1. A micro-fluid ejection head structure comprising: a substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, and a second array of fluid ejection actuators for ejecting a second fluid therefrom; a thick film layer having a thickness attached adjacent the substrate, the thick film layer having fluid flow channels formed therein for all of the first array of fluid ejection actuators and not for any of the second array of fluid ejection actuators; and a nozzle plate attached to the thick film layer opposite the substrate, the nozzle plate having fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators.

2. The micro-fluid ejection head structure of claim l _? further comprising a third array of fluid ejection actuators disposed in a third location on the substrate, wherein the nozzle plate has fluid flow channels formed therein for the third array of fluid ejection actuators.

3. The micro-fluid ejection head structure of claim 2, further comprising a fourth array of fluid ejection actuators disposed in a fourth location on the substrate, wherein the nozzle plate has fluid flow channels formed therein for the fourth array of fluid ejection actuators.

4. A micro-fluid ejection head structure comprising: a semiconductor substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, the first array of fluid ejection actuators being disposed in a first location on the substrate, and at least a second array of fluid ejection actuators for ejecting a second fluid therefrom, the second array of fluid ejection actuators being disposed in a second location on the substrate;

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AMENDED S! ¹EET (ARTICLE 19) a thick film layer having a thickness attached adjacent the semiconductor substrate, the thick film layer having fluid flow channels formed therein solely for the first array of fluid ejection actuators; and a nozzle plate attached to the thick film layer opposite the semiconductor substrate, the nozzle plate having fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators, wherein the fluid flow channels include a fluid throat, wherein the fluid throat has a width in the thick film layer that is at least as wide as a fluid throat width in the nozzle plate.

5. The micro-fluid ejection head structure of claim 4, further comprising a width of thick film layer between adjacent fluid throats that is equal to or greater than the thickness of the thick film layer.

6. The micro-fluid ejection head structure of claim 5, wherein the width of thick film layer between adjacent fluid throats is at least about 6 microns wide.

7. The micro-fluid ejection head structure of claim 5, wherein the thickness of the thick film layer ranges from about 5 microns to about 15 microns.

8. The micro-fluid ejection head structure of claim 1, wherein the fluid ejection actuators comprise thermal fluid ejection actuators.

9. A multi-color printhead comprising the micro-fluid ejection head structure of claim 1.

10. An ink jet printer comprising the multi-color printhead of claim 9.

11. A method of making a micro-fluid ejection head structure, comprising: forming a first array of fluid ejection actuators for ejecting a first fluid therefrom, the first array of fluid ejection actuators being formed in a first location on a substrate; forming at least a second array of fluid ejection actuators for ejecting a second

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AMENDEO St ¹EET(ARTICLE 19) fluid therefrom, the second array of fluid ejection actuators being formed in a second location on the substrate; depositing a thick film layer having a thickness adjacent the first and second arrays of fluid ejection actuators on the substrate; forming fluid flow channels in the thick film layer solely for the first array of fluid ejection actuators; providing a nozzle plate material for attachment to the thick film layer; forming fluid flow channels in the nozzle plate material for both the first and second anrays of fluid ejection actuators; and attaching the nozzle plate to the thick film layer opposite the substrate to provide the micro-fluid ejection head structure.

12. The method of claim 11 , further comprising fonning a third array of fluid ejection actuators in a third location on the substrate, and forming fluid flow channels in the nozzle plate material for the third array of fluid ejection actuators.

J 3. The method of claim 1 1, further comprising forming a fourth array of fluid ejection actuators in a fourth location on the substrate, and forming fluid flow channels in the nozzle plate material for the fourth array of fluid ejection actuators.

14. The method of claim 11, wherein the nozzle plate material comprises a polyimide material, and wherein the step of forming fluid flow channels in the nozzle plate material comprises laser ablating the nozzle plate material.

15. The method of claim 11, wherein the thick film layer comprises a photoresist layer, and wherein the step of forming fluid flow channels in the thick film layer comprises exposing the photoresist layer to a radiation source through a mask and developing the radiation exposed photoresist layer to provide the fluid flow channels.

16. The method of claim 11 , wherein the thick film layer is deposited with a thickness ranging from about 5 to about 15 microns.

