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    • 10. 发明授权
    • System for providing a removable high density electrical interconnect
for flexible circuits
    • 用于为柔性电路提供可移除的高密度电互连的系统
    • US6164979A
    • 2000-12-26
    • US267429
    • 1999-03-12
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • Joseph G. GilletteScott G. PotterRobert J. Mulligan
    • H01R12/79H01R12/82H05K1/11H05K1/14H05K3/36H01R12/00H05K1/00
    • H01R12/79H01R12/82H05K1/118H05K1/141H05K3/363H05K3/365H05K2201/049H05K2201/10734
    • A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads. The flexible circuit is removably connected to the low insertion force connector by insertion through the z-axis (149) of the substrate.
    • 通过结合可移除地连接到低插入力球形阵列连接器(100)的柔性电路(140)来实现高密度电互连。 柔性电路具有多个导电流道(142),并且每个流道具有终端(144)。 终端以柔性电路的端部排列成阵列。 低插入力连接器由在一侧具有与阵列对应的衬垫(122)的图案的衬底(120)组成。 衬底的另一侧具有通过导电通孔与衬垫电连接的对应阵列(124)。 对准特征(470)将柔性电路上的阵列对准衬底上的焊盘图案。 柔性电路和衬底之间的接触由压缩装置(150)保持,压缩装置(150)提供足够的压缩力(310)以建立阵列和焊盘之间的电连接。 柔性电路通过插入穿过衬底的z轴(149)而可移除地连接到低插入力连接器。