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1. 发明授权

US11518913B2 Fluid composition and method for conducting a material removing operation 有权
公开(公告)号：US11518913B2
公开(公告)日：2022-12-06
申请号：US17004988
申请日：2020-08-27
申请人： SAINT-GOBAIN CERAMICS & PLASTICS, INC.
发明人： Lin Fu , Jason A. Sherlock , Long Huy Bui , Douglas E. Ward
IPC分类号： C09G1/18 , C23F3/04 , C01B35/12
摘要： A fluid composition suitable for chemical mechanical polishing a substrate can in include a multi-valent metal borate, at least one oxidizer, and a solvent. The fluid composition can be essentially free of abrasive particles and may achieve a high material removal rate and excellent surface finish.

2. 发明授权

US10711159B2 Polishing compositions 有权
公开(公告)号：US10711159B2
公开(公告)日：2020-07-14
申请号：US15855323
申请日：2017-12-27
申请人： Fujifilm Planar Solutions, LLC
发明人： James McDonough
IPC分类号： C09G1/02 , C23F3/04 , B24B37/04 , H01L21/321 , H01L21/768
摘要： The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.

3. 发明申请

US20170278718A1 CMP POLISHING AGENT, MANUFACTURING METHOD THEREOF, AND METHOD FOR POLISHING SUBSTRATE 审中-公开
公开(公告)号：US20170278718A1
公开(公告)日：2017-09-28
申请号：US15511095
申请日：2015-08-28
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Mitsuhito TAKAHASHI
IPC分类号： H01L21/321 , C09K3/14 , C09G1/02 , C23F3/04
CPC分类号： H01L21/3212 , C01F17/0043 , C01P2004/62 , C01P2004/64 , C09G1/02 , C09K3/1463 , C23F3/04 , H01L21/31053 , H01L21/76224
摘要： The present invention provides a CMP polishing agent containing polishing particles, a protective agent, and water, wherein the protective agent is a silsesquioxane polymer having a polar group. This provides a CMP polishing agent which can reduce polishing scratches produced due to polishing in a CMP process and has high polishing selectivity.

4. 发明授权

US09489978B2 Method of surface-treating metal component 有权
标题翻译：表面处理金属成分的方法
公开(公告)号：US09489978B2
公开(公告)日：2016-11-08
申请号：US14119644
申请日：2012-06-01
申请人： Tatsuji Tamura
发明人： Tatsuji Tamura
IPC分类号： G11B23/00 , C23F3/04 , C21D9/00 , C21D1/74
CPC分类号： G11B23/00 , C21D1/74 , C21D9/0068 , C23F3/04
摘要： Provided is a method for surface-treating a metal component, whereby a pseudo-plated layer can be formed on a surface of a metal component, and quality equivalent to plating or other coating process can be obtained. The method includes a chemical polishing step scraping a surface of a base plate formed into a given shape through chemical polishing by 0.5 micrometer or more, and a heat treat pseudo-plating step forming a pseudo-plated layer on the surface through a heat treatment conducted by heating the base plate at a solution treatment temperature or above, for example, 850 degrees C. or above, preferably approximate 1040 degrees C., in a reducing atmosphere after the polishing step.
摘要翻译：提供一种表面处理金属成分的方法，由此可以在金属成分的表面上形成假镀层，可以获得与电镀或其它涂布方法相当的质量。该方法包括化学抛光步骤，通过0.5微米或更大的化学抛光将形成为给定形状的基板的表面刮擦，并通过热处理在表面上形成假镀层的热处理假电镀步骤通过在固化处理温度以上，例如850℃以上，优选约1040℃，在研磨工序后的还原气氛中加热底板。

5. 发明申请

US20150259575A1 POLISHING COMPOSITION 审中-公开
标题翻译：抛光组合物
公开(公告)号：US20150259575A1
公开(公告)日：2015-09-17
申请号：US14727467
申请日：2015-06-01
申请人： NITTA HAAS INCORPORATED
发明人： Rika TANAKA , Haruki NOJO , Yoshiharu OTA
IPC分类号： C09G1/02 , C23F3/06 , C23F3/04
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , C23F3/04 , C23F3/06 , H01L21/3212
摘要： A polishing composition of the invention is a polishing composition which is suitable for polishing a metal film, which is so-called final polishing, and contains colloidal silica having an average particle size of 20 nm or more and less than 80 nm which is determined by particle size distribution measurement using a light scattering method as abrasive grains; and at least one selected from iodic acid and its salt as an oxidizing agent, with the balance of water. By containing such components, the polishing composition shows nonselectivity, while being sufficiently suppressed in dishing and erosion.
摘要翻译：本发明的抛光组合物是适用于抛光所谓的最终抛光的金属膜的抛光组合物，并且含有平均粒度为20nm以上且小于80nm的胶体二氧化硅，其由使用光散射法作为磨粒的粒度分布测量; 和选自碘酸及其盐中的至少一种作为氧化剂，余量为水。通过含有这些组分，抛光组合物显示非选择性，同时充分抑制凹陷和侵蚀。

