基本信息:
- 专利标题： 基于托盘排列的热敏电阻芯片的包装方法
- 专利标题（英）：Packing method of thermistors chips based on tray arrangement
- 申请号：CN201310351804.1 申请日：2013-08-13
- 公开(公告)号：CN103395571A 公开(公告)日：2013-11-20
- 发明人： 汪鵾 , 段兆祥 , 杨俊 , 柏琪星 , 唐黎民
- 申请人： 肇庆爱晟电子科技有限公司
- 申请人地址： 广东省肇庆市端州区睦岗镇堂下工业区
- 专利权人： 肇庆爱晟电子科技有限公司
- 当前专利权人： 肇庆爱晟电子科技有限公司
- 当前专利权人地址： 广东省肇庆市端州区睦岗镇堂下工业区
- 代理机构： 广州新诺专利商标事务所有限公司
- 代理人： 华辉; 曹爱红
- 主分类号： B65D85/86
- IPC分类号： B65D85/86
The invention relates to a packing method of thermistors chips based on tray arrangement. The first packing method comprises the following steps: placing the thermistors chips in a tray to be arranged, and performing overall packing and transporting on the tray so as to enable customers to mechanically bind the thermistors chips through simple oriented transfer after receiving the thermistors chips. The second packing method comprises the following steps: placing the thermistors chips in a tray to be arranged, performing oriented transfer on a blue film, and finally conducting overall packing and transporting. The method has the advantages that the customer can pack the thermistors chips mechanically after receiving the thermistors chips, the time for terminal customers to re-arrange and re-align the thermistors chips is shortened, and the working efficiency is improved.
公开/授权文献:
- CN103395571B 基于托盘排列的热敏电阻芯片的包装方法 公开/授权日：2016-05-11