The invention provides a manufacturing process of a substrate of a chip on board. The manufacturing process comprises the following steps: arranging an insulating layer on the substrate; etching the insulating layer to form a circuit; arranging an electroplated lead with a connection part and an extension part; electroplating the substrate; removing the extension part by using the etching process. According to the manufacturing process of the substrate of the chip on board provided by the invention, since the extension part of the electroplated lead close to the bottom edge of the substrate is etched to be removed, the phenomenon of discharge between the electroplated lead and a copper seat is avoided, the limitation to the highest power-on voltage of the chip on board is eliminated, the high voltage resistance characteristic is improved, and the lighting effect of an LED (Light Emitting Diode) lamp is further improved. The invention also provides the substrate of the chip on board manufactured by using the manufacturing process.