901
申请日：2020-02-20
申请人： FANUC CORPORATION
发明人： Yoshio Motowaki
IPC分类号： B25J11/00 , B23K3/06 , B23K3/08 , B23K37/00 , B25J9/00 , B25J15/04 , H05K13/04 , B23K101/42
CPC分类号： B25J11/005 , B23K3/0607 , B23K3/082 , B23K3/087 , B23K37/00 , B25J9/0093 , B25J9/0096 , B25J15/04 , H05K13/0465 , B23K2101/42 , G05B2219/2601 , G05B2219/45029 , G05B2219/50391
摘要： The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.

4. 发明授权

US11963307B2 Vacuum-assisted BGA joint formation 有权
公开(公告)号：US11963307B2
公开(公告)日：2024-04-16
申请号：US17216863
申请日：2021-03-30
申请人： International Business Machines Corporation
发明人： Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
IPC分类号： B23K1/00 , B23K3/06 , B23K3/08 , H05K3/34 , B23K101/36
CPC分类号： H05K3/3478 , B23K1/0008 , B23K3/0623 , B23K3/08 , H05K3/3436 , B23K2101/36 , H05K2201/09136 , H05K2203/041 , H05K2203/082
摘要： A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

5. 发明授权

US11948037B2 Contactless card manufacturing apparatus and contactless card manufacturing method 有权
公开(公告)号：US11948037B2
公开(公告)日：2024-04-02
申请号：US17425775
申请日：2020-01-21
申请人： SHANGHAI ORIENTAL MAGNETIC CARD ENGINEERING CO., LTD.
发明人： Xiaodong Li
IPC分类号： G06K19/06 , B23K1/00 , B23K3/08 , G06K19/077 , B23K101/36
CPC分类号： G06K19/07758 , B23K1/0016 , B23K3/087 , G06K19/07773 , B23K2101/36
摘要： Disclosed are a contactless card manufacturing apparatus and a contactless card manufacturing method. The contactless card manufacturing apparatus comprises: an antenna implantation device, wherein the antenna implantation device is used for implanting a copper wire into a card manufacturing base material; a chip fixing device, wherein the chip fixing device is used for placing a chip at a fixed position on the card manufacturing base material; a pin welding device, wherein the pin welding device is used for respectively welding two ends of a wire to a pin of the chip and to the copper wire; and a transmission device, wherein the transmission device is used for transmitting the card manufacturing base material between the antenna implantation device, the chip fixing device and the pin welding device. According to the contactless card manufacturing apparatus and the contactless card manufacturing method, by means of the transmission device transmitting the card manufacturing base material, the card manufacturing base material is transmitted between the devices corresponding to various processing links, and with the card manufacturing base material as a reference, a required chip and antenna are disposed on the surface of the card manufacturing base material, such that a contactless card is manufactured in a more automated and standardized manner, and the labor costs for the manufacturing are reduced.

6. 发明公开

US20240044834A1 OXYGEN CONTENT DETECTING SYSTEM AND CONTROL METHOD THEREOF 审中-公开
公开(公告)号：US20240044834A1
公开(公告)日：2024-02-08
申请号：US18268862
申请日：2022-02-11
申请人： Illinois Tool Works Inc.
发明人： Yuexin Chen
IPC分类号： G01N27/409 , B23K3/08 , G01N27/419
CPC分类号： G01N27/409 , B23K3/08 , G01N27/419 , H05K3/34
摘要： An oxygen content detection system, comprising: a zirconia analyser, an air source, a mass flow valve and a first throttle valve. The zirconia analyser comprises: a signal processing apparatus, a housing and a probe. The housing is connected to the signal processing apparatus, and has a detection port configured to enable a gas from inside the hearth to enter a cavity of the housing via the detection port; the probe is disposed in the cavity of the housing, has one end connected to the signal processing apparatus, and is GC configured to detect an oxygen concentration in the gas that enters the cavity of the housing, and the signal processing apparatus receives and processes a detection result of the probe in order to generate an oxygen concentration signal; the housing is further provided with a communication hole in fluid communication with the cavity of the housing, and the air source is configured to be connected to the communication hole via a connection pathway, in order to input air to the cavity of the housing. The mass flow valve is disposed in the connection pathway, and configured to adjust the amount of air according to the oxygen concentration signal. The first throttle valve is disposed in the connection pathway, in order to adjust the flow speed of air in the connection pathway.

7. 发明授权

US11865645B2 Soldering apparatus 有权
公开(公告)号：US11865645B2
公开(公告)日：2024-01-09
申请号：US18033719
申请日：2021-06-14
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Yuta Saito
IPC分类号： B23K3/00 , B23K3/08 , B23K1/00 , H05K3/34
CPC分类号： B23K3/085 , B23K1/0016 , H05K3/341
摘要： A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.

8. 发明授权

US11865644B2 Brush assembly for a soldering tool cleaning device 有权
公开(公告)号：US11865644B2
公开(公告)日：2024-01-09
申请号：US18024166
申请日：2022-04-20
申请人： Apex Brands, Inc.
发明人： James Spaulding , Kyle Neubauer
IPC分类号： B23K3/02 , B08B9/02 , B23K3/08 , B08B1/00 , A46B13/00 , A46B13/02 , B08B1/04
CPC分类号： B23K3/08 , A46B13/001 , A46B13/02 , B08B1/002 , B08B1/04 , A46B2200/3073
摘要： A brush assembly for a device with a motor for cleaning soldering tools may include a base portion, a brush drive ring, and a locking assembly. The base portion may include a cylindrical core member and a cleaning brush. The cleaning brush may be disposed around a perimeter of the core member and may extend radially away from the core member. The locking assembly may include a first locking member, a second locking member, and an annular retention member. The first and second locking members may be configured to interface with one another. The annular retention member may define a resting state for the locking assembly, in which the first and second locking members may grip a shaft of the motor. The annular retention member may also define a transient state for the locking assembly, in which the first and second locking members may move out of the resting state.

9. 发明公开

US20230405701A1 NETWORK FOR CONTROLLING SOLDERING SYSTEMS AND METHOD THEREFOR 审中-公开
公开(公告)号：US20230405701A1
公开(公告)日：2023-12-21
申请号：US18037353
申请日：2021-11-15
申请人： ERSA GmbH
发明人： Timon Ahlgrimm , Klaus Rosenberger
IPC分类号： B23K3/047 , B23K1/00 , B23K3/03 , B23K3/08
CPC分类号： B23K3/0478 , B23K1/0016 , B23K3/033 , B23K3/08
摘要： A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and

a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.

10. 发明公开

US20230390847A1 SOLDER PASTE BEAD RECOVERY SYSTEM AND METHOD 审中-公开
公开(公告)号：US20230390847A1
公开(公告)日：2023-12-07
申请号：US18237458
申请日：2023-08-24
申请人： Illinois Tool Works Inc.
发明人： William A. Losiewicz , Matthew F. Schumacher , Bruce C. Seaton , Kenneth J. King
IPC分类号： B23K3/06 , B23K3/08
CPC分类号： B23K3/0638 , B23K3/08
摘要： A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

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