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    • 7. 发明申请
    • VIBRATION DIAPHRAGM IN MEMS MICROPHONE AND MEMS MICROPHONE
    • US20190230439A1
    • 2019-07-25
    • US16329193
    • 2017-03-03
    • Goertek Inc.
    • Junkai ZhanMengjin Cai
    • H04R7/00
    • The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body (1) and at least one pressure relief device (2) defined by gaps (a) in the vibration diaphragm body (1), wherein the gaps (a) comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device (2) comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body (1) and of a constraint shape. When subjected to a relatively high sound pressure caused by, for example, mechanical shock, blowing or falling, the at least two valve clacks symmetrical in structure can warp upwards or downwards by taking respective neck portions as pivots. Therefore, an effective pressure relief path is formed, and the aim of pressure relief is achieved.