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AMENDED S! ¹EET (ARTICLE 19)

17. A method for improving fluid flow characteristics in a multi-fluid ejection head for a micro-fluid ejection device, comprising: forming fluid flow channels in a thick film layer and in a nozzle plate material for a first array fluid ejection actuators for the ejection head wherein the fluid flow channels for the first array of fluid ejection actuators in the thick film layer comprise at least 12 percent of a total fluid flow channel cross- sectional area for the first array of fluid ejection actuators; and forming fluid flow channels in the nozzle plate material for at least a second array of fluid ejection actuators remote from the first array of fluid ejection actuators for the multi-fluid ejection head, wherein at least 90 percent of a total cross-sectional area of the fluid flow channels for the second array of fluid ejection actuators is formed in the nozzle plate material.

18. The method of claim 17, further comprising forming fluid flow channels in the nozzle plate material for a third array of fluid ejection actuators for the multi-fluid ejection head, wherein at least 90 percent of a total cross-sectional area of the fluid flow channels for the third array of fluid ejection actuators is formed in the nozzle plate material.

19. The method of claim 17, further comprising forming fluid flow channels in. the nozzle plate material for a fourth array of fluid ejection actuators for the multi- fluid ejection head, wherein at least 90 percent of a total cross-sectional area of the fluid flow channels for the fourth array of fluid ejection actuators is formed in the nozzle plate material.

20. A micro-fluid ejection head structure comprising: a substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, and a second array of fluid ejection actuators for ejecting a second fluid therefrom; a thick film layer having a thickness attached adjacent the substrate, the thick film layer having fluid flow channels of a first height formed therein for the first array of fluid ejection actuators and having fluid flow channels of a

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AMENDEO St ¹EET(ARTICLE 19) second height formed therein for the second array of fluid ejection actuators, wherein the second height is different from the first height; and a nozzle plate attached to the thick film layer opposite the substrate, the nozzle plate having fluid flow channels formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators.

21. The micro-fluid ejection head structure of claim 20, further comprising a third array of fluid ejection actuators disposed in a third location on the substrate, wherein the nozzle plate has fluid flow channels formed therein for the third array of fluid ejection actuators.

22. The micro-fluid ejection head structure of claim 2I ₃ further comprising a fourth array of fluid ejection actuators disposed in a fourth location on the substrate, wherein the nozzle plate has fluid flow channels formed therein for the fourth array of fluid ejection actuators.

23. A micro-fluid ejection head structure comprising: a semiconductor substrate having a first array of fluid ejection actuators for ejecting a first fluid therefrom, the first array of fluid ejection actuators being disposed in a first location on the substrate, and at least a second array of fluid ejection actuators for ejecting a second fluid therefrom, the second array of fluid ejection actuators being disposed in a second location on the substrate; a thick film layer having a thickness attached adjacent the semiconductor substrate and first array of fluid ejection actuators, the thick film layer having fluid flow channels of a first height formed therein for the first array of fluid ejection actuators and having fluid flow channels of a second height formed therein for the second array of fluid ejection actuators, wherein the second height ranges from about 0 to about the thickness of the thick film layer; and a nozzle plate attached to the first and second thick film layers opposite the semiconductor substrate, the nozzle plate having fluid flow channels

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AMENDED S! ¹EET (ARTICLE 19) formed therein for both the first array of fluid ejection actuators and the second array of fluid ejection actuators, wherein the fluid flow channels include a fluid throat, wherein the fluid throat has a width in the thick film layer that is at least as wide as a fluid throat width in the nozzle plate.

24. The micro-fluid ejection head structure of claim 23, further comprising a width of thick film layer between adjacent fluid throats that is equal to or greater than ^;the thickness of the thick film layer.

25. The micro-fluid ejection head structure of claim 24, wherein the width of thick film layer between adjacent fluid throats is at least about 6 microns wide.

26. The micro-fluid ejection head structure of claim 24, wherein the thickness of the thick film layer ranges from about 5 microns to about 15 microns.

27. The micro-fluid ejection head structure of 20, wherein the second array of fluid ejection actuators comprises ink chambers recessed in the thick film layer.

28. A multi-color printhead comprising the micro-fluid ejection head structure of claim 20.

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AMENDEO St ¹EET(ARTICLE 19)