The invention relates to the field of printed circuit boards, in particular to a Z-direction interconnected printed circuit board and a manufacturing method thereof in order to resolve a problem of difficulty in manufacturing a multilayer printed circuit board with high thickness-to-aperture-diameter ratio. The method of an embodiment of the invention comprises: making at least one via hole on the multilayer printed circuit board and a combined connection board provided with at least one combined connection hole corresponding to the via hole; placing the combined connection board and the multilayer printed circuit board alternately and executing prebonding processing, wherein the combined connection hole processed by prebonding is overlapped with a corresponding via hole. By using the method for making the via hole on the multilayer printed circuit board and connecting the multilayer printed circuit board with the combined connection hole, difficulty in drilling holes and electroplating a multilayer board is prevented such that the processability of the multilayer board is enhanced.