6. 发明授权

US5762819A Baths and process for chemical polishing of stainless steel surfaces 失效
标题翻译：用于不锈钢表面化学抛光的浴缸和工艺
公开(公告)号：US5762819A
公开(公告)日：1998-06-09
申请号：US702435
申请日：1996-09-24
申请人： Christian Franck , Jean-Marie Oreins
发明人： Christian Franck , Jean-Marie Oreins
IPC分类号： C09K13/06 , C23F3/06 , C23G1/08 , C23F3/04
CPC分类号： C23F3/06
摘要： Phosphoric acid-free baths for chemical polishing of stainless steel surfaces, including, in aqueous solution, a mixture of hydrochloric acid and of nitric acid, an optionally substituted hydroxybenzoic acid, a cationic surfactant and ferricyanide complex ions.
摘要翻译： PCT No.PCT / EP95 / 00942 Sec。 371日期：1996年9月24日 102（e）1996年9月24日PCT 1995年3月13日PCT公布。公开号WO95 / 26428 日期1995年10月5日不锈钢表面化学抛光的无磷酸浴，包括在水溶液中，盐酸和硝酸的混合物，任选取代的羟基苯甲酸，阳离子表面活性剂和铁氰化物络合物离子。

7. 发明授权

US3905907A Solutions for chemical dissolution treatment of metal materials 失效
标题翻译：金属材料化学溶解处理方案
公开(公告)号：US3905907A
公开(公告)日：1975-09-16
申请号：US42582773
申请日：1973-12-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIGA SHOJI
IPC分类号： C01B15/037 , C23F1/16 , C23F1/30 , C23F1/44 , C23F3/00 , C23G1/02 , C23F3/02 , C23F3/04
CPC分类号： C23F1/16 , C23G1/02
摘要： The present invention relates to solutions used for chemical dissolution treatment such as, pickling, etching, chemical polishing, etc., of metallic materials. In such a treatment, however, where hydrogen peroxide is used as an oxidizing agent, a considerable excess of the agent is required due to low efficiency. On the other hand, when chloride ions are contained in the solution, the dissolution rate of metallic materials is remarkably decreased. The present invention has overcome the above difficulties by using a solution for chemical dissolution treatment of metallic materials containing hydrogen peroxide, an acid and at least one of an alcohol polyoxyethylene ether, an alkylsulfonic acid, an alkyl hydrogen phosphate, an alkyl hydrogen phosphite, an alkyl hydrogen sulfate and their salts.
摘要翻译：本发明涉及用于化学溶解处理的溶液，例如金属材料的酸洗，蚀刻，化学抛光等。然而，在这种处理中，当使用过氧化氢作为氧化剂时，由于效率低，需要相当多的试剂。另一方面，当溶液中含有氯离子时，金属材料的溶解速度显着降低。本发明通过使用含有过氧化氢，酸和醇聚氧乙烯醚，烷基磺酸，烷基磷酸氢盐，烷基亚磷酸氢盐，烷基硫酸氢盐等的金属材料的化学溶解处理的解决方案克服了上述困难。烷基硫酸氢盐及其盐。

8. 发明授权

US3735195A Spark-discharge apparatus for electrohydraulic crushing 失效
标题翻译：用于电液破碎的火花放电装置（SPARK-DISCHARGE APPARATUS FOR ELECTROHRULUL CRUSHING）
公开(公告)号：US3735195A
公开(公告)日：1973-05-22
申请号：US3735195D
申请日：1970-12-04
申请人： JENKINS E , WARD G
发明人： JENKINS E , WARD G
IPC分类号： B02C19/18 , C23F3/04 , C23G1/20 , H05B37/02
CPC分类号： B02C19/18 , B02C2019/183 , C23F3/04 , C23G1/20
摘要： In existing apparatus of the above kind, a capacitor is discharged through the liquid-immersed gap via a self-triggered or externally triggered switch device. In the present invention an initially uncharged capacitor is connected directly across the gap without any intervening switch device. This first capacitor is pulse-charged to the breakdown voltage of the gap via a stepup pulse transformer by discharging a second capacitor via a triggered switch device through the primary winding thereof. The two capacitors are approximately matched in value, as reflected by the transformer ratio, so that substantially all the energy stored in the second capacitor is transferred to the first capacitor at peak voltage thereon. A principal advantage is that the triggered switch device, eg a thyratron, does not require either to withstand the high gap voltage or to carry the high gap current.
摘要翻译：在上述现有装置中，电容器经由自触发或外部触发的开关装置通过液浸间隙放电。在本发明中，初始不带电电容器直接连接在间隙上，而没有任何中间开关装置。该第一电容器经由升压脉冲变压器被脉冲充电到间隙的击穿电压，通过触发开关器件通过其初级绕组放电第二电容器。这两个电容器的值近似匹配，如变压器比所反映的那样，使得存储在第二电容器中的所有能量基本上全部以峰值电压被转移到第一电容器。主要的优点是触发的开关装置，例如闸流管，不需要承受高间隙电压或承载高间隙电流。

9. 发明授权

US3480491A Vapor polishing technique 失效
标题翻译：蒸气抛光技术
公开(公告)号：US3480491A
公开(公告)日：1969-11-25
申请号：US3480491D
申请日：1965-11-17
申请人： IBM
发明人： REISMAN ARNOLD , LEONHARDT HORST R
IPC分类号： C23F3/04 , H01L21/306 , H01L7/00
CPC分类号： H01L21/02046 , C23F3/04 , H01L21/30621 , Y10S148/051 , Y10S148/054 , Y10S148/115 , Y10S438/909 , Y10S438/971

10. 发明授权

US3420712A Method for treating elongated metal workpieces with a succession of treating liquids 失效
标题翻译：用于处理液体的后续处理金属工件的方法
公开(公告)号：US3420712A
公开(公告)日：1969-01-07
申请号：US3420712D
申请日：1964-07-10
申请人： PARSONS CORP
发明人： PARSONS JOHN T
IPC分类号： C23F1/08 , C23G3/04 , C23F3/04
CPC分类号： C23F1/08 , C23G3/04

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