The invention provides a chip bonding device and a chip bonding method. The chip bonding device comprises a measurement system, and is characterized in that the measurement system comprises a first measurement branch and a second measurement branch, the first measurement branch comprises a first lighting unit and a first detecting unit, the second measurement branch comprises a second lighting unit and a second detecting unit, the first lighting unit and the first detecting unit detect the positions of X-direction marks on a chip and a substrate in a matched manner, and the second lighting unit and the second detecting unit detect the positions of Y-direction marks on the chip and the substrate in a matched manner, so that the positions of the chip marks and the substrate marks are synchronously measured, and the measurement time is saved. The chip bonding device provided by the invention can directly absorb a chip from a first moving platform and realize overturn of the chip through setting an overturn device; and meanwhile, the chip bonding device measure the positions of the chip marks and the substrate marks synchronously through setting the measurement system, so that the bonding yield is improved from the two aspects. In addition, the chip bonding device realizes high-precision bonding through adjusting the attitude of a second moving platform.