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    • 9. 发明申请
    • RADIATOR WITH ADAPTED FINS
    • WO2022129035A1
    • 2022-06-23
    • PCT/EP2021/085670
    • 2021-12-14
    • ASETEK DANMARK A/S
    • ANDERSEN, Martin RønnovSAKSAGER, Anders Hjørringgaard
    • F28D1/02F28F1/20F28D1/053F28D21/00F28F1/12H05K7/20
    • There is a need for better cooling solutions for the ever-increasing thermal density of computing systems. This is solved by providing a radiator (100) for a liquid cooling system for cooling a computing unit, the radiator comprising: - a first manifold (101) and a second manifold (102) having among them two liquid openings (103, 104) for connecting the radiator in a liquid loop, - channels (110) extending between the first manifold (101) and the second manifold (102) and providing parallel liquid paths between the manifolds (101, 102), - fin layers (130) sandwiched between sets of neighbouring channels (110) and extending between the first manifold (101) and the second manifold (102), - fastening means (120) for attaching a fan (10) to the radiator (100) in a predetermined position, determining a ring-shaped high-pressure zone (142) corresponding to an outer area of a fan radius (122) of an attached fan, where - at least one fin layer has a low-density section placed away from the high-pressure zone, and a high-density section being located in the high-pressure zone and having a higher fin density than the low-density section, - the density of the group of fin layers thereby varies both along the channels but also transverse of each channel, resulting in two-dimensional density variations across the radiator surface, sections of fins to be positioned in front of the ring-shaped high-pressure zone has a higher density than the section of fins away from the ring-shaped high-pressure zone.